Semiconductor component and sensor component for data transmission devices

• US 7,230,309 B2
• Filed: 10/04/2004
• Issued: 06/12/2007
• Est. Priority Date: 10/02/2003
• Status: Expired due to Fees

• Current Assignee: Infineon Technologies AG
• Original Assignee: Infineon Technologies AG
• Inventors: Mahler, Joachim, Haimerl, Alfred, Schober, Wolfgang, Bauer, Michael, Engling, Thomas
• Primary Examiner(s): POTTER, ROY KARL
• Application Number:
  US10/956,087
• Publication Number:
  US 20050104149A1
• Time in Patent Office: 981 Days
• Field of Search: 257/433, 257/431, 257/432, 257/434
• US Class Current: 257/433
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48465 the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/48 Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 23/66 High-frequency adaptations
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 25/105 the devices being of a type provided for in group H01L27/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01021 Scandium [Sc]
• CPC Class Codes: H01L 2924/12043 Photo diode
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/1815 Shape
• CPC Class Codes: H01L 2924/19041 being a capacitor
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 31/0203 : Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80

Abstract

The invention relates to a semiconductor component and a sensor component with data transmission devices, for wireless transmission the semiconductor component having a main coupling element and the sensor component having a sensor coupling element. The invention affords the possibility of multiple sensor applications without direct electrical contact between sensor component and semiconductor component, which may have a logic chip.

Claims

1. A semiconductor component, comprising:

a substrate;

a semiconductor chip arranged on the substrate;

a plastic housing composition at least partially covering the substrate and the semiconductor chip;

a main coupling element for wireless transmission arranged in a region of the plastic housing composition;

an integrated circuit arranged on an active top side of the semiconductor chip and electrically connected to the main coupling element, wherein the active top side of the semiconductor chip includes an optically sensitive region arranged below an optically transparent opening in the plastic housing composition; and

external contacts electrically connected to the integrated circuit with the main coupling element.

2. The semiconductor component as claimed in claim 1, wherein the main coupling element comprises a main coupling coil.

3. The semiconductor component as claimed in claim 1, wherein the main coupling element surrounds the optically transparent opening in the plastic housing composition.

4. A semiconductor component, comprising:

a rewiring substrate having a top side and an underside;

a semiconductor chip arranged on the substrate;

a plastic housing composition at least partially covering the substrate and the semiconductor chip;

a main coupling element for wireless transmission arranged in a region of the plastic housing composition;

an integrated circuit arranged on an active top side of the semiconductor chip and electrically connected to the main coupling element; and

external contacts electrically connected to the integrated circuit with the main coupling element, the underside of the rewiring substrate being coupled to the external contacts, the rewiring substrate being covered partly by the semiconductor chip and partly by the plastic housing composition on the top side, the rewiring substrate comprising, on the top side, bonding contact pads surrounding the semiconductor chip, which are connected via the rewiring substrate to the external contacts and via bonding contact pads on the active top side of the semiconductor chip.

5. A sensor component, comprising:

a sensor chip;

a plastic housing composition partially encapsulating the sensor chip;

a sensor coupling element for wireless transmission arranged in a region of the plastic housing composition; and

a sensor region arranged on an active top side of the sensor chip and electrically connected to the sensor coupling element, wherein the sensor coupling element provides a wireless energy transmission to the sensor chip and a wireless data transmission for the sensor chip, wherein the plastic housing composition comprises a sensor opening for application of samples to the sensor region of the sensor chip.

6. The sensor component as claimed in claim 5, wherein the sensor coupling element comprises a sensor coupling coil.

7. The sensor component as claimed in claim 6, wherein the sensor coupling element surrounds the sensor opening in the plastic housing composition of the sensor component.

8. The A sensor component, comprising:

a sensor chip;

a plastic housing composition partially encapsulating the sensor chip, wherein an underside of the sensor chip includes an optically transmitting region arranged in a sensor optical system opening of the plastic housing composition on the underside of the sensor chip;

a sensor coupling element for wireless transmission arranged in a region of the plastic housing composition; and

a sensor region arranged on an active top side of the sensor chip and electrically connected to the sensor coupling element, wherein the sensor coupling element provides a wireless energy transmission to the sensor chip and a wireless data transmission for the sensor chip.

9. A sensor stack, comprising:

semiconductor component comprising;

a substrate;

a semiconductor chip arranged on the substrate;

a plastic housing composition at least partially covering the substrate and the semiconductor chip;

a main coupling element for wireless transmission arranged in a region of the plastic housing composition;

an integrated circuit arranged on an active top side of the semiconductor chip and electrically connected to the main coupling element; and

external contacts electrically connected to the integrated circuit with the main coupling element; and

a sensor component comprising;

a sensor chip;

a plastic housing composition partially encapsulating the sensor chip;

a sensor coupling element for wireless transmission arranged in a region of the plastic housing composition; and

a sensor region arranged on an active top side of the sensor chip and electrically connected to the sensor coupling element, wherein the sensor coupling element provides a wireless energy transmission to the sensor chip and a wireless data transmission for the sensor chip;

wherein the sensor component is stacked on the semiconductor component and the sensor component and semiconductor components are wirelessly coupled via the main coupling element and the sensor coupling element, the main coupling element supplying the sensor chip with energy via the sensor coupling element.

10. The sensor stack as claimed in claim 9, wherein a plurality of sensor components with sensor chip and sensor coupling element are arranged next to one another on the semiconductor component above the main coupling element.