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Semiconductor device, method for manufacturing the same, circuit board, and electronic apparatus

  • US 7,223,634 B2
  • Filed: 07/26/2004
  • Issued: 05/29/2007
  • Est. Priority Date: 07/31/2003
  • Status: Active Grant
First Claim
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1. A method for manufacturing a semiconductor device, comprising:

  • (a) forming a conductive part in a concave part on a first surface of a substrate, the first surface having a plurality of chip mounting areas;

    (b) stacking a semiconductor chip in the chip mounting areas;

    (c) providing a sealing member above the first surface of the substrate, wherein the sealing members reinforces the substrate and seals at least one semiconductor chip, and forming a mask having an opening on the first surface of the substrate and filling the opening with a material of the sealing member, and(d) making part of a second surface of the substrate thin so as to make the conductive part penetrate from the first surface to the second surface.

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