Method of making cascaded die mountings with springs-loaded contact-bond options
First Claim
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1. A method for interconnecting and mounting electronic components comprising the steps of;
- assembling at least three cascaded layers of electronic components, wherein said cascaded layers further compromise at least one conducting plate and at least one of said electronic components disposed on said conducting plate;
said conducting plate further compromising a metal and a thermal expansion controlling material,providing a means for electrically interconnecting said layers at contact points,providing a means for connecting input power to said device,providing a means for connecting output power to said device,modifying said input power with said electronic components to produce said output power, andcooling said components by direct refrigerant contact.
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Abstract
A cascaded die mounting device and method using spring contacts for die attachment, with or without metallic bonds between the contacts and the dies, is disclosed. One embodiment is for the direct refrigerant cooling of an inverter/converter carrying higher power levels than most of the low power circuits previously taught, and does not require using a heat sink.
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Citations
14 Claims
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1. A method for interconnecting and mounting electronic components comprising the steps of;
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assembling at least three cascaded layers of electronic components, wherein said cascaded layers further compromise at least one conducting plate and at least one of said electronic components disposed on said conducting plate;
said conducting plate further compromising a metal and a thermal expansion controlling material,providing a means for electrically interconnecting said layers at contact points, providing a means for connecting input power to said device, providing a means for connecting output power to said device, modifying said input power with said electronic components to produce said output power, and cooling said components by direct refrigerant contact. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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Specification