Image sensor package and its manufacturing method

• US 7,227,236 B1
• Filed: 04/26/2005
• Issued: 06/05/2007
• Est. Priority Date: 04/26/2005
• Status: Active Grant

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated
• Inventors: Lee, Chang Deok, Na, Do Hyun
• Primary Examiner(s): Pert; Evan
• Assistant Examiner(s): ERDEM, FAZLI
• Application Number:
  US11/115,574
• Time in Patent Office: 770 Days
• Field of Search: None
• US Class Current: 257/433
• CPC Class Codes: G02B 7/02 for lenses supports for magnifying lenses G02B25/002
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/45139 Silver (Ag) as principal constituent
• CPC Class Codes: H01L 2224/45144 Gold (Au) as principal constituent
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 24/97 the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14623 Optical shielding
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 27/14683 Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof not peculiar thereto H01L21/00
• CPC Class Codes: H01L 27/14685 Process for coatings or optical elements
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/1815 Shape
• CPC Class Codes: H01L 2924/18165 of a wire bonded chip
• CPC Class Codes: H01L 2924/207 Diameter ranges
• CPC Class Codes: H04N 23/54 : Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/57 : Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Abstract

Disclosed are an image sensor package and its manufacturing method. As an example, an infrared ray protection glass is positioned directly on an image sensing region of an image sensor die. An electrically conductive wire and so forth located outside the image sensing region are encapsulated. At this time, one surface of the infrared ray protection glass is exposed outwardly. A mount holder to which a barrel with lenses is coupled is adhered on a surface of the encapsulant outside the infrared ray protection glass. The mount holder has a similar width to that of the image sensor die. Accordingly, the overall width of the image sensor package can become reduced, and the electrically conductive wire is protected against oxidization because it is surrounded by the encapsulant.

Claims

1. An image sensor package comprising:

an image sensor die having a first surface and a second surface opposite to the first surface, the first surface being formed in its middle portion with an image sensing region and being provided outside the image sensing region with at least a bond pad;

an infrared ray protection glass covering the image sensing region of the image sensor die and having a first surface and a second surface opposite to the first surface of the infrared ray protection glass;

a substrate being adhered on the second surface of the image sensor die;

at least an electrically conductive wire electrically connecting the bond pad of the image sensor die and the substrate to each other; and

an encapsulant encapsulating the image sensor die, the infrared ray protection glass, the substrate and the electrically conductive wire such that at least the first surface of the infrared ray protection glass is exposed outwardly, the encapsulant directly contacting and enclosing the first surface of the image sensor die outward of the image sensing region.

3. The image sensor package as claimed in claim 1, wherein the second surface of the infrared ray protection glass comes in direct contact with the image sensing region.

5. The image sensor package as claimed in claim 1, wherein the first surface of the infrared ray protection glass is flush with a surface of the encapsulant.

6. The image sensor package as claimed in claim 1, wherein a hollow mount holder is further adhered on a surface of the encapsulant along an outer periphery of the infrared ray protection glass, and a barrel with a plurality of lenses is further coupled to the inside of the mount holder.

7. The image sensor package as claimed in claim 6, wherein the mount holder has a width equal to or less than that of the image sensor die.

8. The image sensor package as claimed in claim 6, wherein the mount holder and the barrel are screwed to each other.

2. An image sensor package comprising:

an image sensor die having a first surface and a second surface opposite to the first surface, the first surface being formed in its middle portion with an image sensing region and being provided outside the image sensing region with at least a bond pad;

an infrared ray protection glass covering the image sensing region of the image sensor die and having a first surface and a second surface opposite to the first surface of the infrared ray protection glass;

an adhesive having a larger thickness than that of the image sensing region interposed between the first surface of the image sensor die and the second surface of the infrared ray protection glass;

a substrate being adhered on the second surface of the image sensor die;

at least an electrically conductive wire electrically connecting the bond pad of the image sensor die and the substrate to each other; and

an encapsulant encapsulating the image sensor die, the infrared ray protection glass, the substrate and the electrically conductive wire such that at least the first surface of the infrared ray protection glass is exposed outwardly.

4. An image sensor package comprising:

an image sensor die having a first surface and a second surface opposite to the first surface, the first surface being formed in its middle portion with an image sensing region and being provided outside the image sensing region with at least a bond pad;

an infrared ray protection glass covering the image sensing region of the image sensor die and having a first surface and a second surface opposite to the first surface of the infrared ray protection glass;

a substrate being adhered on the second surface of the image sensor die;

at least an electrically conductive wire electrically connecting the bond pad of the image sensor die and the substrate to each other; and

an encapsulant encapsulating the image sensor die, the infrared ray protection glass, the substrate and the electrically conductive wire such that at least the first surface of the infrared ray protection glass is exposed outwardly,

wherein the first surface of the infrared ray protection glass is exposed outwardly while projecting from a surface of the encapsulant by a certain height.

9. An image sensor package comprising:

an image sensor die having a first surface and a second surface opposite to the first surface, the first surface being formed in its middle portion with an image sensing region and being provided outside the image sensing region with at least a bond pad;

an infrared ray protection glass covering the image sensing region of the image sensor die and having a first surface and a second surface opposite to the first surface of the infrared ray protection glass;

a substrate being formed with a cavity surface in which the image sensor die is located;

at least an electrically conductive wire electrically connecting the bond pad of the image sensor die and the substrate to each other; and

an encapsulant encapsulating the image sensor die, the infrared ray protection glass, the substrate and the electrically conductive wire such that the infrared ray protection glass and the second surface of the image sensor die are exposed outwardly, the encapsulant directly contacting and enclosing the first surface of the image sensor die outward of the image sensing region.

11. The image sensor package as claimed in claim 9, wherein a hollow mount holder is further adhered on a surface of the encapsulant along an outer periphery of the infrared ray protection glass, and a barrel with a plurality of lenses is further coupled to an inner side of the mount holder.

12. The image sensor package as claimed in claim 11, wherein the mount holder has a width equal to or less than that of the image sensor die.

13. The image sensor package as claimed in claim 11, wherein the mount holder and the barrel are screwed to each other.

14. The image sensor package as claimed in claim 11, wherein a plurality of electrically conductive patterns which are bonded to the image sensor die by the electrically conductive wire are further formed on a surface of the substrate.

15. The image sensor package as claimed in claim 14, wherein a plurality of solder balls are further welded on the surface of the substrate.

10. An image sensor package comprising:

an image sensor die having a first surface and a second surface opposite to the first surface, the first surface being formed in its middle portion with an image sensing region and being provided outside the image sensing region with at least a bond pad;

an infrared ray protection glass covering the image sensing region of the image sensor die and having a first surface and a second surface opposite to the first surface of the infrared ray protection glass;

an adhesive having a larger thickness than that of the image sensing region interposed between the first surface of the image sensor die and the second surface of the infrared ray protection glass;

a substrate being formed with a cavity surface in which the image sensor die is located;

at least an electrically conductive wire electrically connecting the bond pad of the image sensor die and the substrate to each other; and

an encapsulant encapsulating the image sensor die, the infrared ray protection glass, the substrate and the electrically conductive wire such that the infrared ray protection glass and the second surface of the image sensor die are exposed outwardly.

16. A method for manufacturing an image sensor package, the method comprising:

providing a wafer including at least an image sensor die which is formed on its one surface with an image sensing region and a bond pad;

seating an infrared ray protection glass on the image sensing region of the image sensor die;

sawing the wafer into image sensor dies;

attaching at least one of the sawn image sensor dies on a substrate of a substrate strip;

bonding the image sensor die and the substrate to each other by an electrically conductive wire;

encapsulating the image sensor die, the infrared ray protection glass, the substrate and the electrically conductive wire with an encapsulant such that the infrared ray protection glass is exposed outwardly, the encapsulant directly contacting and enclosing the image sensor die outward of the image sensing region;

adhering a mount holder to which a barrel with a plurality of lenses is coupled on a surface of encapsulant; and

singulating the substrate strip into image sensor packages.

18. The method as claimed in claim 16 wherein the infrared ray protection glass protects the image sensing region during the sawing.

19. The method as claimed in claim 16 wherein the barrel is screwed to the mount holder.

20. The method as claimed in claim 16 wherein the adhering a mount holder to which a barrel with a plurality of lenses is coupled on a surface of encapsulant is performed using an adhesive.

17. A method for manufacturing an image sensor package, the method comprising:

providing a wafer including at least an image sensor die which is formed on its one surface with an image sensing region and a bond pad;

seating an infrared ray protection glass on the image sensing region of the image sensor die performed by adhering an adhesive on an outer periphery of the image sensing region and adhering the infrared ray protection glass to the adhesive;

sawing the wafer into image sensor dies;

attaching at least one of the sawn image sensor dies on a substrate of a substrate strip;

bonding the image sensor die and the substrate to each other by an electrically conductive wire;

encapsulating the image sensor die, the infrared ray protection glass, the substrate and the electrically conductive wire with an encapsulant such that the infrared ray protection glass is exposed outwardly;

adhering a mount holder to which a barrel with a plurality of lenses is coupled on a surface of encapsulant; and

singulating the substrate strip into image sensor packages.