Defect detection using multiple sensors and parallel processing
First Claim
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1. A computer-implemented method of detecting features on a semiconductor wafer comprising:
- collecting data with a plurality of detectors that are positioned about the semiconductor wafer, wherein at least one of the detectors is configured to obtain data in a different manner from other detectors of the plurality of detectors, and wherein each detector collects one data frame for each of a plurality of device areas;
transmitting the data frames from each detector to a data distribution node, which is part of a set of data distribution nodes and wherein each data distribution node comprises a plurality of image buffers configured to hold the data frames and wherein the image buffers are logically separated from each other;
transferring a first data frame along a first data transfer path that connects a first and a second data distribution node;
transferring a second data frame along a second data transfer path that connects the first and second data distribution nodes;
routing the data frames from the data distribution nodes to processing nodes, wherein the data frames in the data distribution nodes are accessible by the processing nodes as read only data and wherein the transferring of data frames between data distribution nodes allows data from any one of the detectors to be routed to any one of the processing nodes;
processing the data frames within each of the processing nodes by analyzing the data frames in order to obtain defect information.
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Abstract
Techniques for detecting defects on semiconductor wafers are described. The techniques involve a parallel processing system wherein a data distribution system contains data distribution nodes that are interconnected by multiple data transfer paths. This configuration allows data collected by any of the detectors to be routed to any one of a plurality of processing nodes. This in turn allows a variety of defect analysis algorithms to be implemented.
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Citations
21 Claims
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1. A computer-implemented method of detecting features on a semiconductor wafer comprising:
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collecting data with a plurality of detectors that are positioned about the semiconductor wafer, wherein at least one of the detectors is configured to obtain data in a different manner from other detectors of the plurality of detectors, and wherein each detector collects one data frame for each of a plurality of device areas; transmitting the data frames from each detector to a data distribution node, which is part of a set of data distribution nodes and wherein each data distribution node comprises a plurality of image buffers configured to hold the data frames and wherein the image buffers are logically separated from each other; transferring a first data frame along a first data transfer path that connects a first and a second data distribution node; transferring a second data frame along a second data transfer path that connects the first and second data distribution nodes; routing the data frames from the data distribution nodes to processing nodes, wherein the data frames in the data distribution nodes are accessible by the processing nodes as read only data and wherein the transferring of data frames between data distribution nodes allows data from any one of the detectors to be routed to any one of the processing nodes; processing the data frames within each of the processing nodes by analyzing the data frames in order to obtain defect information. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A semiconductor wafer inspection system comprising:
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a semiconductor wafer having a plurality of device areas; a plurality of detectors positioned about a semiconductor wafer wherein each detector is configured to collect a data frame for each of the plurality of device areas, wherein at least one of the detectors is configured to obtain data a different manner from other detectors of the plurality of detectors wherein each data frame is configured to overlap adjacent data frames; a data distribution system that includes, a) a plurality of data distribution nodes each having, a plurality of memory devices that are logically separated from each other and configured such that each memory device is configured to receive data frames from a specific detector of the plurality of detectors, and processing node interfaces configured to facilitate transfer of data frames from memory devices to an associated processing node wherein the data frames are accessible to the associated processing node as read only information thereby ensuring memory coherency, b) a plurality of data transfer paths connecting each of the data distribution nodes wherein each data transfer path transfers data frames collected by a respective detector; a plurality of processing nodes configured to receive data frames from the processing node interfaces of the data distribution system, the processing nodes configured to analyze the data frames, wherein the data transfer paths allow data frames collected by any one of the detectors to be routed to any one of the processing nodes; and wherein each of the processing nodes are configured to perform data frame analysis in order to obtain defect information. - View Dependent Claims (12, 13, 14, 15, 16, 17, 18, 19, 20)
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21. A semiconductor wafer inspection system comprising:
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a semiconductor wafer having a plurality of device areas; a plurality of detectors positioned about a semiconductor wafer wherein each detector is configured to collect a data frame for each of the plurality of device areas, wherein each data frame is configured to overlap adjacent data frames; a data distribution system that includes, a) a plurality of data distribution nodes each having, a plurality of memory devices that are logically separated from each other and configured such that each memory device is configured to receive data frames from a specific detector of the plurality of detectors, and processing node interfaces configured to facilitate transfer of data frames from memory devices to an associated processing node wherein the data frames are accessible to the associated processing node as read only information thereby ensuring memory coherency, b) a plurality of data transfer paths connecting each of the data distribution nodes wherein each data transfer path transfers data frames collected by a respective detector; a plurality of processing nodes configured to receive data frames from the processing node interfaces of the data distribution system, the processing nodes configured to analyze the data frames, wherein the data transfer paths allow data frames collected by any one of the detectors to be routed to any one of the processing nodes; and wherein each of the processing nodes are configured to perform data frame analysis that includes processing the data frames using different data processing methodologies and then comparing data frames in order to obtain defect information.
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Specification