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Manufacturing process developing method for semiconductor device

  • US 7,236,840 B2
  • Filed: 08/19/2004
  • Issued: 06/26/2007
  • Est. Priority Date: 08/20/2003
  • Status: Active Grant
First Claim
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1. A manufacturing process designing method which is for dividing a full process necessary for designing a manufacturing process into a plurality of process modules and increasing a degree of perfection of the development in said process modules, comprising:

  • a linking step of linking technical parameters of the process modules, the technical parameters of the process modules being composed of technical items and standards of the process modules with technical parameters of element technologies, the technical parameters of the element technologies being composed of technical items and standards of the element technologies used in said process modules;

    a setting step of carrying out the linking step and setting the technical items and standards included in the technical parameters of the process modules and the technical parameters of the element technologies;

    after the linking and setting steps, a design step of judging whether a process flow and process recipes are appropriate or not;

    a process condition establishment step of judging, after said design step, whether said process flow and process conditions including said process recipes involve any problems in factory lines; and

    a process completion step of judging, after said process condition establishment step, whether said process flow and said process conditions including said process recipes allow mass production in factory lines,wherein a verification step of verifying whether evaluation values of said technical items included in said technical parameters set in said setting step meet respectively said standards included in said technical parameters set in said setting step is performed in said process completion step,said setting step includes setting a defect density as one of said technical items included in said technical parameters and setting a standard of said defect density as one of said standards included in said technical parameters, andsaid verification step includes verifying whether a value of said defect density meets said standard.

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