Methods for packaging a plurality of semiconductor dice using a flowable dielectric material

• US 7,235,431 B2
• Filed: 09/02/2004
• Issued: 06/26/2007
• Est. Priority Date: 09/02/2004
• Status: Active Grant

• Current Assignee: Micron Technology, Inc.
• Original Assignee: Micron Technology, Inc.
• Inventors: Watkins, Charles M., Farnworth, Warren M., Wood, Alan G., Benson, Peter A.
• Primary Examiner(s): Lee; Calvin
• Application Number:
  US10/934,109
• Publication Number:
  US 20060046347A1
• Time in Patent Office: 1,027 Days
• Field of Search: 257709-711, 257787-795, 438110-113, 438124-127
• US Class Current: 438/125
• CPC Class Codes: B33Y 10/00 Processes of additive manufacturing
• CPC Class Codes: B33Y 80/00 Products made by additive manufacturing
• CPC Class Codes: H01L 21/56 Encapsulations, e.g. encapsulation layers, coatings
• CPC Class Codes: H01L 2224/04105 Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 2224/20 Structure, shape, material or disposition of high density interconnect preforms
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14627 Microlenses
• CPC Class Codes: H01L 27/14685 Process for coatings or optical elements
• CPC Class Codes: H01L 2924/01005 Boron [B]
• CPC Class Codes: H01L 2924/01027 Cobalt [Co]
• CPC Class Codes: H01L 2924/01046 Palladium [Pd]
• CPC Class Codes: H01L 2924/12041 LED

Abstract

A method of packaging at least a portion of a semiconductor die or dice is disclosed. Uncured material may be disposed proximate at least the periphery of at least one semiconductor die and at least partially cured substantially as a whole. Methods of forming conductive elements such as traces, vias, and bond pads are also disclosed. More specifically, forming at least one organometallic layer to a substrate surface and selectively heating at least a portion thereof is disclosed. Also, forming a layer of conductive photopolymer over at least a portion of a surface of a substrate and removing at least a portion thereof is disclosed. A microlens having a plurality of mutually adhered layers of cured, optically transmissive material, methods of forming same, and systems so equipped are disclosed.

Claims

1. A method of packaging a plurality of semiconductor dice, comprising:

providing a plurality of semiconductor dice, each including an active surface and bond pads thereon, a backside generally opposite thereto, and an exterior periphery;

affixing the backside of each of the plurality of semiconductor dice to a carrier;

disposing flowable, uncured dielectric material at least partially around and between the plurality of semiconductor dice;

at least partially curing, substantially as a whole, the flowable, uncured dielectric material; and

singulating each of the plurality of the semiconductor dice through the cured dielectric material.

2. The method of claim 1, wherein disposing flowable, uncured dielectric material at least partially around and between the plurality of semiconductor dice comprises disposing uncured dielectric material over the active surface of each of the plurality of semiconductor dice.

3. The method of claim 2, wherein disposing flowable, uncured dielectric material at least partially around and between the plurality of semiconductor dice comprises at least one of immersing, dipping, spin-coating, printing, and spraying.

4. The method of claim 2, further comprising:

curing the flowable, uncured dielectric material over the bond pads of each of the plurality of semiconductor dice; and

removing a portion of the cured dielectric material to expose the bond pads of each of the plurality of semiconductor dice.

5. The method of claim 4, wherein removing the portion of the cured dielectric material to expose the bond pads of each of the plurality of semiconductor dice comprises:

forming a resist over at least a portion of a surface of the cured dielectric material;

etching the at least a portion of the surface of the cured dielectric material uncovered by the resist; and

removing the resist from the at least a portion of the surface of the cured dielectric material.

6. The method of claim 1, further comprising:

preventing the flowable, uncured dielectric material from contacting the bond pads of each of the plurality of semiconductor dice prior to at least partially curing, substantially as a whole, the flowable, uncured dielectric material.

7. The method of claim 6, wherein preventing the flowable, uncured dielectric material from contacting the bond pads comprises disposing a cover element in sealing engagement therewith.

8. The method of claim 6, wherein preventing the flowable, uncured dielectric material from contacting the bond pads comprises forming barrier structures extending from the active surface of each of the plurality of semiconductor dice and surrounding the bond pads thereof.

9. The method of claim 1, further comprising preventing the flowable, uncured dielectric material proximate to the bond pads of each of the plurality of semiconductor dice from curing.

10. The method of claim 1, further comprising forming conductive traces extending from the bond pads, respectively, of each of the plurality of semiconductor dice.

11. The method of claim 1, further comprising:

disposing the flowable, uncured dielectric material at least partially around and between the plurality of semiconductor dice to a first vertical level;

at least partially curing, substantially as a whole, the flowable, uncured dielectric material at the first vertical level;

disposing the flowable, uncured dielectric material at least partially around and between the plurality of semiconductor dice to a second vertical level; and

at least partially curing, substantially as a whole, the flowable, uncured dielectric material at the second vertical level.

12. The method of claim 1, further comprising installing a surface mount component in operable communication with each of the plurality of semiconductor dice, respectively.

13. The method of claim 1, wherein at least partially curing, substantially as a whole, the flowable, uncured dielectric material comprises exposing the flowable, uncured dielectric material to a light source.

14. The method of claim 13, wherein exposing the flowable, uncured dielectric material to a light source comprises exposing the flowable, uncured dielectric material to a light source through an exposure mask.

15. The method of claim 1, wherein at least partially curing, substantially as a whole, the flowable, uncured dielectric material comprises exposing the flowable, uncured dielectric material to a heat source.

16. The method of claim 1, wherein providing the plurality of semiconductor dice comprises providing a plurality of known good semiconductor dice.