Method and apparatus for simultaneously cleaning the front side and back side of a wafer

• US 7,231,682 B1
• Filed: 08/28/2003
• Issued: 06/19/2007
• Est. Priority Date: 08/28/2003
• Status: Expired due to Fees

• Current Assignee: Lam Research Corporation
• Original Assignee: Lam Research Corporation
• Inventors: Redeker, Fred C., Boyd, John M., Mikhaylich, Katrina
• Primary Examiner(s): Spisich; Mark
• Application Number:
  US10/652,648
• Time in Patent Office: 1,391 Days
• Field of Search: 15/77, 15/882, 15/883, 151/02
• US Class Current: 15/77
• CPC Class Codes: B08B 3/12 by sonic or ultrasonic vibrations washing or rinsing machines for crockery or tableware using sonic or ultrasonic waves A47L15/13; of natural teeth, of prostheses using ultrasonic techniques similar to those used for natural teeth A61C17/20; application of ultrasonic vibrations to chemical, physical or physico-chemical processes in general B01J19/10
• CPC Class Codes: H01L 21/67046 using mainly scrubbing means, e.g. brushes
• CPC Class Codes: H01L 21/67051 using mainly spraying means, e.g. nozzles
• CPC Class Codes: H01L 21/67057 with the semiconductor substrates being dipped in baths or vessels

Abstract

A method for cleaning a semiconductor substrate is provided. The method initiates with transferring the semiconductor substrate into a chamber. Then, a first side of the semiconductor substrate is cleaned according to a first cleaning technique. A second side of the semiconductor substrate is simultaneously cleaned according to a second cleaning technique. The semiconductor substrate is then transferred from the chamber. A system and apparatus for simultaneously cleaning opposing sides of a semiconductor substrate are also provided.

Claims

1. A system for cleaning a semiconductor substrate, comprising:

a chamber configured to support the semiconductor substrate, the chamber including,

an acoustic energy cleaning tool configured to be applied to a feature side of the semiconductor substrate, the acoustic energy cleaning tool having a first annular inlet for delivering a first fluid to the feature side surface, a second annular inlet defined around the first annular inlet for delivering a second fluid to the feature side surface and an annular outlet defined between the first annular inlet and the second annular inlet, the annular outlet configured to remove the first fluid and the second fluid, thereby causing a meniscus to form over a source of acoustic energy disposed within the feature side cleaning tool;

a brush cleaning tool configured to be applied to a non-feature side of the semiconductor substrate while the feature side is being cleaned; and

a fluid delivery system capable of applying a feature side fluid to the feature side and a non-feature side fluid to the non-feature side.

2. The system of claim 1, wherein the acoustic energy cleaning tool is a megasonic energy cleaning tool having a resonator coupled to the feature side through the first fluid.

3. The system of claim 1, wherein the acoustic energy cleaning tool and the brush cleaning tool simultaneously clean the corresponding feature side and non-feature side.

4. The system of claim 1, wherein the feature side is placed face up within the chamber.

5. The system of claim 4, wherein the acoustic energy cleaning tool is coupled to a surface of the feature side through the meniscus formed between the acoustic energy cleaning tool and the first fluid.

6. The apparatus of claim 1, wherein the first annular inlet applies a cleaning fluid to the feature side surface and the second annular inlet provides a retaining fluid to the feature side surface to maintain the cleaning fluid within a region defined below the first annular inlet.

7. An apparatus capable of simultaneously applying different cleaning schemes to a feature side surface and a backside surface of a semiconductor substrate, the apparatus configured to support the semiconductor substrate with the feature side surface oriented face-up, the apparatus comprising:

a chamber housing a feature side cleaning tool and a backside cleaning tool, the feature side cleaning tool configured to transfer megasonic energy to the feature side surface through a fluid disposed on the feature side surface, the backside cleaning tool configured to scrub the backside surface with a brush, wherein the feature side cleaning tool includes a first annular inlet for delivering a first fluid to the feature side surface, a second annular inlet defined around the first annular inlet for delivering a second fluid to the feature side surface and an annular outlet defined between the first annular inlet and the second annular inlet, the annular outlet configured to remove the first fluid and the second fluid, thereby causing a meniscus to form over a source of acoustic energy disposed within the feature side cleaning tool.

8. The apparatus of claim 7, wherein the brush is configured to rotate the semiconductor substrate and the feature side cleaning tool is configured to move radially above the feature side surface.

9. The apparatus of claim 7, wherein the chamber further comprises:

a feature side fluid delivery line capable of delivering a feature side fluid to the feature side surface; and

a back side fluid delivery line capable of delivering a back side fluid to the backside surface.

10. The apparatus of claim 9, wherein the back side fluid delivery line is integrated within the brush.

11. The apparatus of claim 7, wherein the feature side cleaning tool is further configured to provide localized heating to elevate a temperature of the fluid in contact with a bottom surface of the feature side cleaning tool while propagating the megasonic energy through the fluid to the feature side of the semiconductor substrate.

12. The apparatus of claim 7, wherein the chamber includes rollers for supporting the semiconductor substrate.

13. The apparatus of claim 12, wherein one of the rollers is a bevel edge cleaner configured to remove material deposited proximate to an edge of the semiconductor substrate.

14. The apparatus of claim 7, wherein the first annular inlet applies a cleaning fluid to the feature side surface and the second annular inlet provides a retaining fluid to the feature side surface to maintain the cleaning fluid within a region defined below the first annular inlet.