Semiconductor device, method for manufacturing the same, circuit board, and electronic apparatus
First Claim
1. A method for manufacturing a semiconductor device, comprising:
- (a) forming a conductive part in a concave part on a first surface of a substrate, the first surface having a plurality of chip mounting areas;
(b) stacking a semiconductor chip in the chip mounting areas;
(c) providing a sealing member above the first surface of the substrate, wherein the sealing members reinforces the substrate and seals at least one semiconductor chip, and forming a mask having an opening on the first surface of the substrate and filling the opening with a material of the sealing member, and(d) making part of a second surface of the substrate thin so as to make the conductive part penetrate from the first surface to the second surface.
2 Assignments
0 Petitions
Accused Products
Abstract
Exemplary embodiments of the present invention include a semiconductor device, a method for manufacturing the same, a circuit board and an electronic apparatus with increased productivity and reliability. An exemplary method for manufacturing a semiconductor device of the present invention includes forming a conductive part in a concave part on a first surface of a semiconductor substrate, the first surface having a plurality of chip mounting areas. Stacking at least one semiconductor chip in each of the chip mounting areas, providing a sealing member on the first surface of the semiconductor substrate and making part of a second surface of the semiconductor substrate thin so as to make the conductive part penetrate from the first surface to the second surface.
84 Citations
16 Claims
-
1. A method for manufacturing a semiconductor device, comprising:
-
(a) forming a conductive part in a concave part on a first surface of a substrate, the first surface having a plurality of chip mounting areas; (b) stacking a semiconductor chip in the chip mounting areas; (c) providing a sealing member above the first surface of the substrate, wherein the sealing members reinforces the substrate and seals at least one semiconductor chip, and forming a mask having an opening on the first surface of the substrate and filling the opening with a material of the sealing member, and (d) making part of a second surface of the substrate thin so as to make the conductive part penetrate from the first surface to the second surface. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
-
Specification