Electrophoretic display

• US 7,233,429 B2
• Filed: 01/07/2005
• Issued: 06/19/2007
• Est. Priority Date: 03/03/2000
• Status: Expired due to Fees

• Current Assignee: E Ink California, LLC (E Ink Corporation)
• Original Assignee: SiPix Imaging, Inc. (E Ink Holdings Incorporated)
• Inventors: Liang, Rong-Chang, Zang, HongMei, Tseng, Scott C-J, Wu, Zarng-Arh George
• Primary Examiner(s): Mack; Ricky
• Assistant Examiner(s): Dinh; Jack
• Application Number:
  US11/031,413
• Publication Number:
  US 20050179984A1
• Time in Patent Office: 893 Days
• Field of Search: 359/296, 359/254, 359/316, 345/107, 345/108, 345/111, 430/35, 252/572, 204/488
• US Class Current: 359/296
• CPC Class Codes: G02F 1/133305 Flexible substrates, e.g. plastics, organic film
• CPC Class Codes: G02F 1/133377 Cells with plural compartments or having plurality of liquid crystal microcells partitioned by walls, e.g. one microcell per pixel
• CPC Class Codes: G02F 1/1339 Gaskets; Spacers; Sealing of cells
• CPC Class Codes: G02F 1/167 by electrophoresis
• CPC Class Codes: G02F 1/1679 Gaskets; Spacers; Sealing of cells; Filling or closing of cells
• CPC Class Codes: G02F 1/1681 having two or more microcells partitioned by walls, e.g. of microcup type

Abstract

This invention relates to an electrophoretic display comprising cells of well-defined shape, size and aspect ratio which cells are filled with charged pigment particles dispersed in a solvent, and novel processes for its manufacture.

Claims

1. An electrophoretic display which comprises

a) an array of microcups on a non-conducting substrate wherein each of said microcups comprises

(i) partition walls;

(ii) a first conductive layer coated on the side surface and the bottom surface of the microcup in said microcup;

(iii) an electrophoretic fluid filled therein; and

(iv) a polymeric sealing layer formed from a sealing composition having a specific gravity lower than that of the electrophoretic fluid to enclose the electrophoretic fluid within the microcup; and

b) a second conductive layer which is placed over said array of filled and sealed microcups.

2. The electrophoretic display of claim 1 wherein said second conductive layer is laminated with a second non-conducting substrate.

3. The electrophoretic display of claim 1 further comprising a third conductive layer between the non-conducting substrate and the array of filled and sealed microcups.

4. The electrophoretic display of claim 3 wherein said third conductive layer is patterned.

5. The electrophoretic display of claim 3 wherein said first conductive layer is of a discrete pattern.

6. The electrophoretic display of claim 3 wherein said third conductive layer is formed by thin film deposition or lamination.

7. The electrophoretic display of claim 1 wherein said first conductive layer is patterned.

8. The electrophoretic display of claim 1 wherein said second conductive layer is patterned.

9. The electrophoretic display of claim 1 wherein said first conductive layer is formed by thin film deposition.

10. The electrophoretic display of claim 9 wherein said thin film deposition is accomplished by sputtering or vapor deposition.

11. The electrophoretic display of claim 1 wherein said second conductive layer is formed by thin film deposition or lamination.

12. The electrophoretic display of claim 1 wherein said sealing composition is a radiation, heat or moisture curable composition.

13. The electrophoretic display of claim 1 wherein said sealing composition comprises a thermoplastic or thermoset precursor.

14. The electrophoretic display of claim 13 wherein said thermoplastic or thermoset precursor is selected from the group consisting of hydrocarbon rubbers, butadiene rubbers, isoprene rubbers, thermoplastic elastomers, polyvalent acrylates, polyvalent methacrylates, cyanoacrylates, polyvalent vinyls, polyvalent epoxides, polyvalent isocyanates, polyvalent allyls and oligomers and polymers containing crosslinkable functional groups.

15. The electrophoretic display of claim 1 wherein the top surface of the partition walls is coated with a third conductive layer.