Vertical offset structure and method for fabricating the same

• US 7,230,307 B2
• Filed: 07/19/2005
• Issued: 06/12/2007
• Est. Priority Date: 07/19/2004
• Status: Expired due to Fees

• Current Assignee: Samsung Electronics Co. Ltd.
• Original Assignee: Samsung Electronics Co. Ltd.
• Inventors: Lee, Sang-woo, Kim, Jong-pal, Choi, Joon-hyock, Lee, Byeung-leul
• Primary Examiner(s): Pert; Evan
• Assistant Examiner(s): Sandvik; Benjamin P.
• Application Number:
  US11/183,863
• Publication Number:
  US 20060023995A1
• Time in Patent Office: 693 Days
• Field of Search: None
• US Class Current: 257/414
• CPC Class Codes: B81B 2201/0235 Accelerometers
• CPC Class Codes: B81C 1/00182 Arrangements of deformable or non-deformable structures, e.g. membrane and cavity for use in a transducer
• CPC Class Codes: B81C 2203/0118 Bonding a wafer on the substrate, i.e. where the cap consists of another wafer
• CPC Class Codes: G01P 15/0802 Details
• CPC Class Codes: G01P 15/125 by capacitive pick-up

Abstract

A vertical offset structure and a method for fabricating the same. The vertical offset structure includes a substrate; a fixed electrode fixing portion formed on the substrate; a fixed electrode moving portion formed at a position away from an upper portion of the substrate by a predetermined distance; a spring portion for connecting the fixed electrode fixing portion and the fixed electrode moving portion to each other so that the fixed electrode moving portion moves into a direction substantially perpendicular to a plate surface of the substrate; a movable electrode located away from the upper portion of the substrate by a predetermined distance to have a predetermined interval horizontal to the fixed electrode moving portion; and a cap wafer bonded to a predetermined area of one of the fixed electrode moving portion and the movable electrode.

Claims

1. A vertical offset structure, comprising:

a substrate;

a fixed electrode fixing portion formed on the substrate;

a fixed electrode moving portion formed at a position away from an upper portion of the substrate by a predetermined distance;

a spring portion operable to connect the fixed electrode fixing portion and the fixed electrode moving portion to each other so that the fixed electrode moving portion moves in a direction substantially perpendicular to a plate surface of the substrate;

a movable electrode located away from the upper portion of the substrate by a predetermined distance to have a predetermined interval horizontal to the fixed electrode moving portion; and

a cap wafer bonded to a predetermined area of one of the fixed electrode moving portion and the movable electrode by making each of the fixed electrode moving portion and the movable electrode have a vertical offset so that one of the fixed electrode moving portion and the movable electrode moves in a direction substantially perpendicular to the plate surface of the substrate.

2. The vertical offset structure as claimed in claim 1, wherein the spring portion allows the fixed electrode moving portion to be moved in only the direction substantially perpendicular to the plate surface of the substrate.

3. The vertical offset structure as claimed in claim 1, wherein the cap wafer performs an anodic bonding to a predetermined area of one of the fixed electrode moving portion and the movable electrode, wherein one of the fixed electrode moving portion and the movable electrode moves from the substrate to the cap wafer to form a vertical offset.

4. The vertical offset structure as claimed in claim 1, wherein the cap wafer comprises a projection portion at a bonding area bonded to a predetermined area of one of the fixed electrode moving portion and the movable electrode so that one of the fixed electrode moving portion and the movable electrode moves from the cap wafer to the substrate.

5. The vertical offset structure as claimed in claim 4, wherein the projection portion is formed by etching areas other than the bonded area of the cap wafer.

6. The vertical offset structure as claimed in claim 4, wherein the projection portion is formed by depositing materials at the cap wafer and etching the deposited material at areas other than the bonded area of the cap wafer.

7. A vertical operation type capacitance electrode manufactured comprising a vertical offset structure comprising:

a substrate;

a fixed electrode fixing portion formed on the substrate;

a fixed electrode moving portion formed at a position away from an upper portion of the substrate by a predetermined distance;

a spring portion operable to connect the fixed electrode fixing portion and the fixed electrode moving portion to each other so that the fixed electrode moving portion moves in a direction substantially perpendicular to a plate surface of the substrate;

a movable electrode located away from the upper portion of the substrate by a predetermined distance to have a predetermined interval horizontal to the fixed electrode moving portion; and

a cap wafer bonded to a predetermined area of one of the fixed electrode moving portion and the movable electrode by making each of the fixed electrode moving portion and the movable electrode have a vertical offset so that one of the fixed electrode moving portion and the movable electrode moves in a direction substantially perpendicular to the plate surface of the substrate.

8. An accelerometer manufactured comprising a vertical offset structure comprising:

a substrate;

a fixed electrode fixing portion formed on the substrate;

a fixed electrode moving portion formed at a position away from an upper portion of the substrate by a predetermined distance;

a spring portion operable to connect the fixed electrode fixing portion and the fixed electrode moving portion to each other so that the fixed electrode moving portion moves in a direction substantially perpendicular to a plate surface of the substrate;

a movable electrode located away from the upper portion of the substrate by a predetermined distance to have a predetermined interval horizontal to the fixed electrode moving portion; and

a cap wafer bonded to a predetermined area of one of the fixed electrode moving portion and the movable electrode by making each of the fixed electrode moving portion and the movable electrode have a vertical offset so that one of the fixed electrode moving portion and the movable electrode moves in a direction substantially perpendicular to the plate surface of the substrate.

9. An angular velocity system manufactured comprising a vertical offset structure comprising:

a substrate;

a fixed electrode fixing portion formed on the substrate;

a fixed electrode moving portion formed at a position away from an upper portion of the substrate by a predetermined distance;

a spring portion operable to connect the fixed electrode fixing portion and the fixed electrode moving portion to each other so that the fixed electrode moving portion moves in a direction substantially perpendicular to a plate surface of the substrate;

a movable electrode located away from the upper portion of the substrate by a predetermined distance to have a predetermined interval horizontal to the fixed electrode moving portion; and

a cap wafer bonded to a predetermined area of one of the fixed electrode moving portion and the movable electrode by making each of the fixed electrode moving portion and the movable electrode have a vertical offset so that one of the fixed electrode moving portion and the movable electrode moves in a direction substantially perpendicular to the plate surface of the substrate.

10. A mirror manufactured comprising a vertical offset structure comprising:

a substrate;

a fixed electrode fixing portion formed on the substrate;

a fixed electrode moving portion formed at a position away from an upper portion of the substrate by a predetermined distance;

a spring portion operable to connect the fixed electrode fixing portion and the fixed electrode moving portion to each other so that the fixed electrode moving portion moves in a direction substantially perpendicular to a plate surface of the substrate;

a movable electrode located away from the upper portion of the substrate by a predetermined distance to have a predetermined interval horizontal to the fixed electrode moving portion; and

a cap wafer bonded to a predetermined area of one of the fixed electrode moving portion and the movable electrode by making each of the fixed electrode moving portion and the movable electrode have a vertical offset so that one of the fixed electrode moving portion and the movable electrode moves in a direction substantially perpendicular to the plate surface of the substrate.

11. A method for manufacturing a vertical offset structure, the method comprising:

forming a fixed electrode fixing portion on a substrate;

forming a fixed electrode moving portion at a position away from an upper portion of the substrate by a predetermined distance;

forming a spring portion for connecting the fixed electrode fixing portion and the fixed electrode moving portion to each other so that the fixed electrode moving portion moves in a direction perpendicular to a plate surface of the substrate;

forming a movable electrode located away from the upper portion of the substrate by a predetermined distance to have a predetermined interval horizontal to the fixed electrode moving portion; and

bonding a cap wafer to a predetermined area of one of the fixed electrode moving portion and the movable electrode by making each of the fixed electrode moving portion and the movable electrode to have a vertical offset so that one of the fixed electrode moving portion and the movable electrode moves in a direction substantially perpendicular to the plate surface of the substrate.

12. A method of manufacturing a vertical operation type capacitance electrode comprising a method for manufacturing a vertical offset structure comprising:

forming a fixed electrode fixing portion on a substrate;

forming a fixed electrode moving portion at a position away from an upper portion of the substrate by a predetermined distance;

forming a spring portion for connecting the fixed electrode fixing portion and the fixed electrode moving portion to each other so that the fixed electrode moving portion moves in a direction perpendicular to a plate surface of the substrate;

forming a movable electrode located away from the upper portion of the substrate by a predetermined distance to have a predetermined interval horizontal to the fixed electrode moving portion; and

bonding a cap wafer to a predetermined area of one of the fixed electrode moving portion and the movable electrode by making each of the fixed electrode moving portion and the movable electrode to have a vertical offset so that one of the fixed electrode moving portion and the movable electrode moves in a direction substantially perpendicular to the plate surface of the substrate.

13. A method of manufacturing an accelerometer comprising a method for manufacturing a vertical offset structure comprising:

forming a fixed electrode fixing portion on a substrate;

forming a fixed electrode moving portion at a position away from an upper portion of the substrate by a predetermined distance;

forming a spring portion for connecting the fixed electrode fixing portion and the fixed electrode moving portion to each other so that the fixed electrode moving portion moves in a direction perpendicular to a plate surface of the substrate;

forming a movable electrode located away from the upper portion of the substrate by a predetermined distance to have a predetermined interval horizontal to the fixed electrode moving portion; and

bonding a cap wafer to a predetermined area of one of the fixed electrode moving portion and the movable electrode by making each of the fixed electrode moving portion and the movable electrode to have a vertical offset so that one of the fixed electrode moving portion and the movable electrode moves in a direction substantially perpendicular to the plate surface of the substrate.

14. A method of manufacturing an angular velocity system comprising a method for manufacturing a vertical offset structure comprising:

forming a fixed electrode fixing portion on a substrate;

forming a fixed electrode moving portion at a position away from an upper portion of the substrate by a predetermined distance;

forming a spring portion for connecting the fixed electrode fixing portion and the fixed electrode moving portion to each other so that the fixed electrode moving portion moves in a direction perpendicular to a plate surface of the substrate;

forming a movable electrode located away from the upper portion of the substrate by a predetermined distance to have a predetermined interval horizontal to the fixed electrode moving portion; and

bonding a cap wafer to a predetermined area of one of the fixed electrode moving portion and the movable electrode by making each of the fixed electrode moving portion and the movable electrode to have a vertical offset so that one of the fixed electrode moving portion and the movable electrode moves in a direction substantially perpendicular to the plate surface of the substrate.

15. A method of manufacturing a mirror comprising a method for manufacturing a vertical offset structure comprising:

forming a fixed electrode fixing portion on a substrate;

forming a fixed electrode moving portion at a position away from an upper portion of the substrate by a predetermined distance;

forming a spring portion for connecting the fixed electrode fixing portion and the fixed electrode moving portion to each other so that the fixed electrode moving portion moves in a direction perpendicular to a plate surface of the substrate;

forming a movable electrode located away from the upper portion of the substrate by a predetermined distance to have a predetermined interval horizontal to the fixed electrode moving portion; and

bonding a cap wafer to a predetermined area of one of the fixed electrode moving portion and the movable electrode by making each of the fixed electrode moving portion and the movable electrode to have a vertical offset so that one of the fixed electrode moving portion and the movable electrode moves in a direction substantially perpendicular to the plate surface of the substrate.