High temperature attachment of organic molecules to substrates
First Claim
1. A method of coupling a redox-active molecule to a surface, said method comprising:
- heating a heat-resistant redox-active organic molecule bearing an attachment group and/or said surface to a temperature of at least about 200°
C.; and
contacting said molecule to said surface whereby said molecule couples to said surface.
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Abstract
This invention provides a new procedure for attaching molecules to semiconductor surfaces, in particular silicon. The molecules, which include, but are not limited to porphyrins and ferrocenes, have been previously shown to be attractive candidates for molecular-based information storage. The new attachment procedure is simple, can be completed in short times, requires minimal amounts of material, is compatible with diverse molecular functional groups, and in some instances affords unprecedented attachment motifs. These features greatly enhance the integration of the molecular materials into the processing steps that are needed to create hybrid molecular/semiconductor information storage devices.
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Citations
39 Claims
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1. A method of coupling a redox-active molecule to a surface, said method comprising:
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heating a heat-resistant redox-active organic molecule bearing an attachment group and/or said surface to a temperature of at least about 200°
C.; andcontacting said molecule to said surface whereby said molecule couples to said surface. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39)
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Specification