Method and apparatus for expanding a semiconductor wafer
First Claim
Patent Images
1. A method for enhancing die transfer capability, compnsing:
- (A) receiving a plurality of dies of a separated wafer on a support structure;
(B) increasing an area of the support structure to increase a space between adjacent dies of the plurality of dies;
(C) inserting a solidifiable material into the increased space between adjacent dies;
(D) causing the solidifiable material to harden into a solid grid that removably holds the plurality of dies;
(E) removing the support structure from the solid grid that removably holds the plurality of dies; and
(F) transferring at least one die of the plurality of dies from the solid grid while the solid grid remains substantially intact.
2 Assignments
0 Petitions
Accused Products
Abstract
Methods, systems, and apparatuses are described for expanding an area of a semiconductor wafer, an enhancing die transfer capability. A wafer is attached to a support structure. The wafer is separated on the support structure into a plurality of dies. An area of the support structure is increased to increase a space between adjacent dies of the plurality of dies. Dies may be transferred from the expanded support structure.
66 Citations
14 Claims
-
1. A method for enhancing die transfer capability, compnsing:
-
(A) receiving a plurality of dies of a separated wafer on a support structure; (B) increasing an area of the support structure to increase a space between adjacent dies of the plurality of dies; (C) inserting a solidifiable material into the increased space between adjacent dies; (D) causing the solidifiable material to harden into a solid grid that removably holds the plurality of dies; (E) removing the support structure from the solid grid that removably holds the plurality of dies; and (F) transferring at least one die of the plurality of dies from the solid grid while the solid grid remains substantially intact. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
-
Specification