Method and apparatus for manufacturing a transistor-outline (TO) can having a ceramic header

• US 7,223,629 B2
• Filed: 12/11/2003
• Issued: 05/29/2007
• Est. Priority Date: 12/11/2003
• Status: Expired due to Fees

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Zheng, Tieyu, Narayan, Raghuram
• Primary Examiner(s): Dang, Phuc T.
• Application Number:
  US10/732,949
• Publication Number:
  US 20050130342A1
• Time in Patent Office: 1,265 Days
• Field of Search: 438/106, 438/112, 438/118, 438/122, 438/125, 438/126
• US Class Current: 438/106
• CPC Class Codes: H01L 21/50 Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/02325 the optical elements not being integrated nor being directly associated with the device
• CPC Class Codes: H01L 33/483 Containers
• CPC Class Codes: H01S 5/0071 for beam steering, e.g. using a mirror outside the cavity to change the beam direction
• CPC Class Codes: H01S 5/02212 Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis
• CPC Class Codes: H01S 5/02253 using lenses
• CPC Class Codes: H01S 5/02325 Mechanically integrated components on mount members or optical micro-benches

Abstract

A method of manufacturing an optoelectronic packaging comprises placing a solder preform between a metal cover and an insulating base, applying pressure to the metal cover and the insulating base, and applying a current through multiple conductive vias to heat the solder preform to melt.

Claims

1. A method of manufacturing an optoelectronic package having an insulating base with multiple conductive vias running through the insulating base, and having a metal cover that at least partially encloses an optoelectronic device mounted on the insulating base, the method comprising:

placing a solder preform between the metal cover and the insulating base;

applying pressure between the metal cover and the insulating base; and

applying a current through the multiple conductive vias to heat the solder preform to melt.

2. The method of claim 1 further comprising:

metalizing a top surface of the insulating base prior to the placing of the solder preform.

3. The method of claim 2, further comprising:

allowing the solder preform to cool; and

removing the pressure between the metal cover and the insulating base.

4. The method of claim 1, further comprising:

allowing the solder preform to cool; and

removing the pressure between the metal cover and the insulating base.

5. A method of manufacturing a TO can comprising:

placing a solder preform between a metal cover and an insulating base; and

applying a current to the solder preform until the solder preform melts to seal metal cover to the insulating base.

7. The method of claim 5, further comprising:

creating a metallized surface on the insulating base, wherein placing the solder preform between the metal cover and the insulating base further comprises placing the solder preform in contact with the metallized surface.

6. A method of manufacturing a TO can comprising:

placing a solder preform between a metal cover and an insulating base; and

applying a current to the solder preform until the solder preform melts to seal metal cover to the insulating base, wherein the current is applied through conductive vias running through the insulating base.

8. A method of manufacturing an optoelectronic package having an insulating base with multiple conductive vias running through the insulating base, and having a metal cover with a transparent portion that at least partially encloses an optoelectronic device mounted on the insulating base, the method comprising:

aligning the transparent portion with a beam emergence side of an optoelectronic device;

placing a solder preform between the metal cover and the insulating base;

applying pressure between the metal cover and the insulating base; and

applying a current through the multiple conductive vias to heat the solder preform to melt.

9. The method of claim 8 further comprising:

metalizing a top surface of the insulating base prior to the placing of the solder preform.

10. The method of claim 8, further comprising:

allowing the solder preform to cool; and

removing the pressure between the metal cover and the insulating base.

11. The method of claim 8, further comprising:

allowing the solder preform to cool; and

removing the pressure between the metal cover and the insulating base.