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Thin film device provided with coating film, liquid crystal panel and electronic device, and method for making the thin film device

  • US 7,229,859 B2
  • Filed: 01/29/2003
  • Issued: 06/12/2007
  • Est. Priority Date: 05/15/1996
  • Status: Expired due to Fees
First Claim
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1. A method of forming a device, the method comprising:

  • applying a first solution to form a first applied film over a portion of a substrate, the first applied film being patterned, the first solution including a first solvent and a first solute;

    heating the first applied film at a temperature ranging from 250°

    C. to 500°

    C. to form a first film over the portion, the first solvent being evaporated during a period in which the heating of the first applied film is carried out;

    applying a second solution to form a second applied film over the portion of the substrate, the second applied film being patterned, the second solution including a second solvent and a second solute;

    heating the second applied film at a temperature ranging from 250°

    C. to 500°

    C. to form a second film over the portion, the second solvent being evaporated during a period in which the heating of the second applied film is carried out;

    applying a dispersion liquid to form a third applied film over the portion of the substrate, the dispersion liquid including a dispersion medium and a dispersoid, the dispersoid being a metal particle with a size of 80 to 100 angstroms; and

    heating the third applied film at a temperature ranging from 250°

    C. to 500°

    C. to form a third film over the portion.

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