Cooled electronic assembly and method for cooling a printed circuit board
First Claim
1. A cooled electronic assembly comprising:
- a) a printed circuit board;
b) a flip chip electrically connected to the printed circuit board and including a first coolant channel;
c) a liquid pump electrically connected to the printed circuit board;
d) a molding material molded to the flip chip, to the liquid pump, and to the printed circuit board;
e) a heat exchanger; and
f) a cover having a second coolant channel fluidly connected to the heat exchanger, wherein the cover is attached to the molding material, wherein the first coolant channel, the heat exchanger, and the second coolant channel together at least partially define a closed coolant circuit, and wherein the liquid pump is operatively connected to the closed coolant circuit.
2 Assignments
0 Petitions
Accused Products
Abstract
A cooled electronic assembly includes an integrated-circuit device carrier (such as a printed circuit board), a device (such as a flip chip), a liquid pump, a molding material, a heat exchanger, and a cover. The device and the liquid pump are electrically connected to the integrated-circuit device carrier. The molding material is molded to the device, to the liquid pump, and to the integrated-circuit device carrier. The cover has a coolant channel fluidly connected to the heat exchanger, wherein the cover is attached to the molding material. The coolant channel and the heat exchanger together at least partially define a closed coolant circuit. The liquid pump is operatively connected to the closed coolant circuit. A method for cooling a printed circuit board includes placing a liquid coolant in the closed coolant circuit and electrically activating the liquid pump through the printed circuit board.
24 Citations
20 Claims
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1. A cooled electronic assembly comprising:
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a) a printed circuit board; b) a flip chip electrically connected to the printed circuit board and including a first coolant channel; c) a liquid pump electrically connected to the printed circuit board; d) a molding material molded to the flip chip, to the liquid pump, and to the printed circuit board; e) a heat exchanger; and f) a cover having a second coolant channel fluidly connected to the heat exchanger, wherein the cover is attached to the molding material, wherein the first coolant channel, the heat exchanger, and the second coolant channel together at least partially define a closed coolant circuit, and wherein the liquid pump is operatively connected to the closed coolant circuit. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A method for cooling a printed circuit board comprising the steps of:
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a) electrically connecting a flip chip to the printed circuit board, wherein the flip chip includes a first coolant channel; b) electrically connecting a liquid pump to the printed circuit board; c) molding a molding material to the flip chip, to the liquid pump, and to the printed circuit board; d) attaching a cover to the molding material, wherein the cover has a second coolant channel fluidly connected to a heat exchanger, wherein the first coolant channel, the heat exchanger, and the second coolant channel together at least partially define a closed coolant circuit, and wherein the liquid pump is operatively connected to the closed coolant circuit; e) disposing a liquid coolant in the closed coolant circuit; and f) electrically activating the liquid pump through the printed circuit board. - View Dependent Claims (11)
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12. A cooled electronic assembly comprising:
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a) an integrated-circuit device carrier; b) a device electrically connected to the integrated-circuit device carrier; c) a liquid pump electrically connected to the integrated-circuit device carrier; d) a molding material molded to the device, to the liquid pump, and to the integrated-circuit device carrier; e) a heat exchanger; and f) a cover having a coolant channel fluidly connected to the heat exchanger, wherein the cover is attached to the molding material, wherein the heat exchanger and the coolant channel together at least partially define a closed coolant circuit, and wherein the liquid pump is operatively connected to the closed coolant circuit. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20)
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Specification