Lithographic apparatus having double telecentric illumination

• US 7,227,613 B2
• Filed: 07/26/2004
• Issued: 06/05/2007
• Est. Priority Date: 07/26/2004
• Status: Expired due to Fees

• Current Assignee: ASML Holding NV
• Original Assignee: ASML Holding NV
• Inventors: Vladimirsky, Yuli, Ryzhikov, Lev
• Primary Examiner(s): Nguyen; Henry Hung
• Assistant Examiner(s): Ohira; Marissa A.
• Application Number:
  US10/898,290
• Publication Number:
  US 20060017902A1
• Time in Patent Office: 1,044 Days
• Field of Search: 355/53, 355/67, 355/77, 345/690, 345/694
• US Class Current: 355/53
• CPC Class Codes: G03F 7/70225 Optical aspects of catadioptric systems, i.e. comprising reflective and refractive elements
• CPC Class Codes: G03F 7/70283 Mask effects on the imaging process
• CPC Class Codes: G03F 7/70291 Addressable masks, e.g. spatial light modulators [SLMs], digital micro-mirror devices [DMDs] or liquid crystal display [LCD] patterning devices

Abstract

A system and method are used to pattern illumination to form one or more devices on a substrate using a reflecting system, a pattern generator that defines an objection plane, a projection system, and the substrate that defines an image plane. A reflecting portion of the reflecting system is substantially parallel to a reflecting portion of the pattern generator. The reflecting portion of the pattern generator patterns the illumination beam and directs the patterned illumination beam towards the substrate via the projection system. Based on the relationship of the reflecting system and the pattern generator, the illumination beam is telecentric proximate the object plane and the patterned illumination beam is telecentric proximate the image plane. Through use of a reflecting optic and not a transmissive optic to direct light between the illuminator and the projection system, illumination efficiency is increased and errors imparted on the illumination are decreased.

Claims

1. A system, comprising,

an illumination system that generates a beam of radiation;

a reflecting system including a reflecting portion;

a pattern generator including a plurality of arrays of individually controllable elements that are symmetrical about an axis of symmetry of the pattern generator and an axis of symmetry of the reflecting system, each of the individually controllable elements having a reflecting surface, the pattern generator defining an object plane and configured to pattern the beam of radiation; and

a projection system that projects the patterned beam onto a substrate,

wherein the reflecting portion of the reflecting system reflects the beam of radiation outwardly or inwardly with respect to the axes onto the reflecting surfaces of selected ones of the individually controllable elements.

2. The system of claim 1, further comprising:

a calibration system that is configured to generate control signals to move the individually controllable elements to respective default positions based on detecting the patterned beam.

3. The system of claim 1, wherein the beam of radiation is formed such that substantially all of the beam of radiation interacts with the pattern generator.

4. The system of claim 1, wherein the reflecting portion of the reflecting system is substantially parallel to the reflecting surfaces of the individually controllable elements when they are in a default state.

5. The system of claim 1, wherein the beam of radiation is telecentric proximate the object plane and the patterned beam is telecentric proximate the image plane.

6. A lithography system, comprising:

an illuminating system that produces a beam of radiation;

a dynamic pattern generator having an array of individually controllable elements, the individually controllable elements being symmetrical about an axis of symmetry of the pattern generator and an axis of symmetry of a reflector, the pattern generator patterning the beam of radiation;

the reflector having a conical reflecting surface that is substantially parallel to respective reflecting surfaces of each of the individually controllable elements when the individually controllable elements are in a default state; and

a projection system that directs the patterned beam onto a substrate,

wherein the beam of radiation is telecentric proximate an object plane and the patterned beam is telecentric proximate an image plane.

7. The lithography system of claim 6, wherein the reflector directs the beam of radiation outwardly towards the array of individually controllable elements.

8. The lithography system of claim 6, further comprising:

a calibration system that detects the patterned beam and generates a control signal therefrom that is used to position each of the individually controllable elements such that they are substantially parallel in the default state to the conical reflecting surface.

9. A lithography system, comprising:

an illuminating system that produces a beam of radiation;

a dynamic pattern generator having an array of individually controllable elements that patterns the beam of radiation the individually controllable elements being symmetrical about an axis of symmetry of the pattern generator and an axis of symmetry of a reflector;

the reflector having a pyramid shaped reflecting surface that is substantially parallel to respective reflecting surfaces of each of the individually controllable elements when the individually controllable elements are in a default state; and

a projection system that directs the patterned beam onto a substrate,

wherein the beam of radiation is telecentric proximate an object plane and the patterned beam is telecentric proximate an image plane.

10. The lithography system of claim 9, wherein the reflector directs the beam of radiation outwardly towards the array of individually controllable elements.

11. The lithography system of claim 9, further comprising:

a calibration system that detects the patterned beam and generates a control signal that is used to position each of the individually controllable elements such that they are substantially parallel in the default state to the pyramid shaped reflecting surface.

12. A lithography system, comprising:

an illuminating system that produces an illumination beam;

a plurality of dynamic pattern generators each having a plurality of reflective controllable elements that pattern the illumination beam the reflective controllable elements being symmetrical about an axis of symmetry of the pattern generators and an axis of symmetry of a reflector;

the reflector whose respective reflecting sections are substantially parallel to reflecting surfaces of the plurality of reflective controllable elements in a default state; and

a projection system that directs the patterned illumination beam onto a substrate,

wherein the illumination beam is telecentric proximate an object plane and the patterned illumination beam is telecentric proximate an image plane, and

wherein the reflector reflects the beam of radiation passing through a peripheral portion of the object plane onto the plurality of dynamic pattern generators.

13. The lithography system of claim 12, wherein the reflector reflects the illumination beam inwardly towards the dynamic pattern generator.

14. The lithography system of claim 12, further comprising:

a calibration system that positions elements in the plurality of controllable elements such that they are substantially parallel in the default state to the reflector.

15. A method of making a device, comprising:

(a) reflecting a beam of radiation using a reflecting section of a reflecting system towards a pattern generator that defines an object plane;

(b) patterning the beam of radiation using the pattern generator that includes a plurality of arrays of individually controllable elements that are symmetrical about an axis of symmetry of the pattern generator and an axis of symmetry of the reflecting system, each of the individually controllable elements having a reflective surface;

(c) directing the patterned beam using a projection system onto a substrate that defines an image plane and on which the device is formed,

wherein the reflecting section reflects the beam of radiation outwardly or inwardly with respect to the axes towards the pattern generator.

16. The method of claim 15, wherein step (b) comprises:

adjusting the reflective surfaces of the individually controllable elements to a default state so that the reflecting surfaces are substantially parallel to the reflecting section of the reflecting system.

17. The method of claim 16, further comprising:

(e) using a calibration method to position respective ones of the plurality of individually controllable elements.

18. The method of claim 15, wherein step (a) comprises:

forming the beam of radiation such that substantially all of the beam of radiation interacts with the pattern generator.

19. The method of claim 15, wherein the beam of radiation is telecentric proximate the object plane and the patterned beam is telecentric proximate the image plane.