Methods for packaging a plurality of semiconductor dice using a flowable dielectric material
First Claim
1. A method of packaging a plurality of semiconductor dice, comprising:
- providing a plurality of semiconductor dice, each including an active surface and bond pads thereon, a backside generally opposite thereto, and an exterior periphery;
affixing the backside of each of the plurality of semiconductor dice to a carrier;
disposing flowable, uncured dielectric material at least partially around and between the plurality of semiconductor dice;
at least partially curing, substantially as a whole, the flowable, uncured dielectric material; and
singulating each of the plurality of the semiconductor dice through the cured dielectric material.
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0 Petitions
Accused Products
Abstract
A method of packaging at least a portion of a semiconductor die or dice is disclosed. Uncured material may be disposed proximate at least the periphery of at least one semiconductor die and at least partially cured substantially as a whole. Methods of forming conductive elements such as traces, vias, and bond pads are also disclosed. More specifically, forming at least one organometallic layer to a substrate surface and selectively heating at least a portion thereof is disclosed. Also, forming a layer of conductive photopolymer over at least a portion of a surface of a substrate and removing at least a portion thereof is disclosed. A microlens having a plurality of mutually adhered layers of cured, optically transmissive material, methods of forming same, and systems so equipped are disclosed.
128 Citations
16 Claims
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1. A method of packaging a plurality of semiconductor dice, comprising:
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providing a plurality of semiconductor dice, each including an active surface and bond pads thereon, a backside generally opposite thereto, and an exterior periphery; affixing the backside of each of the plurality of semiconductor dice to a carrier; disposing flowable, uncured dielectric material at least partially around and between the plurality of semiconductor dice; at least partially curing, substantially as a whole, the flowable, uncured dielectric material; and singulating each of the plurality of the semiconductor dice through the cured dielectric material. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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Specification