Hybrid impact sensor

• US 7,231,803 B2
• Filed: 11/08/2004
• Issued: 06/19/2007
• Est. Priority Date: 06/11/2004
• Status: Expired due to Fees

• Current Assignee: Robert Bosch Corporation (Robert Bosch GmbH), Robert Bosch GmbH
• Original Assignee: Robert Bosch GmbH
• Inventors: Stuetzler, Frank-Juergen
• Primary Examiner(s): NOORI, MAX H
• Application Number:
  US10/983,547
• Publication Number:
  US 20050274168A1
• Time in Patent Office: 953 Days
• Field of Search: 73 1201- 1209, 738/622.6
• US Class Current: 73/12.01
• CPC Class Codes: B60R 21/0136 responsive to actual contact with an obstacle , e.g. to vehicle deformation, bumper displacement or bumper velocity relative to the vehicle monitoring crash strength in combination with passenger seat detection B60R21/01558

Abstract

A hybrid impact sensor and method of operating the same. One sensor includes a support containing one or more mounts; a first sensor with first sensing properties and configured to generate a first output signal; a second sensor with second sensing properties and configured to generate a second output signal, wherein the second sensing properties are different from the first sensing properties; and a housing encasing the first sensor and the second sensor.

Claims

1. A hybrid impact sensor system comprising:

a control unit; and

a sensor module, the sensor module including

a first sensor with first sensing properties and configured to generate a first output signal, wherein the first sensor includes at least one of a sensor including a semiconductor element containing a plurality of piezoresistors, wherein each piezoresistor has an impedance and input and output terminals, and a circuit configured to be coupled to the input and output terminals of the plurality of piezoresistors and capable of sensing the impedance of the plurality of piezoresistors;

a magnetostrictive sensor; and

an acoustic wave sensor;

a second sensor with second sensing properties, mounted directly to the first sensor, and configured to generate a second output signal, wherein the second sensing properties are different from the first sensing properties and wherein the second sensor includes at least one of an acceleration sensor and a pressure sensor;

an electrical connector coupled to the first sensor, the second sensor, and the control unit and configured to transmit the first output signal and the second output signal to the control unit;

a housing encasing the first sensor and the second sensor and at least a portion of the electrical connector; and

one or more mounts,

the control unit positioned outside the housing.

2. A hybrid impact sensor as claimed in claim 1, wherein the second sensor includes a pressure sensor and is configured to detect pressure within a vehicle door cavity.

3. A hybrid impact sensor as claimed in claim 1, wherein the electrical connector is further configured to provide at least one of amplification and filtering to the first output signal and the second output signal in order to improve the characteristics of the first output signal and the second output signal before transmitting the first output signal and the second output signal to the control unit.

4. A hybrid impact sensor as claimed in claim 1, wherein the one or more mounts are configured to be attached to a component of a vehicle.

5. A hybrid impact sensor as claimed in claim 1, further comprising potting material.

6. A hybrid impact sensor as claimed in claim 1, further comprising a support.

7. A hybrid impact sensor as claimed in claim 6, wherein the first sensor is attached to the support.

8. A hybrid impact sensor as claimed in claim 6, wherein the second sensor is attached to the support.

9. A hybrid impact sensor as claimed in claim 6, wherein the one or more mounts are located at ends of the support.

10. A hybrid impact sensor as claimed in claim 1, wherein the second sensor includes a pressure sensor and the housing includes an opening for the second sensor.

11. A method of sensing impact to a structure, the method comprising:

providing a control unit;

providing a sensor module, the sensor module including

a first sensor of a first sensing type, wherein the first sensor includes at least one of a sensor including a semiconductor element containing a plurality of piezoresistors, wherein each piezoresistor has an impedance and input and output terminals, and a circuit configured to be coupled to the input and output terminals of the plurality of piezoresistors and capable of sensing the impedance of the plurality of piezoresistors;

a magnetostrictive sensor; and

an acoustic wave sensor;

a second sensor of a second sensing type mounted directly to the first sensor, wherein the second sensing type is different from the first sensing type and wherein the second sensor includes at least one of an acceleration sensor and a pressure sensor;

an electrical connector coupled to the first sensor, the second sensor, and the control unit and configured to transmit the first output signal and the second output signal to the control unit;

a housing encasing the first sensor and the second sensor and at least a portion of the electrical connector; and

one or more mounts;

positioning the control unit outside the housing;

generating a first output signal; and

generating a second output signal.

12. A method as claimed in claim 11, further comprising providing at least one of amplification and filtering to the first output signal and the second output signal with the electrical connector in order to improve the characteristics of the first output signal and the second output signal before transmitting the first output signal and the second output signal to the control unit.

13. A method as claimed in claim 11, further comprising attaching the one or more mounts to a component of a vehicle.

14. A method as claimed in claim 11, further comprising filling the housing with potting material.

15. A method as claimed in claim 11, further comprising providing a support.

16. A method as claimed in claim 15, further comprising attaching the first sensor to the support.

17. A method as claimed in claim 11, further comprising attaching the second sensor to the support.

18. A method as claimed in claim 15, further comprising placing the one or more mounts at ends of the support.

19. A method as claimed in claim 11, further comprising providing an opening in the housing, wherein the second sensor includes a pressure sensor.

20. A method as claimed in claim 11, further comprising detecting pressure within a vehicle door cavity, wherein the second sensor includes a pressure sensor.

21. A hybrid impact sensor comprising:

a support containing one or more mounts;

a semiconductor element mounted to the support between the one or more mounts and containing a plurality of piezoresistors each piezoresistor having an impedance and input and output terminals, the plurality of piezoresistors including sensing piezoresistors and reference piezoresistors, each of the sensing piezoresistors having a non-strained impedance that is different than a non-strained impedance of each of the reference piezoresistors;

a circuit configured to be coupled to the input and output terminals of the plurality of piezoresistors and capable of sensing the impedance of the plurality of piezoresistors; and

a pressure sensor configured to generate a pressure signal.

22. A hybrid impact sensor as claimed in claim 21, wherein the support is configured to receive stress waves.

23. A hybrid impact sensor as claimed in claim 21, wherein the semiconductor element is configured to be mounted along an entire surface of the support such that stress waves that travel through the support distort the semiconductor element.

24. A hybrid impact sensor as claimed in claim 21, wherein the one or more mounts of the support are located at ends of the support.

25. A hybrid impact sensor as claimed in claim 21, wherein the one or more mounts of the support are configured to be attached to a component requiring stress wave sensing.

26. A hybrid impact sensor as claimed in claim 25, wherein the one or more mounts of the support are configured to allow stress waves traveling through the component to also travel through the support.

27. A hybrid impact sensor as claimed in claim 21, wherein the circuit is configured to be mounted on a printed circuit board.

28. A hybrid impact sensor as claimed in claim 27, wherein the pressure sensor is attached to the printed circuit board.

29. A hybrid impact sensor as claimed in claim 21, further comprising a connector configured to be coupled to at least one of the circuit, the pressure sensor, and a control unit.

30. A hybrid impact sensor as claimed in claim 29, wherein the connector is further configured to output at least one of the pressure signal and the impedance to a control unit.

31. A hybrid impact sensor as claimed in claim 21, wherein the pressure sensor is configured to detect pressures changes within a door cavity of a vehicle.

32. A hybrid impact sensor as claimed in claim 21, further comprising a housing.

33. A hybrid impact sensor as claimed in claim 32, wherein the housing includes an opening for the pressure sensor.

34. A hybrid impact sensor as claimed in claim 21, wherein the pressure sensor is attached to the support.

35. A method for sensing impact to a structure, the method comprising:

providing a support with one or more mounts;

attaching a semiconductor element containing a plurality of piezoresistors to the support, each of the semiconductor elements having an impedance and input and output terminals, the plurality of piezoresistors including sensing piezoresistors and reference piezoresistors, each of the sensing piezoresistors having a non-strained impedance that is different than a non-strained impedance of each of the reference piezoresistors;

providing a circuit configured to be coupled to the input and output terminals of the plurality of piezoresistors and capable of sensing the impedance of the plurality of piezoresistors;

connecting the support to the structure with the one or more mounts of the support;

providing a pressure sensor configured to generate a pressure signal;

encasing the support and the pressure sensor in a housing;

sensing the impedance of the plurality of piezoresistors;

and sensing the pressure signal.

36. A method as claimed in claim 35, further comprising attaching the semiconductor element along an entire surface of the support such that stress waves that travel through the support distort the semiconductor element.

37. A method as claimed in claim 35, further comprising mounting the circuit on a printed circuit board.

38. A method as claimed in claim 37, further comprising mounting the pressure sensor on the printed circuit board.

39. A method as claimed in claim 35, further comprising transmitting at least one of the impedance and pressure signal to a control unit.

40. A method as claimed in claim 35, further comprising attaching the pressure sensor to the support.

41. A method as claimed in claim 35, further comprising detecting pressure within a door cavity of a vehicle.

42. A method as claimed in claim 35, further comprising providing an opening in the housing for the pressure sensor.

43. A hybrid impact sensor comprising:

a support containing one or more mounts;

a semiconductor element mounted to the support between the one or more mounts and containing a plurality of piezoresistors, each piezoresistor having input and output terminals, the plurality of piezoresistors including sensing piezoresistors and reference piezoresistors, each of the sensing piezoresistors having a non-strained impedance that is different than a non-strained impedance of each of the reference piezoresistors;

a circuit configured to be coupled to the input and output terminals of the plurality of piezoresistors and capable of sensing the impedance of the plurality of piezoresistors; and

an acceleration sensor configured to generate an acceleration signal.

44. A hybrid impact sensor as claimed in claim 43, wherein the support is configured to receive stress waves.

45. A hybrid impact sensor as claimed in claim 43, wherein the semiconductor element is configured to be mounted along an entire surface of the support such that stress waves that travel through the support distort the semiconductor element.

46. A hybrid impact sensor as claimed in claim 43, wherein the one or more mounts of the support are located at ends of the support.

47. A hybrid impact sensor as claimed in claim 43, wherein the one or more mounts of the support are configured to be attached to a component requiring stress wave sensing.

48. A hybrid impact sensor as claimed in claim 47, wherein the one or more mounts of the support are configured to allow stress waves traveling through the component to also travel through the support.

49. A hybrid impact sensor as claimed in claim 43, wherein the circuit is configured to be mounted on a printed circuit board.

50. A hybrid impact sensor as claimed in claim 49, wherein the acceleration sensor is attached to the printed circuit board.

51. A hybrid impact sensor as claimed in claim 43, further comprising a connector configured to be coupled to at least one of the circuit, the acceleration sensor, and a control unit.

52. A hybrid impact sensor as claimed in claim 51, wherein the connector is further configured to output at least one of the impedance and the acceleration signal to the control unit.

53. A hybrid impact sensor as claimed in claim 43, further comprising a housing.

54. A hybrid impact sensor as claimed in claim 43, wherein the acceleration sensor is attached to the support.

55. A method for sensing impact to a structure, the method comprising:

providing a support with one or more mounts;

attaching a semiconductor element containing a plurality of piezoresistors to the support, each piezoresistor having input and output terminals, the plurality of piezoresistors including sensing piezoresistors and reference piezoresistors, each of the sensing piezoresistors having a non-strained impedance that is different than a non-strained impedance of each of the reference piezoresistors;

providing a circuit configured to be coupled to the input and output terminals of the plurality of piezoresistors and capable of sensing the impedance of the plurality of piezoresistors;

connecting the support to the structure with the one or more mounts of the support;

providing an acceleration sensor configured to generate an acceleration signal;

encasing the support and the acceleration sensor in a housing;

sensing the impedance of the plurality of piezoresistors; and

sensing the acceleration signal.

56. A method as claimed in claim 55, further comprising attaching the semiconductor element along an entire surface of the support such that stress waves that travel through the support distort the semiconductor element.

57. A method as claimed in claim 55, further comprising mounting the circuit on a printed circuit board.

58. A method as claimed in claim 57, further comprising mounting the acceleration sensor to the printed circuit board.

59. A method as claimed in claim 55, further comprising transmitting at least one of the impedance and the acceleration signal to a control unit.

60. A method as claimed in claim 55, further comprising attaching the acceleration sensor to the support.