Organic field-effect transistor, method for structuring an OFET and integrated circuit

• US 7,229,868 B2
• Filed: 12/07/2001
• Issued: 06/12/2007
• Est. Priority Date: 12/08/2000
• Status: Expired due to Fees

• Current Assignee: AMO GmbH, PolyIC GmbH & Co. KG (Leonhard KURZ Stiftung & Company KG)
• Original Assignee: PolyIC GmbH & Co. KG (Leonhard KURZ Stiftung & Company KG)
• Inventors: Bernds, Adolf, Clemens, Wolfgang, Kurz, Heinrich, Vratzov, Borislav, Haring, Peter
• Primary Examiner(s): Le; Thao P.
• Application Number:
  US10/433,959
• Publication Number:
  US 20040063267A1
• Time in Patent Office: 2,013 Days
• Field of Search: 438/197, 438/99, 438/82, 438/780, 257/401, 257/288, 257/E51.005
• US Class Current: 438/197
• CPC Class Codes: H10K 10/464 Lateral top-gate IGFETs comprising only a single gate
• CPC Class Codes: H10K 10/468 characterised by the gate dielectrics
• CPC Class Codes: H10K 71/13 using printing techniques, e.g. ink-jet printing or screen printing
• CPC Class Codes: H10K 71/20 Changing the shape of the active layer in the devices, e.g. patterning
• CPC Class Codes: H10K 71/221 by lift-off techniques
• CPC Class Codes: H10K 71/621 Providing a shape to conductive layers, e.g. patterning or selective deposition
• CPC Class Codes: H10K 71/821 Patterning of a layer by embossing, e.g. stamping to form trenches in an insulating layer

Abstract

The invention relates to an organic field-effect transistor, to a method for structuring an OFET and to an integrated circuit with improved structuring of the functional polymer layers. The improved structuring is obtained by introducing, using a doctor blade, the functional polymer in the mold layer in which recesses are initially produced by imprinting.

Claims

1. Method for forming an OFET comprising the following:

a) depositing a mold layer for a negative mold on a substrate or a lower layer,

b) imprinting recesses into the mold layer whereby the recesses correspond to the negatives of subsequent patterns of the OFET and

c) then introducing a functional polymer into the recesses by a doctor blade.

2. Method according to claim 1, wherein the mold layer is removed upon completion of the patterning.

3. Method according to claim 1, wherein the functional polymer is introduced at least twice into the recesses of the mold layer by the doctor blade.

4. Method according to claim 1, comprising continuously performing the method of claim 1 with a continuously running belt.

5. Method according to claim 2, wherein the functional polymer is introduced at least twice into the recesses of the mold layer by the doctor blade.

6. Method according to claim 2, comprising continuously performing the method of claim 2 with a continuously running belt.

7. Method according to claim 3, comprising continuously performing the method of claim 3 with a continuously running belt.