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Post passivation interconnection schemes on top of the IC chips

  • US 7,230,340 B2
  • Filed: 10/15/2003
  • Issued: 06/12/2007
  • Est. Priority Date: 10/18/2000
  • Status: Expired due to Term
First Claim
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1. A circuitry component comprising:

  • a semiconductor substrate;

    an internal circuit in or on said semiconductor substrate;

    a first intra-chip driver or receiver in or on said semiconductor substrate and connected to said internal circuit;

    a second intra-chip driver or receiver in or on said semiconductor substrate;

    a first metallization structure over said semiconductor substrate;

    a passivation layer over said first metallization structure; and

    a second metallization structure over said passivation layer, wherein said first and second metallization structures connect said first intra-chip driver or receiver and said second intra-chip driver or receiver.

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