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Semiconductor device having capacitors for reducing power source noise

  • US 7,233,065 B2
  • Filed: 02/25/2005
  • Issued: 06/19/2007
  • Est. Priority Date: 12/15/2000
  • Status: Expired due to Fees
First Claim
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1. A semiconductor device comprising:

  • a BGA substrate having one principal plane furnished with a large number of solder balls, said solder balls constituting a ball grid array;

    a semiconductor chip mounted on another principal plane of said BGA substrate, said semiconductor chip being electrically connected to said BGA substrate by metal wires;

    chip capacitors mounted on said semiconductor chip to reduce power source noise;

    a conductive radiator attached to said another principal plane of said BGA substrate, said conductive radiator covering said semiconductor chip; and

    a shield plane incorporated in said BGA substrate, said shield plane constituting a shield of said semiconductor chip in combination with said conductive radiator;

    wherein said conductive radiator and said shield plane are connected to ground potential.

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