Multi-cell masks and methods and apparatus for using such masks to form three-dimensional structures
First Claim
1. A process for forming a multilayer three-dimensional structure, comprising:
- (a) forming a layer of at least one material on a substrate that may include one or more previously deposited layers of one or more materials;
(b) repeating the forming operation of “
(a)”
one or more times to form at least one subsequent layer on at least one previously formed layer to build up a three-dimensional structure from a plurality layers;
wherein the forming of at least one layer, comprises;
(1) supplying a substrate on which one or more successive depositions of one or more materials may have occurred;
(2) supplying a multi-cell mask, wherein each cell is separated from other cells by a material, wherein each of a plurality of the cells of the mask each comprise an independently controllable electrode, and wherein a pattern of dielectric material extends beyond the cell electrodes for proximate or contact positioning relative to the substrate and for forming process pockets when such proximate or contact positioning is achieved;
(3) bringing the multi-cell mask and the substrate into proximate positioning or contact such that electrochemical process pockets are formed having a desired registration with respect to any previous depositions and providing a desired electrolyte solution such that the solution is located within the electrochemical process pockets;
(4) selectively etching material from the substrate or previously deposited material to form at least one void, comprising applying a desired electrical activation to at least one selected cell electrode and to the substrate; and
(5) depositing a selected material into at least a portion of the at least one void,wherein a plurality of the cells of the multi-cell mask comprise a passage in proximity to the cell electrode for allowing ion exchange between the electrolyte in the process pockets and a larger volume of electrolyte located outside the process pockets such that ions may be transferred between the substrate and one or more electrodes located outside the process pockets.
1 Assignment
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Accused Products
Abstract
Multilayer structures are electrochemically fabricated via depositions of one or more materials in a plurality of overlaying and adhered layers. Selectivity of deposition is obtained via a multi-cell controllable mask. Alternatively, net selective deposition is obtained via a blanket deposition and a selective removal of material via a multi-cell mask. Individual cells of the mask may contain electrodes comprising depositable material or electrodes capable of receiving etched material from a substrate. Alternatively, individual cells may include passages that allow or inhibit ion flow between a substrate and an external electrode and that include electrodes or other control elements that can be used to selectively allow or inhibit ion flow and thus inhibit significant deposition or etching. Single cell masks having a cell size that is smaller or equal to the desired deposition resolution may also be used to form structures.
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Citations
43 Claims
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1. A process for forming a multilayer three-dimensional structure, comprising:
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(a) forming a layer of at least one material on a substrate that may include one or more previously deposited layers of one or more materials; (b) repeating the forming operation of “
(a)”
one or more times to form at least one subsequent layer on at least one previously formed layer to build up a three-dimensional structure from a plurality layers;wherein the forming of at least one layer, comprises; (1) supplying a substrate on which one or more successive depositions of one or more materials may have occurred; (2) supplying a multi-cell mask, wherein each cell is separated from other cells by a material, wherein each of a plurality of the cells of the mask each comprise an independently controllable electrode, and wherein a pattern of dielectric material extends beyond the cell electrodes for proximate or contact positioning relative to the substrate and for forming process pockets when such proximate or contact positioning is achieved; (3) bringing the multi-cell mask and the substrate into proximate positioning or contact such that electrochemical process pockets are formed having a desired registration with respect to any previous depositions and providing a desired electrolyte solution such that the solution is located within the electrochemical process pockets; (4) selectively etching material from the substrate or previously deposited material to form at least one void, comprising applying a desired electrical activation to at least one selected cell electrode and to the substrate; and (5) depositing a selected material into at least a portion of the at least one void, wherein a plurality of the cells of the multi-cell mask comprise a passage in proximity to the cell electrode for allowing ion exchange between the electrolyte in the process pockets and a larger volume of electrolyte located outside the process pockets such that ions may be transferred between the substrate and one or more electrodes located outside the process pockets. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
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10. A process for forming a multilayer three-dimensional structure, comprising:
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(a) forming a layer of at least one material on a substrate that may include one or more previously deposited layers of one or more materials; (b) repeating the forming operation of “
(a)”
one or more times to form at least one subsequent layer on at least one previously formed layer to build up a three-dimensional structure from a plurality layers;wherein the forming of at least one layer, comprises; (1) supplying a substrate on which one or more successive depositions of one or more materials may have occurred; (2) supplying a multi-cell mask, wherein each cell is separated from other cells by a material, wherein each of a plurality of the cells of the mask each comprise an independently controllable electrode, wherein a pattern of dielectric material extends beyond the cell electrodes for proximate or contact positioning relative to the substrate for forming electrochemical process pockets when such proximate or contact positioning is achieved; (3) bringing the multi-cell mask and the substrate into proximate positioning or contact such that electrochemical process pockets are formed having a desired registration with respect to any previous depositions and providing a desired electrolyte solution such that the solution is located within the electrochemical process pockets; (4) modifying the substrate or previously deposited material at selected locations, comprising applying desired electrical activation to at least one selected cell electrode and to the substrate; and wherein a plurality of the cells of the multi-cell mask comprise a passage in proximity to the cell electrode for allowing ion exchange between the electrolyte in the process pockets and a larger volume of electrolyte located outside the process pockets such that ions may be transferred between one or more electrodes located outside the process pockets and a portion of the substrate forming part of at least one pocket, wherein the modifying of the substrate or previously deposited material further comprises activating at least one electrode outside the process pockets, wherein during deposition onto the substrate, inactive cells have their cell electrodes set at a potential equal to or greater than that of an anode. - View Dependent Claims (11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27)
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28. A process for forming a multilayer three-dimensional structure, comprising:
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(a) forming a layer of at least one material on a substrate that may include one or more previously deposited layers of one or more materials; (b) repeating the forming operation of “
(a)”
one or more times to form at least one subsequent layer on at least one previously formed layer to build up a three-dimensional structure from a plurality layers;wherein the forming of at least one layer, comprises; (1) supplying a substrate on which one or more successive depositions of one or more materials may have occurred; (2) supplying a multi-cell mask, wherein each cell is separated from other cells by a material, wherein each of a plurality of the cells of the mask comprise a control means for selectively activating or inhibiting activation of the cell during an electrochemical process; and
wherein a pattern of dielectric material extends beyond the control means for proximate or contact positioning relative to the substrate and for forming electrochemical process pockets when such proximate or contact positioning is made;(3) bringing the multi-cell mask and the substrate into proximate positioning or contact such that electrochemical process pockets are formed having a desired registration with respect to any previous depositions and providing a desired electrolyte solution such that the solution is provided within the electrochemical process pockets; and (4) selectively depositing a desired material onto the substrate or previously deposited material or selectively forming voids in the substrate or previously deposited material, comprising applying a desired activation to at least one control element that is used to control the activity of a selected cell, and applying a desired electrical activation to the substrate, and to one or more additional electrodes that may be located within individual cells or located external to the multi-cell mask, wherein a plurality of the cells of the multi-cell mask comprise a passage in proximity to the cell electrode for allowing ion exchange between the electrolyte in the process pockets and a larger volume of electrolyte located outside the process pockets such that ions may be transferred between the substrate and one or more electrodes located outside the process pockets. - View Dependent Claims (29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40, 41, 42, 43)
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Specification