Modular heat sink decoupling capacitor array forming heat sink fins and power distribution interposer module

• US 7,235,875 B2
• Filed: 12/09/2004
• Issued: 06/26/2007
• Est. Priority Date: 12/09/2004
• Status: Expired due to Fees

• Current Assignee: International Business Machines Corporation
• Original Assignee: International Business Machines Corporation
• Inventors: Booth, Roger Allen Jr., Patel, Ankur Kanu, Doyle, Matthew Stephen, Liang, Thomas W., Gilliland, Don Alan, Wurth, Dennis James, Landin, Lynn Robert, Gregg, Brian Edward
• Primary Examiner(s): Tran; Long K.
• Application Number:
  US11/008,798
• Publication Number:
  US 20060125086A1
• Time in Patent Office: 929 Days
• Field of Search: 257/772, 257/706, 257/707, 257/276, 257/625, 257/675, 257/E33.075, 257/E31.131, 438/122
• US Class Current: 257/706
• CPC Class Codes: H01L 23/3672 Foil-like cooling fins or heat sinks being part of lead-frames H01L23/49568
• CPC Class Codes: H01L 23/50 for integrated circuit devices, e.g. power bus, number of leadsH01L23/482 - H01L23/498 take precedence
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H05K 1/0203 Cooling of mounted components H05K1/0272 takes precedence
• CPC Class Codes: H05K 1/0231 Capacitors or dielectric substances
• CPC Class Codes: H05K 2201/10454 Vertically mounted
• CPC Class Codes: H05K 2201/2018 Presence of a frame in a printed circuit or printed circuit assembly
• CPC Class Codes: H05K 3/301 by means of a mounting structure H05K3/325 takes precedence

Abstract

A modular heat sink decoupling capacitor array includes a plurality of modules, each defining parallel distributed decoupling plates, and each module forming a heat sink fi. Each module includes multiple spaced apart contacts for providing low inductance connections with an associated device. A power distribution interposer module is attached to a heat sink surface of the modular decoupling capacitor. The interposer module is used for implementing power delivery without using valuable ball grid array (BGA) connections and printed circuit board (PCB) layers.

Claims

1. A modular heat sink decoupling capacitor array comprising:

a plurality of modules defining parallel distributed decoupling plates;

a dielectric material surrounding each of said parallel distributed decoupling plates of said plurality of said modules;

each said module forming a heat sink fin; and

each said module including a plurality of spaced apart contacts for providing low inductance connections with an associated device;

a power distribution interposer module for implementing power delivery without using valuable ball grid array (BGA) connections and printed circuit board (PCB) layers;

said power distribution interposer module includes a flex cable;

said flex cable connected to a pad-on-pad connector.

2. A modular heat sink decoupling capacitor array as recited in claim 1 wherein said dielectric material includes a selected one of the group of single dielectric materials including X7R, and X5R.

3. A modular heat sink decoupling capacitor array as recited in claim 1 wherein said plurality of spaced apart contacts of said plurality of modules are arranged in a connection grid pattern.

4. A modular heat sink decoupling capacitor array as recited in claim 1 wherein said plurality of spaced apart contacts are formed of a selected one of the group of electrically conductive materials including silver and glass frit, copper and glass frit, silver, copper, nickel, and tin.

5. A modular heat sink decoupling capacitor array as recited in claim 1 wherein said associated device includes a selected one of an electrical chip carrier module and a printed circuit board.

6. A modular heat sink decoupling capacitor array as recited in claim 1 wherein said power distribution interposer module is attached to a heat sink surface of one said module of the modular decoupling capacitor.

7. A modular heat sink decoupling capacitor array as recited in claim 1 wherein said pad-on-pad connector electrically connects said power distribution interposer module to a plurality of contact pads carried by a chip carrier.

8. A printed circuit board assembly comprising:

a printed circuit board;

a chip carrier mounted on said printed circuit board;

a modular heat sink decoupling capacitor array mounted on said printed circuit board;

said modular heat sink decoupling capacitor array including a plurality of modules, each defining parallel distributed decoupling plates;

a dielectric material surrounding each of said parallel distributed decoupling plates of said plurality of said modules, each said module forming a heat sink fin; and

each said module including a plurality of spaced apart contacts for providing electrical connections with a selected one of said chip carrier and said printed circuit board; and

a power distribution interposer module mounted on said modular decoupling capacitor;

said power distribution interposer module for implementing power delivery without using valuable ball grid array (BGA) connections and printed circuit board (PCB) layers; and

said power distribution interposer module including a flex cable;

said flex cable connected to a pad-on-pad connector.

9. A printed circuit board assembly as recited in claim 8 wherein said dielectric material includes a selected one of the group of single dielectric materials including X7R, and X5R.

10. A printed circuit board assembly as recited in claim 8 wherein said plurality of spaced apart contacts of said plurality of modules of said modular heat sink decoupling capacitor array are arranged in a connection grid pattern.

11. A printed circuit board assembly as recited in claim 8 wherein said plurality of spaced apart contacts are formed of a selected one of the group of electrically conductive materials including silver and glass frit, copper and glass frit, silver, copper, nickel, and tin.