Wafer probe
First Claim
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1. A probe comprising:
- (a) a substantially rigid support base;
(b) a substantially and uniformly flexible circuit board attached and inclined with respect to said support base, wherein said circuit board includes a resistor-capacitor network comprising a first set of capacitors connected between adjacent power and ground transmission lines, and a second set of capacitors are not adjacent said power and ground transmission lines connected respectively to said first set of capacitors;
(c) an integrated tip assembly comprising a plurality of contact fingers supported by and extending from said circuit board, wherein said contact fingers are interconnected with said circuit board and are arranged as a unity assembly, wherein said plurality of contact fingers are maintained in a predetermined alignment when attached to said support by a tab proximate the ends of said plurality of contact fingers.
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Abstract
The present invention relates to a probe for testing of integrated circuits or other microelectronic devices.
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Citations
9 Claims
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1. A probe comprising:
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(a) a substantially rigid support base; (b) a substantially and uniformly flexible circuit board attached and inclined with respect to said support base, wherein said circuit board includes a resistor-capacitor network comprising a first set of capacitors connected between adjacent power and ground transmission lines, and a second set of capacitors are not adjacent said power and ground transmission lines connected respectively to said first set of capacitors; (c) an integrated tip assembly comprising a plurality of contact fingers supported by and extending from said circuit board, wherein said contact fingers are interconnected with said circuit board and are arranged as a unity assembly, wherein said plurality of contact fingers are maintained in a predetermined alignment when attached to said support by a tab proximate the ends of said plurality of contact fingers. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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Specification