Integrated circuit package with laminated power cell having coplanar electrode

• US 7,230,321 B2
• Filed: 10/13/2003
• Issued: 06/12/2007
• Est. Priority Date: 10/13/2003
• Status: Expired due to Fees

• Current Assignee: Joseph Samaha
• Original Assignee: Joseph Samaha
• Inventors: McCain, Joseph
• Primary Examiner(s): Whitehead, Jr.; Carl
• Assistant Examiner(s): MITCHELL, JAMES M
• Application Number:
  US10/685,825
• Publication Number:
  US 20050077604A1
• Time in Patent Office: 1,338 Days
• Field of Search: 257/666, 257/691, 257/929, 438/19
• US Class Current: 257/666
• CPC Class Codes: H01L 2224/05554 being square
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48237 connecting the wire to a die pad of the item
• CPC Class Codes: H01L 2224/49171 Fan-out arrangements
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 23/58 Structural electrical arrangements for semiconductor devices not otherwise provided for , e.g. in combination with batteries H01L23/49593, H01L23/49596 take precedence
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 24/49 of a plurality of wire connectors
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01079 Gold [Au]
• CPC Class Codes: H01L 2924/12042 LASER
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/181 Encapsulation
• CPC Class Codes: H01L 2924/207 Diameter ranges

Abstract

An electrode that includes an electrically conductive, substantially planar body having a first thickness and a junction area, wherein the junction area is configured to receive a solid state power cell having a second thickness. The electrode also includes an arcuate terminal electrically coupled to the body and configured to position a wire bond terminus at a perpendicular distance from the body, the distance being not substantially less than the sum of the first and second thicknesses.

Claims

1. An integrated circuit package, comprising:

a lead frame assembly including a central support member and a plurality of conductive leads, wherein the central support member has opposing first and second major surfaces, and wherein the plurality of conductive leads are radially disposed about the periphery of the central support member;

an integrated circuit die coupled to the first surface of the central support member and having a plurality of bond pads;

a power cell coupled to the second surface of the central support member and comprising a cathode layer, an anode layer, and a separator layer interposing the cathode and anode layers, wherein the cathode layer is doped with a first impurity type and the anode layer is doped with a second, opposite impurity type, wherein the first and second impurity types are selected from an n-type impurity and a p-type impurity, wherein the cathode layer includes manganese dioxide doped with the first impurity type, wherein the separator layer includes lithium perchlorate, and wherein the anode layer includes lithium doped with the second impurity type;

an electrode including a planar body and a terminal extending from the body, wherein the body is coupled to the power cell opposite the central support member;

a plurality of first wire bonds each coupling one of the plurality of bond pads and one of the plurality of conductive leads; and

a second wire bond having a first terminus coupled to one of the plurality of bond pads and a second terminus coupled to the tenninal of the electrode, wherein the terminal has an arcuate shape configured to position the second terminus of the second wire bond in a reference plane that is coincident with the first surface of the central support member.

2. The package of claim 1 further comprising a laminated insulating layer substantially covering surfaces of the body and the terminal that are opposite the power cell.

3. The package of claim 2 wherein the insulating layer comprises one of a paper material and a polyester film material.

4. The package of claim 1 wherein the body and the terminal each comprise at least one of copper and nickel.

5. The package of claim 1 further comprising an electrical conduction enhancement material coating at least a portion of the electrode, wherein the electrical conduction enhancement material comprises graphite.

6. The package of claim 5 wherein the electrical conduction enhancement material is one of a graphite based, air-curable material and a graphite based, heat-curable material.

7. The package of claim 1 further comprising an insulating layer encapsulating the central support member, the integrated circuit die, the power cell, the electrode, the plurality of first wire bonds, and the second wire bond, collectively.

8. The package of claim 1 wherein the power cell further comprises a frame adjacent and extending along the perimeter of each of the cathode layer, the anode layer, and the separator layer, wherein the frame substantially comprises an insulating material.

9. The package of claim 1 wherein the power cell further comprises a frame adjacent and extending along the perimeter of each of the cathode layer, the anode layer, and the separator layer, wherein the frame is open at opposing first and second ends, the first end exposing the anode layer, and the second end exposing the cathode layer.

10. An integrated circuit package, comprising:

a conventional lead frame having an industry-standard geometry and composition and including;

a central support member;

a plurality of formable, flexible metal leads that extend radially around the periphery of the central support member to a plurality of connectors; and

a conductive coating located on the central support member;

a laminated, solid polymer, rechargeable power cell having a thickness ranging between about 500 microns and about 1000 microns, the power cell including a plurality of laminated layers and a four-sided, open-ended carrier structure surrounding the plurality of laminated layers, wherein the plurality of laminated layers includes;

a cathode layer impregnated with conductivity-enhancing impurities and having a thickness ranging between about 300 microns and about 750 microns;

an anode layer comprising a lithium-impregnated metal and having a thickness ranging between about 30 microns and about 100 microns; and

a solid electrolyte separator interposing the cathode layer and the anode layer and comprising lithium perchlorate and polyvinylidene (LiClO₄-PVDF);

wherein a first one of the cathode layer and the anode layer is coupled to a first major surface of the central support member;

an integrated circuit die having a plurality of bond pads and coupled to a second major surface of the central support member opposite the power cell;

an electrode including;

a substantially planar body having a thickness ranging between about 500 microns and about 1000 microns, a width ranging between about 7,500 microns and about 10,000 microns, and a length ranging between about 7,500 microns and about 10,000 microns, wherein a second one of the cathode layer and the anode layer is coupled to the body;

a terminal integral to the body;

a conductive coating located on a first side of the body and a first side of the terminal; and

an insulating layer located on a second side of the body and a second side of the terminal, wherein the second side of the body is opposite the first side of the body, and wherein the second side of the terminal is opposite the first side of the terminal;

a plurality of first wire bonds coupling ones of the leads to corresponding ones of the plurality of bond pads;

a second wire bond coupling one of the plurality of bond pads to the terminal, whereby an arcuate shape of the terminal positions a terminus of the second wire bond in a reference plane that is substantially coincident with a surface interface between the central support member and the integrated circuit die; and

an insulating layer encapsulating the electrode, the power cell, the central support member, the integrated circuit die, the plurality of first wire bonds, and the second wire bond.