Methods of and apparatus for molding structures using sacrificial metal patterns

• US 7,229,542 B2
• Filed: 05/07/2003
• Issued: 06/12/2007
• Est. Priority Date: 05/07/2002
• Status: Expired due to Term

• Current Assignee: Memgen Corporation (Technoprobe S.P.A.)
• Original Assignee: Microfabrica Incorporated (Technoprobe S.P.A.)
• Inventors: Bang, Christopher A.
• Primary Examiner(s): Wong; Edna
• Application Number:
  US10/434,315
• Publication Number:
  US 20030234179A1
• Time in Patent Office: 1,497 Days
• Field of Search: 205/118, 205/135, 205/170, 205/181, 205/182, 205/220, 205/221, 205/223, 205/67, 205/70, 264/219, 264/221, 264/259, 264/271.1, 264/299, 264/313, 264/317, 264/318, 264/328.1
• US Class Current: 205/67
• CPC Class Codes: B33Y 10/00 Processes of additive manufacturing
• CPC Class Codes: B81B 2201/042 Micromirrors, not used as optical switches
• CPC Class Codes: B81C 2201/0107 Sacrificial metal
• CPC Class Codes: B81C 2201/0109 Sacrificial layers not provided for in B81C2201/0107 - B81C2201/0108
• CPC Class Codes: B81C 2201/0197 Processes for making multi-layered devices not provided for in groups B81C2201/0176 - B81C2201/0192
• CPC Class Codes: B81C 99/0085 using moulds and master templates, e.g. for hot-embossing
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: G01P 15/125 by capacitive pick-up

Abstract

Molded structures, methods of and apparatus for producing the molded structures are provided. At least a portion of the surface features for the molds are formed from multilayer electrochemically fabricated structures (e.g. fabricated by the EFAB™ formation process), and typically contain features having resolutions within the 1 to 100 μm range. The layered structure is combined with other mold components, as necessary, and a molding material is injected into the mold and hardened. The layered structure is removed (e.g. by etching) along with any other mold components to yield the molded article. In some embodiments portions of the layered structure remain in the molded article and in other embodiments an additional molding material is added after a partial or complete removal of the layered structure.

Claims

1. A method of forming a three-dimensional molded structure, comprising:

(A) providing a mold having a mold structure that comprises at least one sacrificial material and at least one structural material, the at least one sacrificial material and the at least one structural material each have a surface that define a portion of a desired molding pattern, wherein the mold structure is formed, at least in part, by electrochemically depositing multiple layers, each comprising the at least one sacrificial material deposited adjacent to and adhered to a previously deposited layer that comprises the at least one sacrificial material and wherein the at least one structural material is electrochemically deposited during formation of at least one layer;

(B) placing flowable molding material against the desired molding pattern and allowing or causing the molding material to solidify to form at least a portion of the three-dimensional molded structure; and

(C) separating the three-dimensional molded structure from a portion of the mold, wherein the separating is accomplished, at least in part, by destroying the desired molding pattern defined by the at least one sacrificial material without significantly damaging the molding material such that an image of the molding pattern remains on a surface of the three-dimensional molded structure, and wherein the at least one structural material, after destroying the desired molding pattern, is restrained to a desired location by the molding material and becomes part of the three-dimensional structure.