Chip scale package with heat spreader
First Claim
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1. A semiconductor device assembly of a plurality of semiconductor device assemblies, comprising:
- a semiconductor die having an active surface having a plurality of bond pads thereon and an opposing second surface;
at least one projection connected to at least one bond pad of the plurality of bond pads on the active surface of the semiconductor die for flip-chip bonding to a substrate, the at least one projection including one of at least one solder ball and at least one solder bump; and
a paddle frame of a plurality of paddle frames including a pair of side rails, a plurality of cross-members, and a plurality of generally centrally positioned paddles, the pair of side rails and the plurality of cross-members connected to a generally centrally positioned paddle of the paddle frame by a plurality of paddle support bars, the second surface of the semiconductor die being secured to the paddle, the paddle being attached to the side rail by at least two of the plurality of paddle support bars and being attached to the cross-members by at least two of the plurality of support bars.
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Abstract
A dense semiconductor flip-chip device assembly is provided with a heat sink/spreading/dissipating member that is formed as a paddle of a metallic paddle frame in a strip of paddle frames. Semiconductor dice are bonded to the paddles by, e.g., conventional semiconductor die attachment methods, enabling bump attachment and testing to be conducted before detachment from the paddle frame strip.
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Citations
37 Claims
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1. A semiconductor device assembly of a plurality of semiconductor device assemblies, comprising:
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a semiconductor die having an active surface having a plurality of bond pads thereon and an opposing second surface; at least one projection connected to at least one bond pad of the plurality of bond pads on the active surface of the semiconductor die for flip-chip bonding to a substrate, the at least one projection including one of at least one solder ball and at least one solder bump; and a paddle frame of a plurality of paddle frames including a pair of side rails, a plurality of cross-members, and a plurality of generally centrally positioned paddles, the pair of side rails and the plurality of cross-members connected to a generally centrally positioned paddle of the paddle frame by a plurality of paddle support bars, the second surface of the semiconductor die being secured to the paddle, the paddle being attached to the side rail by at least two of the plurality of paddle support bars and being attached to the cross-members by at least two of the plurality of support bars. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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12. A semiconductor device assembly of a plurality of semiconductor device assemblies, comprising:
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a semiconductor die having an active surface having at least one bond pad thereon and an opposing second surface; at least one projection secured to the at least one bond pad on the active surface of the semiconductor die configured for flip-chip connection to a substrate, the at least one projection including one of at least one solder ball and at least one solder bump; and a metal paddle from a paddle frame having no narrow common electrical leads for connection to the semiconductor die of a plurality of paddle frames connected by a pair of rails having a plurality of cross-members therebetween, the second surface of the semiconductor die being attached to the paddle, the metal paddle attached to at least one side rail by at least a plurality of paddle support bars and being attached to a plurality of cross-members by the support bars, the paddle support bars not used for electrical leads for the semiconductor die. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24)
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25. A semiconductor device assembly of a plurality of semiconductor device assemblies, comprising:
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a semiconductor die having an active surface having a plurality of bond pads thereon and an opposing second surface; a plurality of projections connected to the plurality of bond pads for direct connection to a host circuit board, the plurality of projections including one of a plurality of solder balls and a plurality of solder bumps; and a metallic paddle having no electrical leads for connection to a semiconductor die secured to the second surface of the semiconductor die, the metallic paddle being attached to at least one side rail by at least a plurality of paddle support bars that include one of being used as a lead and not being used as a lead and being attached to a plurality of cross-members by the support bars of a paddle frame. - View Dependent Claims (26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37)
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Specification