Thermal bus load control management for electronic systems

• US 7,227,749 B2
• Filed: 12/07/2004
• Issued: 06/05/2007
• Est. Priority Date: 12/07/2004
• Status: Active Grant

• Current Assignee: Rocky Research (Honeywell International Inc.)
• Original Assignee: Rocky Research (Honeywell International Inc.)
• Inventors: Rockenfeller, Uwe
• Primary Examiner(s): Datskosky; Michael
• Assistant Examiner(s): HOFFBERG, ROBERT JOSEPH
• Application Number:
  US11/007,085
• Publication Number:
  US 20060120036A1
• Time in Patent Office: 910 Days
• Field of Search: 361687-688, 165 802- 805, 165/104.33, 165/185, 165/276, 623/83
• US Class Current: 361/688
• CPC Class Codes: H05K 7/20836 Thermal management, e.g. server temperature control

Abstract

An electronic apparatus comprising a housing having a plurality of electronic components and two or more separate heat transfer systems each thermally communicating with different one or more of said electronic components is characterized by at least one central heat transfer bus communicating with the two or more heat transfer systems, one or more switching or modulating connections between the heat transfer bus and one or more of the heat transfer systems, and one or more activating components for switching or modulating the one or more connections in response to monitored thermal load or temperature of the electronic components and/or heat transfer bus. Heat transfer between said heat transfer bus and one or more of the heat transfer systems is modulated or switched on or off by the activating components.

Claims

1. An electronic apparatus comprising a housing having a plurality of electronic components therein,

two or more separate heat transfer systems each thermally communicating with different one or more of said electronic components, said heat transfer systems comprising one or more heat exchangers for transferring thermal energy to and/or from said electronic components, and

at least one central heat transfer bus communicating with said two or more heat transfer systems,

said apparatus characterized by:

one or more switching or modulating connections between said heat transfer bus and one or more of said heat transfer systems, and

one or more activating components for switching or modulating said one or more connections in response to monitored thermal load or temperatures of said one or more of said electronic components and/or said heat transfer bus, or in response to a preselected temperature or thermal load of said heat transfer bus and/or one or more of said electronic components, whereby heat transfer between said heat transfer bus and one or more of said heat transfer systems is modulated or switched on or off by said activating components.

2. An apparatus of claim 1 wherein said one or more activating components comprises one or more sensors for monitoring the temperature or load of said heat transfer bus and/or one or more of said electronic components, said one or more sensors operatively communicating with said switching or modulating connections, and/or one or more sensors for monitoring the temperature or load of one or more of said electronics components and operatively communicating with said switching or modulating connection.

3. An apparatus of claim 2 wherein said heat transfer bus comprises a heat exchanger including a heat transfer medium and wherein one or more of said sensors for monitoring the temperature or load of said heat transfer bus monitors the temperature of said heat transfer medium and/or measures the ambient temperature.

4. An apparatus of claim 2 comprising a controller configured to direct switching and modulating of the said one or more connections.

5. An apparatus of claim 4 wherein said controller comprises instructions for directing switching or modulating one or more of said connections in response to monitored temperatures of said heat transfer bus and one or more of said electronic components.

6. An apparatus of claim 4 wherein said controller comprises instructions for directing switching or modulating one or more of said connections in response to monitored load of one or more of said electronic components.

7. An apparatus of claim 4 wherein said controller comprises instructions for directing switching or modulating one or more of said connections in response to monitored temperature and monitored or computed load of said heat transfer bus and/or one or more of said electronic components.

8. A heat transfer apparatus of claim 4 wherein said controller comprises instructions for directing switching or modulation in response to monitored or anticipated thermal load of said heat transfer bus.

9. An apparatus of claim 4 wherein said controller comprises instructions for switching or modulating a connection to at least one of said electronic components in response to operating temperature or operational load limitations of said electronic components.

10. An apparatus of claim 9 wherein said controller comprises instructions for prioritizing heat transfer requirement in response to sensed electronic component temperature an/or thermal load.

11. An apparatus claim 10 wherein said controller comprises instructions for said prioritizing in response to two or more sensed conditions selected from ambient temperature, component temperature, component loads, anticipated temperatures and anticipated loads.

12. An apparatus of claim 4 wherein said controller comprises instructions for directing switching or modulation in response to prioritized heat transfer requirement of one or more selected of said electronic components.

13. An apparatus of claim 1 wherein said heat transfer bus includes a phase change refrigerant heat exchange loop.

14. An apparatus of claim 13 wherein said phase change refrigerant is a hydrofluorocarbon.

15. An apparatus of claim 1 wherein said heat transfer bus comprises a pumped liquid loop.

16. An apparatus of claim 15 wherein said pumped liquid comprises water.

17. An apparatus of claim 1 wherein said heat transfer bus comprises a thermally conductive solid material.

18. An apparatus of claim 17 wherein said conductive solid material comprises a metal selected from the group consisting of copper, aluminum, titanium and gold.

19. An apparatus of claim 1 wherein at least one of said modulating connections comprises a heat transfer capacity modulator.

20. An apparatus of claim 19 wherein said capacity modulator comprises a heat pipe.

21. An apparatus of claim 20 wherein said heat pipe is configured to modulate its capacity by refrigerant charge alteration.

22. An apparatus of claim 19 wherein said capacity modulator comprises a thermally expandable composition configured to increase the cross-section of the effective heat transfer path.

23. An apparatus of claim 1 wherein at least one of said switching connections comprises a heat transfer switching device.

24. An apparatus of claim 23 wherein said heat transfer switching device comprises a thermally sensitive bi-metal.

25. An apparatus of claim 23 wherein said heat transfer switching device comprises a heat pipe which substantially eliminates its heat transfer by reducing its refrigerant charge to less than 10% of the design charge.

26. An apparatus of claim 23 wherein said heat transfer switching device comprises a thermal fuse.

27. An apparatus of claim 26 wherein said thermal fuse comprises wax.

28. An apparatus of claim 1 wherein said activating component comprises an electrically actuated contact.

29. An apparatus of claim 28 wherein said electrically actuated contact comprises one or more solenoid switches providing thermal conductance through metal contact when closed.

30. An apparatus of claim 1 wherein said activating component comprises a plurality of individually controlled electrically actuated contacts for modulating said one or more connections.

31. An apparatus of claim 30 wherein said plurality of electrically actuated contacts comprise solenoid switches configured to provide thermal conductance through metal contact when closed.

32. An apparatus of claim 1 wherein at least one of said heat transfer systems comprises means for heating.

33. An apparatus claim 1 including one or more heat sinks exterior to the housing and wherein said central heat transfer bus is thermally connected to said one or more heat sinks.

34. An apparatus of claim 33 wherein said one or more heat sinks comprises forced convection heat transfer apparatus.

35. An apparatus claim 33 wherein said one or more heat sinks comprises an active refrigeration cooling component comprising a thermoelectric device, liquid cooled heat exchanger, or refrigerant evaporator.

36. An apparatus claim 33 or 35 wherein said heat sink comprises a heat transfer fluid loop.

37. An apparatus claim 33 wherein said heat sink comprises a coordinative complex compound refrigeration apparatus.

38. An apparatus claim 1 wherein said central heat transfer bus includes a heat exchanger and wherein said apparatus includes one or more fans for directing a flow of air in heat exchange communication with said heat transfer bus heat exchanger.

39. An apparatus claim 38 wherein said housing includes one or more ports cooperating with said one or more fans for directing air flow into and out of said housing.

40. An apparatus claim 1 including an active cooling or refrigeration system in thermal communication with said central heat transfer bus.

41. An apparatus claim 40 wherein said active cooling or refrigeration system includes one or more heat exchangers in direct thermal communication with said central heat transfer bus.

42. An apparatus claim 40 comprising a heat exchanger having a heat transfer fluid comprising a liquid, gas or two phase heat transfer fluid in direct thermal communication between said central heat transfer bus and said active cooling or refrigeration system.

43. An apparatus claim 42 wherein said heat transfer fluid is a vaporizable refrigerant.

44. An apparatus of claim 42 wherein said heat transfer fluid comprises water or an aqueous fluid.

45. An apparatus claim 40 wherein said active cooling or refrigerating system comprises a heat exchanger outside said housing and having a heat exchange surface for evaporating water for cooling thereof.

46. An apparatus claim 40 wherein said active cooling or refrigeration system comprises water evaporation.

67. A method of operating an apparatus of claim 1 comprising sensing electronic component temperature and switching or modulating said components in response to electronic component temperature.

68. A method of operating an apparatus of claim 67 comprising switching or modulating in response to two or more of the following:

one or more of the electronic component or component heat transfer system temperatures and/or the thermal bus temperature and/or the ambient temperature.

69. A method of operating an apparatus of claim 1 comprising sensing the temperature of at least one of said electronic components and activating said activation means in response thereto.

70. A method of operating an apparatus of claim 1 comprising sensing the temperature of the thermal bus and/or the ambient temperature and use of the predicted or calculated load of one or more electronic components.

47. A heat transfer apparatus for removing heat from an electronic apparatus comprising a housing having a plurality of electronic components therein, said heat transfer apparatus comprising:

one or more separate heat transfer systems each thermally communicating with a different one or more of said electronic components, said one or more heat transfer systems comprising one or more heat exchangers for transferring thermal energy to and/or from said electronic components, and

a central heat transfer bus communicating with said one or more heat transfer systems,

one or more switching or modulating connections between said heat transfer bus and one or more of said heat transfer systems, and

activating means for switching or modulating said one or more connections in response to monitored thermal load or temperature of said one or more electronic components and/or said heat transfer bus, or in response to a preselected temperature or thermal load of said one or more electronic components and/or said heat transfer bus, whereby heat transfer between said heat transfer bus and one or more of said heat transfer systems is modulated or switched on or off by said activating means.

48. A heat transfer apparatus of claim 47 wherein at least one thermal load is not in thermal communication with the one or more heat transfer systems for the central heat transfer bus.

49. A heat transfer apparatus of claim 47 wherein one or more but less than all of said heat transfer systems comprise a heat exchange external to said housing.

50. A heat transfer apparatus of claim 47 including one or more direct heat exchangers for transferring heat directly from an electronic component to the exterior of said housing independent of said heat transfer bus and wherein said one or more direct heat exchangers are not in thermal communication with said heat transfer bus.

51. A heat transfer apparatus of claim 47 including means for heating at least one of said electronic components.

52. A heat transfer apparatus of claim 47 including an energy storage system for selectively discharging energy to said one or more heat transfer systems and/or said central heat transfer bus.

53. A heat transfer apparatus of claim 52 wherein said energy storage system is a thermal energy storage system and comprises a metal block.

54. A heat transfer apparatus of claim 52 wherein said energy storage system comprises a battery to operate a cooling or heating energy flow.

55. A heat transfer apparatus of claim 52 wherein said energy storage system is configured to release heat to an electronic component.

56. A heat transfer apparatus of claim 47 including a thermal energy storage system in thermal communication with said central heat transfer bus for selectively discharging thermal energy commonly for cooling thereto.

57. A heat transfer apparatus of claim 56 wherein said thermal energy storage system comprises ice or water.

58. A heat transfer apparatus of claim 56 wherein said thermal energy storage system comprises a coordinative complex compound sorption system.

59. A heat transfer apparatus of claim 56 wherein said thermal energy storage system comprises a phase change material undergoing phase change from solid to liquid in the operating temperature range of the heat transfer system.

60. A heat transfer apparatus of claim 56 wherein said thermal energy storage system comprises a vaporizable liquid.

61. A heat transfer apparatus of claim 60 wherein said liquid is water.

62. A heat transfer apparatus of claim 60 liquid is a refrigerant.

63. A heat transfer apparatus of claim 62 wherein vaporized refrigerant is absorbed on an absorbent.

64. A heat transfer apparatus of claim 56 wherein said thermal energy storage system is configured to release heat to an electronic component.

65. A heat transfer apparatus of claim 64 wherein said thermal energy storage system is configured to release heat independent of said heat transfer bus.

66. A heat transfer apparatus of claim 64 wherein said electronic component is configured to selectively receive cooling independent of said heat transfer bus.