Transceiver module having a dual segment lead frame connector

• US 7,229,295 B2
• Filed: 08/30/2006
• Issued: 06/12/2007
• Est. Priority Date: 02/27/2004
• Status: Active Grant

• Current Assignee: II-VI Delaware, Inc. (Coherent Corp.)
• Original Assignee: Finisar Corporation (II-VI Incorporated)
• Inventors: Douma, Darin J., Nelson, Stephen T., Ice, Donald A.
• Primary Examiner(s): Paumen; Gary F.
• Application Number:
  US11/468,752
• Publication Number:
  US 20070003195A1
• Time in Patent Office: 286 Days
• Field of Search: 439/79, 439/516, 439/736, 439/596, 439/236, 439/885, 439/43, 439/860, 439/242, 439/226, 385/92, 385/93, 385/89, 385/88
• US Class Current: 439/79
• CPC Class Codes: G02B 6/4201 Packages, e.g. shape, construction, internal or external details
• CPC Class Codes: G02B 6/4245 Mounting of the opto-electronic elements
• CPC Class Codes: G02B 6/4246 Bidirectionally operating package structures
• CPC Class Codes: G02B 6/4255 Moulded or casted packages
• CPC Class Codes: G02B 6/4292 the light guide being disconnectable from the opto-electronic element, e.g. mutually self aligning arrangements
• CPC Class Codes: H01R 13/6315 allowing relative movement between coupling parts, e.g. floating connection for coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures, H01R12/91 takes precedence
• CPC Class Codes: H05K 1/0278 Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
• CPC Class Codes: H05K 1/141 One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 2201/0394 Conductor crossing over a hole in the substrate or a gap between two separate substrate parts
• CPC Class Codes: H05K 2201/049 PCB for one component, e.g. for mounting onto mother PCB
• CPC Class Codes: H05K 2201/09118 Moulded substrate
• CPC Class Codes: H05K 2201/10121 Optical component, e.g. opto-electronic component
• CPC Class Codes: H05K 2201/10446 Mounted on an edge soldering edge mounted components H05K3/3405; edge terminals H05K2201/1034
• CPC Class Codes: H05K 2201/10757 Bent leads
• CPC Class Codes: H05K 2201/10924 Leads formed from a punched metal foil affixing a prefabricated self-supporting metal foil pattern H05K3/202
• CPC Class Codes: H05K 2203/302 Bending a rigid substrate; Breaking rigid substrates by bending rigid circuit boards or rigid supports locally made bendable H05K1/0278
• CPC Class Codes: H05K 3/202 using self-supporting metal foil pattern
• CPC Class Codes: H05K 3/3405 Edge mounted components, e.g. terminals
• CPC Class Codes: H05K 3/3447 Lead-in-hole components H05K3/3415 takes precedence

Abstract

An optical transceiver module having a plurality of optical subassemblies and a printed circuit board is disclosed. The transceiver module includes lead frame connectors for connecting the optical subassemblies to the printed circuit board. The lead frame connectors include a stamped and bent conductive lead structure that is encased in an insert injection molded plastic casing. The plastic casing provides electrical insulation for the conductors in the lead frame as well as mechanical support for the finished component. The lead frame connectors connect to the leads associated with the optical subassemblies and are surface mounted onto the printed circuit board to establish connectivity between the optical subassembly and the printed circuit board. The lead frame assemblies are generally more reliable and less expensive than using flexible printed circuit board structures to establish electrical connectivity between optical subassemblies and transceiver printed circuit boards.

Claims

1. A lead frame connector, comprising:

an electrically insulating casing comprising;

first and second portions; and

a flexible portion interposed between, and attached to, the first and second portions; and

a plurality of conductors that are electrically isolated one from another, each of the plurality of conductors extending from the first portion through the flexible portion and into the second portion, and comprising;

an electrical contact portion configured to interface with a corresponding lead of an optical subassembly; and

a lead in electrical communication with the electrical contact portion, the lead being configured to interface with a corresponding element of a printed circuit board.

2. The lead frame connector as recited in claim 1, wherein the flexible portion comprises either plastic or rubber.

3. The lead frame connector as recited in claim 1, wherein:

the first portion comprises a first casing; and

the second portion comprises a second casing.

4. The lead frame connector as recited in claim 2, wherein the conductors are bent at segments thereof between the first casing and the second casing.

5. The lead frame connector as recited in claim 1, wherein the casing is insert injection molded over a portion of the plurality of conductors.

6. The lead frame connector as recited in claim 1, wherein the first portion is oriented at an angle with respect to the second portion.

7. The lead frame connector as recited in claim 2, wherein a configuration of the first and second casings corresponds with a desired impedance effect associated with the plurality of conductors.

8. The lead frame connector as recited in claim 3, wherein a configuration of each of the plurality of conductors is associated with a particular impedance control effect.

9. The lead frame connector as recited in claim 1, wherein electrical isolation of the conductors relative to each other is effected by the electrically insulating casing.

10. The lead frame connector as recited in claim 1, wherein one of the portions of the casing is substantially perpendicular with respect to the other portion of the casing.

11. An optical subassembly attached to the lead frame connector of claim 1.