Semiconductor light source
First Claim
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1. A semiconductor light source for emitting light to illuminate a space used by humans, the semiconductor light source comprising:
- an enclosure, said enclosure being fabricated from a material substantially transparent to white light,an interior volume within said enclosure,a heat sink located in said interior volume,said heat sink being capable of drawing heat from one or more semiconductors devices,said heat sink having a plurality of panels on it suitable for mounting semiconductor devices thereon,said panels on said heat sink being oriented to facilitate emission of light from the semiconductor light source in desired directions around the semiconductor light source,at least one semiconductor chip capable of emitting light mounted on one of said panels,said semiconductor chip being capable of emitting monochromatic light,said semiconductor chip being selected from the group consisting of light emitting diodes, light emitting diode arrays, laser chips, LED modules, laser modules, and VOSEL chips,said chip including a substrate on which epitaxial layers are grown,a buffer layer located on said substrate, said buffer layer serving to mitigate differences in material properties between said substrate and other epitaxial layers,a first cladding layer serving to confine electron movement within the chip, said first cladding layer being adjacent said buffer layer,an active layer, said active layer emitting light when electrons jump to a valance state,a second cladding layer, said second cladding layer positioned so that said active layer lies between cladding layers,a first and a second reflective layer, each of said first and second reflective layers being located on opposite sides of said active layer, said reflective layers serving to reflect light emitted by said active layer,said reflective layers including multiple quantum wells,a contact layer on which an electron may be mounted for powering said chip,a coating for converting monochromatic light emitted by said chip to white light,an air entrance, an air exit, and an interior airflow path through said heat sink,said air entrance and air exit being proximate a fitting for electrical connection to a light bulb socket,said airflow path proceeding from said air entrance toward the top of the bulb, turning 90 degrees to move laterally a predetermined distance, then turning to move down toward the bottom of the bulb, and out said air exit,said airflow path permitting air to enter said heat sink through said air entrance, absorb heat from said heat sink, and exit said heat sink through said air exit, andair located within said enclosure.
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Abstract
A semiconductor light source for illuminating a physical space has been invented. In various embodiments of the invention, a semiconductor such as and LED chip, laser chip, LED chip array, laser array, an array of chips, or a VCSEL chip is mounted on a heat sink. The heat sink may have multiple panels for mounting chips in various orientations. The chips may be mounted directly to a primary heat sink which is in turn mounted to a multi-panel secondary heat sink. A TE cooler and air circulation may be provided to enhance heat dissipation. An AC/DC converter may be included in the light source fitting.
64 Citations
5 Claims
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1. A semiconductor light source for emitting light to illuminate a space used by humans, the semiconductor light source comprising:
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an enclosure, said enclosure being fabricated from a material substantially transparent to white light, an interior volume within said enclosure, a heat sink located in said interior volume, said heat sink being capable of drawing heat from one or more semiconductors devices, said heat sink having a plurality of panels on it suitable for mounting semiconductor devices thereon, said panels on said heat sink being oriented to facilitate emission of light from the semiconductor light source in desired directions around the semiconductor light source, at least one semiconductor chip capable of emitting light mounted on one of said panels, said semiconductor chip being capable of emitting monochromatic light, said semiconductor chip being selected from the group consisting of light emitting diodes, light emitting diode arrays, laser chips, LED modules, laser modules, and VOSEL chips, said chip including a substrate on which epitaxial layers are grown, a buffer layer located on said substrate, said buffer layer serving to mitigate differences in material properties between said substrate and other epitaxial layers, a first cladding layer serving to confine electron movement within the chip, said first cladding layer being adjacent said buffer layer, an active layer, said active layer emitting light when electrons jump to a valance state, a second cladding layer, said second cladding layer positioned so that said active layer lies between cladding layers, a first and a second reflective layer, each of said first and second reflective layers being located on opposite sides of said active layer, said reflective layers serving to reflect light emitted by said active layer, said reflective layers including multiple quantum wells, a contact layer on which an electron may be mounted for powering said chip, a coating for converting monochromatic light emitted by said chip to white light, an air entrance, an air exit, and an interior airflow path through said heat sink, said air entrance and air exit being proximate a fitting for electrical connection to a light bulb socket, said airflow path proceeding from said air entrance toward the top of the bulb, turning 90 degrees to move laterally a predetermined distance, then turning to move down toward the bottom of the bulb, and out said air exit, said airflow path permitting air to enter said heat sink through said air entrance, absorb heat from said heat sink, and exit said heat sink through said air exit, and air located within said enclosure. - View Dependent Claims (2, 3)
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4. A semiconductor light source for emitting light to illuminate a space used by humans, the semiconductor light source comprising:
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an enclosure, said enclosure being fabricated from a material substantially transparent to white light, a base to which said enclosure is mounted, an interior volume within said enclosure, a secondary heat sink located in said interior volume, said secondary heat sink being capable of drawing heat from one or more semiconductors devices, said secondary heat sink having a plurality of panels on it suitable for mounting primary heat sinks thereon, said panels on said secondary heat sink being oriented to facilitate emission of light from the semiconductor light source in desired directions around the semiconductor light source, a plurality of primary heat sinks mounted on said secondary heat sink, each of said primary heat sinks being smaller than said secondary heat sink, a semiconductor chip capable of emitting light mounted on one of said primary heat sinks, said semiconductor chip being capable of emitting monochromatic light, said semiconductor chip being selected from the group consisting of light emitting diodes, light emitting diode arrays, laser chips, and VCSEL chips, a coating for converting monochromatic light emitted by said chip to white light, an air entrance, an air exit, and an interior airflow path through said heat sink, said air entrance and air exit being proximate a fitting for electrical connection to a light bulb socket, said airflow path proceeding from said air entrance toward the top of the bulb, turning 90 degrees to move laterally a predetermined distance, then turning to move down toward the bottom of the bulb, and out said air exit, said airflow path permitting air to enter said heat sink through said air entrance, absorb heat from said heat sink, and exit said heat sink through said air exit, and air located within said enclosure.
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5. A semiconductor light bulb comprising:
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an enclosure, said enclosure being fabricated from a transparent material through which visible light may pass, said enclosure being generally impermeable to gas, a base to which said enclosure is mounted, said base including a fitting of appropriate shape for insertion into a light bulb socket, an interior volume within said enclosure, a heat sink located in said interior volume, said heat sink being capable of drawing heat from a vertical cavity surface emitting laser mounted on said heat sink, a plurality of vertical cavity surface emitting lasers, at least some of said vertical cavity surface emitting lasers being capable of emitting light having a wavelength in the range of about 200 nanometers to about 700 nanometers, at least two of said vertical cavity surface emitting lasers being mounted on said heat sink without any module physically isolating them from each other, an air entrance, an air exit, and an interior airflow path through said heat sink, said air entrance and air exit being proximate a fitting for electrical connection to a light bulb socket, said airflow path proceeding from said air entrance toward the top of the bulb, turning 90 degrees to move laterally a predetermined distance, then turning to move down toward the bottom of the bulb, and out said air exit, said airflow path permitting air to enter said heat sink through said air entrance, absorb heat from said heat sink, and exit said heat sink through said air exit, air located within said enclosure, a fan within said enclosure for bringing air into said air entrance and forcing air through said airflow path and through said air exit, an electrical connection between at least two of said vertical cavity surface emitting lasers, an AC/DC converter, a fitting for electrical connection to a light bulb socket, electrical connection between said AC/DC converter and said vertical cavity surface emitting lasers, electrical connection between said fitting and said AC/DC converter, an air entrance, an air exit, and an interior airflow path through said heat sink, said air entrance and air exit being proximate a fitting for electrical connection to a light bulb socket, said airflow path proceeding from said air entrance toward the top of the bulb, turning 90 degrees to move laterally a predetermined distance, then turning to move down toward the bottom of the bulb, and out said air exit, said airflow path permitting air to enter said heat sink through said air entrance, absorb heat from said heat sink, and exit said heat sink through said air exit, and air located within said enclosure.
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Specification
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Current AssigneeEpistar Corporation
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Original AssigneeCAO Group, Inc.
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InventorsCao, Densen
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Primary Examiner(s)JACKSON JR, JEROME
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Application NumberUS09/939,339Publication NumberTime in Patent Office2,104 DaysField of Search257/99, 257/90, 257/97US Class Current257/99CPC Class CodesF21K 9/232 specially adapted for gener...F21K 9/64 using wavelength conversion...F21V 29/673 the fans being used for intakeF21V 29/677 the fans being used for dis...F21V 29/89 MetalsF21V 3/00 Globes; Bowls; Cover glasse...F21V 3/10 characterised by coatingsF21Y 2107/40 on the sides of polyhedrons...F21Y 2115/10 Light-emitting diodes [LED]F21Y 2115/30 Semiconductor lasersH01L 2224/48091 ArchedH01L 2224/48465 the other connecting portio...H01L 2224/73265 Layer and wire connectorsH01L 25/0753 the devices being arranged ...H01L 2924/00 Indexing scheme for arrange...H01L 2924/00014 the subject-matter covered ...
