Connection structure for printed wiring board

• US 7,232,315 B2
• Filed: 04/23/2004
• Issued: 06/19/2007
• Est. Priority Date: 04/30/2003
• Status: Expired due to Fees

• Current Assignee: JST Manufacturing Company Limited
• Original Assignee: JST Manufacturing Company Limited
• Inventors: Uchida, Shinji, Funakoshi, Akihito, Kajimoto, Junya
• Primary Examiner(s): Zarroli; Michael C.
• Application Number:
  US10/554,744
• Publication Number:
  US 20060286858A1
• Time in Patent Office: 1,152 Days
• Field of Search: 439/67, 439/55, 439/492
• US Class Current: 439/67
• CPC Class Codes: H01R 12/721 cooperating directly with the edge of the rigid printed circuits
• CPC Class Codes: H01R 12/774 Retainers
• CPC Class Codes: H01R 12/79 connecting to rigid printed circuits or like structures
• CPC Class Codes: H05K 2201/0367 Metallic bump or raised conductor not used as solder bump solder materials or compositions and methods of application thereof H05K3/3457
• CPC Class Codes: H05K 2201/09163 Slotted edge
• CPC Class Codes: H05K 2201/09481 Via in pad; Pad over filled via if used for surface mounting H05K1/113
• CPC Class Codes: H05K 3/365 by abutting, i.e. without alloying process

Abstract

A connection structure for a printed wiring board which enables high density integration is provided. A FCP 2 includes an exposed conductor part 2A including an insulating substrate 22 and a reinforcing plate 24 stacked with this substrate 22 via an elastic member 23. In the exposed conductor part 2A, conductors 21 each having a protrusion 20 formed on a surface is placed on the insulating substrate. The exposed conductor part 2A can be elastically deformed in the thickness direction in which the substrate 22, the reinforcing plate 24 and the like are stacked. A printed wiring board 1 is constructed by stacking an inner layer board 10 and a first outer layer board 11 and a second outer layer board 12 which sandwich this inner layer board 10. A notched groove 10A is formed on the inner layer board 10, and an insertion opening 10B is formed. Through-hole ports 11 which appear on the notched groove 10A side is placed on the first outer layer board. When the FPC 2 is inserted into the insertion opening 10B, the protrusion 20 of the FPC 2 fits with the through-hole port 11A from within insertion opening 10B and presses thereto.

Claims

1. A connection structure for a printed wiring board for electrically connecting a FPC and a printed wiring which is electrically connected to this FPC, wherein:

said FPC comprises a board-shaped substrate and has an exposed conductor part which can be elastically deformed in the thickness direction;

said exposed conductor part has an exposed surface on a surface of said substrate onto which a plurality of conductors is placed;

said conductor comprises a protrusion on a surface which protrudes from said substrate;

said printed wiring board is formed by stacking a plurality of base plates and comprises an insertion opening into which said FPC is inserted in an edge surface parallel to the stacking direction of said base plates and a plurality of through-hole ports provided on an inner wall surface of said insertion opening; and

said protrusions of said FPC is connected to said through-hole port of said insertion opening and pressed thereto when said FPC is inserted into said insertion opening of said printed wiring board.

2. The connection structure for a printed wiring board according to claim 1, wherein said exposed conductor part of said FPC comprises a board-shaped substrate formed from an insulating material and a reinforcing plate which is stacked with this board-shaped substrate with an elastic member sandwiched in between.

3. The connection structure for a printed wiring board according to claim 1, wherein:

said exposed conductor part of said FPC comprises a board-shaped substrate formed from an insulating material and an elastic reinforcing plate stacked in close contact to this substrate, is bent in the thickness direction which is the direction in which said substrate and said elastic reinforcing plate are stacked to form a crease perpendicular to this thickness direction; and

said conductor is arranged in alignment along this crease.

5. A connection structure for a printed wiring board according to claim 1, wherein:

said printed wiring board comprises a first outer layer board, a second outer layer board, and an inner layer board which is placed between said first outer layer board and said second outer layer board;

a notched groove into which said exposed conductor part of said FPC is inserted is formed on said inner layer board;

said first outer layer board comprises a plurality of through-hole ports which penetrate said first outer board, and

said insertion opening is formed on an edge surface parallel to the stacked direction in which said first outer layer board, said second outer layer board, and said inner layer board are stacked.

6. The connection structure for a printed wiring board according to claim 1, wherein:

said protrusions protrude spherically.

7. The connection structure for a printed wiring board according to claim 1, wherein:

said protrusions protrude in a pyramid-shape.

8. The connection structure for a printed wiring board according to claim 6, wherein:

said protrusions are aligned in a row.

9. The connection structure for a printed wiring board according to claim 5, wherein:

said inner layer board is formed in said printed wiring board from insulating plate;

said first outer layer board and said second outer layer board are double-sided copper-clad laminating sheets onto which wire patterns are formed; and

said inner layer board, said first outer layer board, and said second outer layer board are stacked and connected sterically in the thickness direction by solder plating method.

10. The connection structure for a printed wiring board according to claim 9, wherein:

a wiring pattern is formed respectively on double-sided copper-clad laminated sheets in said first outer layer board and said second outer layer board in said printed wiring board; and

a prepreg and a copper foil are further stacked between said first outer layer board and said second outer layer board and are connected sterically in the thickness direction by solder plating method.

11. The connection structure for a printed wiring board according to claim 9, wherein:

a plurality of through-hole ports are exposed on said notched groove formed on said printed wiring board, and a plurality of line patterns parallel to the direction in which said FPC is inserted extends from said through-hole ports to an outer edge part of said multilayer printed wiring board, in these through-hole ports; and

hard plating is applied onto said plurality of line patterns.

4. A connection structure for a printed wiring board for electrically connecting a FPC and a printed wiring which is electrically connected to this FPC, wherein:

said FPC has an exposed conductor part comprising a board-shaped substrate formed from insulating material and a reinforcing plate which is stacked in close contact with this substrate;

said exposed conductor part has an exposed surface on a surface of said substrate onto which a plurality of conductors are placed and is inserted into the printed wiring board by contacting an insertion jig closely to said reinforcing plate and;

said conductor comprises a protrusion on a surface which protrudes from said substrate;

said insertion jig comprises a lead part which is inserted into said printed wiring board and a locking part for locking said FPC;

said lead part is formed from an elastic material having the same width as said exposed conductor part of said FPC, is bent in the thickness direction which is the direction said substrate and said reinforcing plate of said exposed conductor part is stacked to form a crease which extends in the direction perpendicular to the thickness direction;

said locking part comprises a pair of locking pieces for locking said FPC;

said printed wiring board is formed by stacking a plurality of base plates and comprises an insertion opening into which said FPC is inserted on an edge surface parallel to the stacking direction of said baseplates and a plurality of through-hole ports provided on an inner wall of this insertion opening; and

said protrusion of said FPC is connected to said through-hole port of said insertion opening and pressed thereto when said FPC is inserted into said insertion opening of said printed wiring board.