Imaging device with multiple fields of view incorporating memory-based temperature compensation of an uncooled focal plane array
First Claim
1. An apparatus comprising:
- a plurality of focal plane arrays, each of said focal plane arrays having a plurality of pixel locations;
memory having a plurality of memory locations in which operating parameters of each pixel location are stored;
means for measuring the temperature of each of said focal plane arrays;
a shared processing module comprised of a logic circuit coupled to said temperature measuring means for converting a measured temperature of each of said focal plane arrays to an address, said logic circuit coupled to said memory to read said operating parameters of each of said pixel locations from said memory;
a read-out circuit coupled to each of said focal plane arrays for measuring radiant energy incident on said pixel locations; and
a processing circuit coupled to said logic circuit and to said read-out circuit for processing said operating parameters of each pixel location from said memory device with said measured radiant energy incident on said addressed pixel location to provide a temperature compensated measurement for each of said pixel locations and,multiplexing circuitry coupled between each of said focal plane arrays and said shared processing module for the multiplexing of an electronic signal between said focal plane arrays and said shared processing module.
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Abstract
A plurality of temperature dependent focal plane arrays operate without a temperature stabilization cooler and/or heater over a wide range of ambient temperatures. Gain, offset and/or bias correction tables are provided in a flash memory in memory pages indexed by the measured temperature of the focal plane arrays. The memory stores a calibration database, which is accessed using a logic circuit which generates a memory page address from a digitized temperature measurement of each of the focal plane array. The calibration database is comprised of an array of bias, gain and offset values for each pixel in the focal plane array for each potential operating temperature over the entire range of potential operating temperatures. The bias, gain and offset data within the database are read out, converted to analog form, and used by analog circuits to correct the focal plane array response. The output of each of the FPAs is multiplexed to a shared processing module and calibration data for each of the FPAs is accessed from the shared processing module.
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Citations
11 Claims
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1. An apparatus comprising:
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a plurality of focal plane arrays, each of said focal plane arrays having a plurality of pixel locations; memory having a plurality of memory locations in which operating parameters of each pixel location are stored; means for measuring the temperature of each of said focal plane arrays; a shared processing module comprised of a logic circuit coupled to said temperature measuring means for converting a measured temperature of each of said focal plane arrays to an address, said logic circuit coupled to said memory to read said operating parameters of each of said pixel locations from said memory; a read-out circuit coupled to each of said focal plane arrays for measuring radiant energy incident on said pixel locations; and
a processing circuit coupled to said logic circuit and to said read-out circuit for processing said operating parameters of each pixel location from said memory device with said measured radiant energy incident on said addressed pixel location to provide a temperature compensated measurement for each of said pixel locations and,multiplexing circuitry coupled between each of said focal plane arrays and said shared processing module for the multiplexing of an electronic signal between said focal plane arrays and said shared processing module. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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Specification