High brightness LED apparatus with an integrated heat sink

• US 7,236,366 B2
• Filed: 07/23/2004
• Issued: 06/26/2007
• Est. Priority Date: 07/23/2004
• Status: Expired due to Fees

• Current Assignee: Excel Cell Electronic Co., Ltd.
• Original Assignee: Excel Cell Electronic Co., Ltd.
• Inventors: Chen, An-Si
• Primary Examiner(s): DATSKOVSKIY, MICHAIL V
• Application Number:
  US10/896,986
• Publication Number:
  US 20060018099A1
• Time in Patent Office: 1,068 Days
• Field of Search: 361/704, 361/705, 361/707, 361/709, 361/712, 361717-719, 257/678, 257291-293, 257/99, 257/103, 257/75, 257/88, 257/712, 257/725, 257431-434, 362/218, 362/227, 362/294, 362/373, 362/555, 362/800, 362/487, 362/543, 362/545, 362/382, 362/396.11, 174/16.3, 174/252, 165/80.2, 165/80.3, 165/185
• US Class Current: 361/709
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: F21V 29/70 characterised by passive heat-dissipating elements, e.g. heat-sinks
• CPC Class Codes: F21V 29/74 with fins or blades
• CPC Class Codes: F21V 29/745 the fins or blades being planar and inclined with respect to the joining surface from which the fins or blades extend
• CPC Class Codes: F21V 29/763 the planes containing the fins or blades having the direction of the light emitting axis
• CPC Class Codes: F21V 29/773 the planes containing the fins or blades having the direction of the light emitting axis
• CPC Class Codes: F21V 29/80 with pins or wires
• CPC Class Codes: F21Y 2115/10 Light-emitting diodes [LED]
• CPC Class Codes: H01L 25/0753 the devices being arranged next to each other
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 33/647 the elements conducting electric current to or from the semiconductor body

Abstract

A high brightness LED apparatus with an integrated heat sink includes a heat sink base and at least one LED mounted in the heat sink base. The heat sink base includes multiple dissipating fins formed integrally on the substrate. Each of the at least one LED includes a body and multiple dies. The body is mounted in the substrate and includes a conductive seat with a top recess. The dies are mounted on the conductive seat in the top recess and produce a great amount of light beams for an enhanced brightness of illumination. The dissipating fins will efficiently dissipate heat produced by the at least one LED to prevent each LED from brightness decay and extend the useful life of each LED.

Claims

1. A high brightness LED apparatus with an integrated heat sink, and the high brightness LED apparatus comprising

a heat sink base comprising

a substrate;

and

multiple dissipating fins formed integrally on the substrate; and

at least one LED mounted in the substrate and each of the at least one LED comprising

a body mounted in the substrate and comprising

a conductive seat having a top recess;

an embedded conductor mounted in the conductive seat;

an insulating layer mounted in the conductive seat and surrounding the embedded conductor to insulate electrically the embedded conductor from the conductive seat; and

two conductive leads coupled respectively to the conductive seat and the embedded conductor; and

multiple dies mounted on and connected to the conductive seat in the top recess and connected electrically to the embedded conductor.

2. The high brightness LED apparatus with an integrated heat sink as claimed in claim 1, wherein

the substrate is a planar block that has a first surface and a second surface opposite the first surface;

and

the dissipating fins are formed and arranged on the entire second surface of the substrate.

3. The high brightness LED apparatus with an integrated heat sink as claimed in claim 2, wherein

the substrate further has at least one LED hole;

and

each one of the at least one LED is held in a respective one of the at least one LED hole and further comprises

a cover attached to the conductive seat to cover the top recess; and

an outside casing mounted on the conductive seat to clamp the cover and having a presenting hole aligned with the top recess.

4. The high brightness LED apparatus with an integrated heat sink as claimed in claim 2, wherein the body of each one of the at least one LED further has an annular lip abutting on the first surface of the substrate.

5. The high brightness LED apparatus with an integrated heat sink as claimed in claim 1, wherein

the substrate is a thin disk and has a first surface, a second surface opposite the first surface and an annular edge;

and

the dissipating fins are formed on the second surface along the annular edge of the substrate.

6. The high brightness LED apparatus with an integrated heat sink as claimed in claim 5, wherein

the substrate further has at least one LED hole;

and

each one of the at least one LED is held in a respective one of the at least one LED hole and further comprises

a cover attached to the conductive seat to cover the top recess; and

an outside casing mounted on the conductive seat to clamp the cover and having a presenting hole aligned with the top recess.

7. The high brightness LED apparatus with an integrated heat sink as claimed in claim 6, wherein the body of each one of the at least one LED further has an annular lip abutting on the first surface of the substrate.

8. The high brightness LED apparatus with an integrated heat sink as claimed in claim 1, wherein

the substrate is a thin disk and has a first surface, a second surface opposite the first surface and an annular edge;

and

the dissipating fins are formed on the second surface and are complementarily arranged along the annular edge of the substrate.

9. The high brightness LED apparatus with an integrated heat sink as claimed in claim 8, wherein

the substrate further has at least one LED hole;

and

each one of the at least one LED is held in a respective one of the at least one LED hole and further comprises

a cover attached to the conductive seat to cover the top recess; and

an outside casing mounted on the conductive seat to clamp the cover and having a presenting hole aligned with the top recess.

10. The high brightness LED apparatus with an integrated heat sink as claimed in claim 9, wherein the body of each one of the at least one LED further has an annular lip abutting on the first surface of the substrate.

11. The high brightness LED apparatus with an integrated heat sink as claimed in claim 1, wherein the substrate has at least one mounting hole.