Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization

• US 7,229,336 B2
• Filed: 10/31/2003
• Issued: 06/12/2007
• Est. Priority Date: 08/31/1999
• Status: Expired due to Fees

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Moore, Scott E.
• Primary Examiner(s): RACHUBA, MAURINA T
• Application Number:
  US10/698,142
• Publication Number:
  US 20040097169A1
• Time in Patent Office: 1,320 Days
• Field of Search: 451/5, 451/8, 451/41, 451/56, 451285-290, 451/443, 451/444
• US Class Current: 451/5
• CPC Class Codes: B24B 49/006 taking regard of the speed
• CPC Class Codes: B24B 49/16 taking regard of the load
• CPC Class Codes: B24B 53/017 Devices or means for dressing, cleaning or otherwise conditioning lapping tools
• CPC Class Codes: B24B 53/12 Dressing tools; Holders therefor

Abstract

A method and apparatus for conditioning and monitoring a planarizing medium used for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a conditioning body having a conditioning surface that engages a planarizing surface of the planarizing medium and is movable relative to the planarizing medium. A force sensor is coupled to the conditioning body to detect a frictional force imparted to the conditioning body by the planarizing medium when the conditioning body and the planarizing medium are moved relative to each other. The apparatus can further include a feedback device that controls the motion, position, or force between the conditioning body and the planarizing medium to control the conditioning of the planarizing medium.

Claims

1. A method for controlling conditioning of a continuous planarizing medium used for planarizing a microelectronic substrate, the method compnsing:

positioning the continuous planarizing medium around a pair of spaced apart rollers to define a first planarization station and an opposing second planarization station;

engaging a conditioning body with the continuous planarizing pad proximate to at least one of the first planarization station and the opposing second planarization station and moving at least one of the conditioning body and the continuous planarizing medium relative to the other while the conditioning body contacts the continuous planarizing medium to generate a frictional force between the conditioning body and the continuous planarizing medium, the conditioning body being coupled to a generally upwardly extending first support member and a generally laterally extending second support member being pivotally coupled to the first support member;

transmitting a force to a force sensor indicative of the frictional force by pivoting the first support member to compress a force sensor between the first and second support members; and

controlling at least one of a force between the conditioning body and the continuous planarizing medium and a speed of the conditioning body relative to the continuous planarizing medium in response to detecting the frictional force between the conditioning body and the planarizing medium.

2. The method of claim 1, wherein at least one of a force between the conditioning body and the continuous planarizing medium comprises receiving a first signal corresponding to the frictional force and transmitting a second signal to an actuator coupled to the conditioning body.

3. The method of claim 2, wherein receiving the first signal comprises receiving the first signal with a microprocessor and wherein transmitting the second signal comprises transmitting the second signal from the microprocessor.

4. The method of claim 1, wherein controlling at least one of a force between the conditioning body and the continuous planarizing medium comprises applying a force to the conditioning body that is approximately normal to a planarizing surface of the planarizing medium.

5. The method of claim 1, wherein controlling a speed of the conditioning body relative to the continuous planarizing medium further comprises controlling a rotational speed of the spaced apart rollers.

6. The method of claim 1, wherein positioning the continuous planarizing medium around a pair of spaced apart rollers further comprises supporting the continuous planarizing medium with a continuous support band.

7. The method of claim 1, wherein positioning the continuous planarizing medium around a pair of spaced apart rollers further comprises positioning a first platen proximate to the first planarization station and positioning a second platen proximate to the second planarization station.

8. The method of claim 7, wherein positioning the continuous planarizing medium around a pair of spaced apart rollers further comprises positioning a first carrier supporting a first substrate adjacent to the first platen and positioning a second carrier supporting a second substrate adjacent to the second platen and wherein engaging a conditioning body with the continuous planarizing medium further comprises contacting the continuous planarizing medium with the conditioning body while the first substrate and the second substrate are in contact with the planarizing medium.

9. The method of claim 7, wherein positioning the continuous planarizing medium around a pair of spaced apart rollers further comprises positioning a first carrier supporting a first substrate adjacent to the first platen and positioning a second carrier supporting a second substrate adjacent to the second platen and wherein engaging a conditioning body with the continuous planarizing medium further comprises contacting the continuous planarizing medium with the conditioning body while the first substrate and the second substrate are not in contact with the planarizing medium.

10. The method of claim 1 wherein the force sensor comprises a compression force sensor.