Method for implanting dopants within a substrate by tilting the substrate relative to the implant source
First Claim
1. A method for implanting a dopant in a substrate, comprising:
- tilting a substrate located on or over an implant platen about an axis in a first direction with respect to an implant source, wherein the substrate has one or more patterned gate structures located thereover;
implanting a portion of an implant dose within the substrate and below the one or more patterned gate structures, the substrate tilted in the first direction;
tilting the substrate having already been tilted in the first direction about the axis in a second opposite direction;
implanting at least a portion of the implant dose within the substrate and below the one or more patterned gate structures, the substrate tilted in the second opposite direction;
rotating the substrate by about 90 degrees from its original position after implanting at least a portion of the implant dose within the substrate tilted in the second opposite direction;
tilting the rotated substrate about the axis a second time in the first direction;
implanting a portion of the implant dose within the substrate and below the one or more patterned gate structures, the substrate tilted in the first direction the second time;
tilting the substrate having already been tilted a second time in the first direction about the axis a second time in the second opposite direction; and
implanting a remaining portion of the implant dose within the substrate and below the one or more patterned gate structures, the substrate tilted in the second opposite direction the second time.
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Abstract
The present invention provides a method for implanting a dopant in a substrate and a method for manufacturing a semiconductor device. The method for implanting a dopant, among other steps, including tilting a substrate (310) located on or over an implant platen (305) about an axis in a first direction with respect to an implant source (320) and implanting a portion of an implant dose within the substrate (310) tilted in the first direction. The method further includes tilting the substrate (310) having already been tilted in the first direction about the axis in a second opposite direction, and implanting at least a portion of the implant dose within the substrate (310) tilted in the second opposite direction.
14 Citations
20 Claims
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1. A method for implanting a dopant in a substrate, comprising:
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tilting a substrate located on or over an implant platen about an axis in a first direction with respect to an implant source, wherein the substrate has one or more patterned gate structures located thereover; implanting a portion of an implant dose within the substrate and below the one or more patterned gate structures, the substrate tilted in the first direction; tilting the substrate having already been tilted in the first direction about the axis in a second opposite direction; implanting at least a portion of the implant dose within the substrate and below the one or more patterned gate structures, the substrate tilted in the second opposite direction; rotating the substrate by about 90 degrees from its original position after implanting at least a portion of the implant dose within the substrate tilted in the second opposite direction; tilting the rotated substrate about the axis a second time in the first direction; implanting a portion of the implant dose within the substrate and below the one or more patterned gate structures, the substrate tilted in the first direction the second time; tilting the substrate having already been tilted a second time in the first direction about the axis a second time in the second opposite direction; and implanting a remaining portion of the implant dose within the substrate and below the one or more patterned gate structures, the substrate tilted in the second opposite direction the second time. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 17)
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9. A method for manufacturing a semiconductor device, comprising:
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forming a gate structure over a substrate; and forming implants within the substrate below the gate structure, including; tilting the substrate located on or over an implant platen about an axis in a first direction with respect to an implant source; implanting a portion of an implant dose within the substrate tilted in the first direction; tilting the substrate having already been tilted in the first direction about the axis in a second opposite direction; implanting at least a portion of the implant dose within the substrate tilted in the second opposite direction; rotating the substrate by about 90 degrees from its original position after implanting at least a portion of the implant dose within the substrate tilted in the second opposite direction; tilting the rotated substrate about the axis a second time in the first direction; implanting a portion of the implant dose within the substrate tilted in the first direction the second time; tilting the substrate having already been tilted a second time in the first direction about the axis a second time in the second opposite direction; and implanting a remaining portion of the implant dose within the substrate tilted in the second opposite direction the second time. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 18)
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19. A method for implanting a dopant in a substrate, comprising:
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tilting a substrate located on or over an implant platen about an axis in a first direction with respect to an implant source, wherein the substrate has one or more patterned gate structures located thereover; implanting a portion of an implant dose within the substrate and below the one or more patterned gate structures, the substrate tilted in the first direction; tilting the substrate having been tilted in the first direction about the axis in a second opposite direction with respect to the implant source; implanting at least a portion of the implant dose within the substrate and below the one or more patterned gate structures, the substrate tilted in the second opposite direction; rotating the substrate by about 90 degrees after implanting at least a portion of the implant dose within the substrate tilted in the first direction; tilting the rotated substrate about the axis in the first direction; implanting a portion of the implant dose within the rotated substrate and below the one or more patterned gate structures, the rotated substrate tilted in the first direction; tilting the rotated substrate in the second opposite direction; and implanting a portion of the implant dose within the rotated substrate and below the one or more patterned gate structures, the rotated substrate tilted in the second opposite direction. - View Dependent Claims (20)
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Specification