Printhead integrated circuit with coupled arrays of transistor drive circuits and nozzles

• US 7,226,147 B2
• Filed: 06/22/2006
• Issued: 06/05/2007
• Est. Priority Date: 10/16/1998
• Status: Expired due to Fees

• Current Assignee: Memjet Technology Ltd. (Memjet Limited)
• Original Assignee: Silverbrook Research Pty Limited
• Inventors: Silverbrook, Kia
• Primary Examiner(s): JACKSON, JUANITA DIONNE
• Application Number:
  US11/472,405
• Publication Number:
  US 20060238571A1
• Time in Patent Office: 348 Days
• Field of Search: 347/20, 347/15, 347/43, 347/54, 347/56, 347 61- 64, 347/65, 347/67, 347/42
• US Class Current: 347/54
• CPC Class Codes: B41J 2/04528 aiming at warming up the head
• CPC Class Codes: B41J 2/04541 Specific driving circuit
• CPC Class Codes: B41J 2/04543 Block driving
• CPC Class Codes: B41J 2/04553 detecting ambient temperature
• CPC Class Codes: B41J 2/04563 detecting head temperature; Ink temperature
• CPC Class Codes: B41J 2/04585 controlling heads based on thermal bent actuators
• CPC Class Codes: B41J 2/04588 using a specific waveform
• CPC Class Codes: B41J 2/04591 Width of the driving signal being adjusted
• CPC Class Codes: B41J 2/04596 Non-ejecting pulses
• CPC Class Codes: B41J 2/14427 Structure of ink jet print heads with thermal bend detached actuators
• CPC Class Codes: B41J 2/1623 bonding and adhesion
• CPC Class Codes: B41J 2/1628 dry etching
• CPC Class Codes: B41J 2/1631 photolithography
• CPC Class Codes: B41J 2/1632 machining
• CPC Class Codes: B41J 2/1635 dividing the wafer into individual chips
• CPC Class Codes: B41J 2/1637 molding
• CPC Class Codes: B41J 2/1639 sacrificial molding
• CPC Class Codes: B41J 2/1642 thin film formation by CVD [chemical vapor deposition]
• CPC Class Codes: B41J 2/1646 thin film formation by sputtering
• CPC Class Codes: B41J 2/1648 Production of print heads with thermal bend detached actuators
• CPC Class Codes: B41J 2/175 : Ink supply systems ; Circuit parts therefor
• CPC Class Codes: B41J 2002/14362 : Assembling elements of heads
• CPC Class Codes: B41J 2002/14419 : Manifold
• CPC Class Codes: B41J 2002/14491 : Electrical connection
• CPC Class Codes: Y10T 29/49083 : Heater type
• CPC Class Codes: Y10T 29/49128 : Assembling formed circuit to base
• CPC Class Codes: Y10T 29/49155 : Manufacturing circuit on or in base
• CPC Class Codes: Y10T 29/494 : Fluidic or fluid actuated device making
• CPC Class Codes: Y10T 29/49401 : Fluid pattern dispersing device making, e.g., ink jet

Abstract

A printhead integrated circuit that has an elongate wafer substrate with three or more columnar arrays of nozzle arrangements fabricated on the elongate wafer substrate. Each columnar array extends parallel to the longitudinal extent of the elongate wafer substrate. Each of the columnar array of nozzle arrangements providing ink drops of a different color. Three columnar arrays of transistor drive circuits fabricated on the wafer substrate adjacent the columnar arrays of nozzle arrangements for activating said columnar arrays of nozzle arrangements; wherein, consecutive nozzle arrangements are spaced such that a series of dots can be printed with a resolution of over 1000 dpi.

Claims

1. A printhead integrated circuit for a pagewidth inkjet printhead, the printhead integrated circuit comprising:

an elongate wafer substrate;

three columnar arrays of nozzle arrangements fabricated on the elongate wafer substrate such that each columnar array extends parallel to the longitudinal extent of the elongate wafer substrate, each of the columnar array of nozzle arrangements providing ink drops of a different color; and

three columnar arrays of transistor drive circuits fabricated on the wafer substrate adjacent the columnar arrays of nozzle arrangements for activating said columnar arrays of nozzle arrangements;

wherein,

consecutive nozzle arrangements are spaced such that a series of dots can be printed with a resolution of over 1000 dpi.

2. A printhead integrated circuit according to claim 1 wherein more than three of the columnar arrays of nozzle arrangements are fabricated on the wafer substrate for the ejection of four or more ink colors or printing fluid types.