Systems and methods for closed loop defect reduction

• US 7,236,847 B2
• Filed: 01/15/2003
• Issued: 06/26/2007
• Est. Priority Date: 01/16/2002
• Status: Active Grant

• Current Assignee: Kla-Tencor Technologies Corporation (KLA Corporation)
• Original Assignee: Kla-Tencor Technologies Corporation (KLA Corporation)
• Inventors: Marella, Paul Frank
• Primary Examiner(s): Picard; Leo
• Assistant Examiner(s): Rao; Sheela S.
• Application Number:
  US10/342,819
• Publication Number:
  US 20030139838A1
• Time in Patent Office: 1,623 Days
• Field of Search: 438/4, 438/5, 438/12, 700/110, 702/35, 702/83, 702/108, 356/237.2, 382/149, 205/80, 716/4
• US Class Current: 700/110
• CPC Class Codes: G01N 21/55 Specular reflectivity
• CPC Class Codes: H01L 22/20 Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps

Abstract

Systems and methods for repairing defects on a specimen are provided. A method may include processing a specimen, detecting defects on the specimen, and repairing one or more of the defects. An additional method may include detecting defects on a specimen, repairing one or more of the defects, and inspecting the specimen to detect defects remaining on the specimen subsequent to repair. A system may include a process chamber, a measurement device configured to detect defects on a specimen, and a repair tool configured to repair one or more of the defects detected on the specimen. An additional system may include a measurement device, a repair tool, and an inspection tool configured to detect defects remaining on the specimen subsequent to repair. The systems may also include a processor configured to alter a parameter of an instrument coupled to the repair tool in response to output from the measurement device.

Claims

1. A method for repairing defects on a specimen, comprising:

processing the specimen;

detecting defects present on the specimen;

determining if the defects are repairable;

repairing one or more of the defects on the specimen, wherein the one or more defects comprise defects determined to be repairable;

inspecting the specimen subsequent to the repairing to detect defects remaining on the specimen; and

altering a parameter of an instrument coupled to a process chamber used for the processing in response to the defects remaining on the specimen.

2. The method of claim 1, wherein the detecting comprises determining a characteristic of the defects on the specimen, the method further comprising altering a parameter of an instrument coupled to a repair tool used for the repairing in response to the characteristic.

3. The method of claim 1, wherein the detecting comprises determining a location of the defects on the specimen, the method further comprising altering a parameter of an instrument coupled to a repair tool used for the repairing in response to the location of the defects.

4. The method of claim 1, further comprising sending output from a measurement device used for the detecting to a repair tool used for the repairing, wherein the output is responsive to the defects present on the specimen, and processing the output to determine a parameter of an instrument coupled to the repair tool for the repairing.

5. The method of claim 1, wherein the detecting comprises forming an image of the specimen.

6. The method of claim 1, wherein the repairing is performed during the detecting.

7. The method of claim 1, wherein the repairing comprises removing the one or more defects with chemically assisted laser removal.

8. The method of claim 1, wherein the repairing comprises removing the one or more defects with laser induced shock wave removal.

9. The method of claim 1, wherein the repairing comprises particle beam assisted repair.

10. The method of claim 1, further comprising determining a characteristic of the specimen during the processing with a measurement device used for the detecting.

11. The method of claim 1, further comprising altering the parameter of the instrument coupled to the process chamber in response to the defects detected on the specimen.

12. The method of claim 1, wherein the processing is selected from the group consisting of forming a layer of material on the specimen, patterning a resist on the specimen, etching the specimen, polishing the specimen, and cleaning the specimen.

13. A method for repairing defects on a specimen, comprising:

detecting defects present on the specimen;

repairing one or more of the defects present on the specimen;

inspecting the specimen to detect defects remaining on the specimen subsequent to the repairing; and

altering a parameter of an instrument coupled to a process chamber used for processing the specimen in response to the defects remaining on the specimen.

14. The method of claim 13, wherein the detecting comprises determining locations of the defects present on the specimen, and wherein said inspecting comprises inspecting the locations on the specimen subsequent to the repairing to detect the defects remaining on the specimen.

15. The method of claim 13, wherein the inspecting is performed during the repairing.

16. The method of claim 13, further comprising altering a parameter of an instrument coupled to a repair tool used for the repairing in response to the inspecting.

17. The method of claim 13, wherein the inspecting comprises forming an image of the specimen.

18. A system configured to repair defects on a specimen, comprising:

a process chamber configured to process the specimen;

a measurement device configured to detect defects present on the specimen subsequent to processing by the process chamber;

a repair tool configured to repair one or more of the defects detected on the specimen; and

a processor coupled to the process chamber, the measurement device and the repair tool, wherein the processor is configured to receive output from the measurement device, wherein the output is responsive to the defects detected on the specimen, and wherein the processor is further configured to alter a parameter of an instrument coupled to the repair tool in response to the output and to alter a parameter of an instrument coupled to the process chamber in response to defects remaining on the specimen subsequent to repair.

19. The system of claim 18, wherein the processor is further configured to determine if the detected defects are repairable from the output and to alter the parameter of the instrument coupled to the repair tool such that the one or more defects comprise defects determined to be repairable.

20. The system of claim 18, wherein the processor is further configured to determine a characteristic of the detected defects from the output and to alter the parameter of the instrument coupled to the repair tool in response to the characteristic of the detected defects.

21. The system of claim 18, wherein the processor is further configured to determine a location of the detected defects on the specimen from the output and to alter the parameter of the instrument coupled to the repair tool in response to the location of the detected defects.

22. The system of claim 18, wherein the processor is further configured to alter the parameter of the instrument coupled to the process chamber in response to the output.

23. The system of claim 18, wherein the measurement device is further configured to form an image of the specimen.

24. The system of claim 18, wherein the measurement device is further configured to inspect the specimen to detect the defects remaining on the specimen subsequent to repair.

25. The system of claim 18, further comprising an inspection tool configured to inspect the specimen to detect the defects remaining on the specimen subsequent to repair.

26. The system of claim 18, wherein the repair tool is further configured to repair the one or more defects detected on the specimen during detection of the defects by the measurement device.

27. The system of claim 18, wherein the repair tool comprises a chemically assisted laser removal tool.

28. The system of claim 18, wherein the repair tool comprises a laser induced shock wave removal tool.

29. The system of claim 18, wherein the repair tool comprises a particle beam assisted repair tool.

30. The system of claim 18, wherein the measurement device is further configured to generate additional output during the process, and wherein the processor is further configured to obtain a signature characterizing the process from the additional output.

31. The system of claim 18, wherein the measurement device is further configured to generate additional output during the process, and wherein the processor is further configured to obtain a signature characterizing the process from the additional output and to alter the parameter of the instrument coupled to the process chamber in response to the signature.

32. The system of claim 18, wherein the process chamber is selected from the group consisting of a deposition chamber, a plating chamber, a thermal growth chamber, a lithography chamber, an etch chamber, a polishing chamber, and a cleaning chamber.

33. The system of claim 18, wherein the system is arranged as a cluster tool.

34. A system configured to repair defects on a specimen, comprising:

a measurement device configured to detect defects present on the specimen;

a repair tool configured to repair one or more of the defects detected on the specimen;

an inspection tool configured to detect defects remaining on the specimen subsequent to repair; and

a processor coupled to a process chamber, the measurement device, and the repair tool, wherein the processor is configured to receive output from the measurement device, wherein the output is responsive to the defects detected on the specimen, and wherein the processor is farther configured to alter a parameter of an instrument coupled to the repair tool in response to the output and to alter a parameter of an instrument coupled to the process chamber in response to the defects remaining on the specimen subsequent to repair.

35. The system of claim 34, wherein the processor is further coupled to the inspection tool, wherein the inspection tool is further configured to receive output from the processor responsive to locations of the detected defects on the specimen, and wherein the inspection tool is further configured to inspect the locations on the specimen subsequent to repair to detect the defects remaining on the specimen subsequent to repair.

36. The system of claim 34, wherein the inspection tool is further configured to form an image of the specimen.

37. The system of claim 34, wherein the processor is further coupled to the inspection tool, wherein the processor is further configured to receive additional output from the inspection tool, wherein the additional output is responsive to the defects remaining on the specimen subsequent to the repair, and wherein the processor is further configured to alter a parameter of an instrument coupled to the repair tool in response to the additional output.

38. A system, comprising:

a wet cleaning chamber configured to process a specimen; and

a laser induced shock wave removal tool coupled to the wet cleaning chamber, wherein the removal tool is configured to remove particles from the specimen.

39. The system of claim 38, wherein the particles are located on frontside and backside surfaces of the specimen.

40. The system of claim 38, wherein the removal tool is further coupled to the wet cleaning chamber by a common handler.

41. The system of claim 38, further comprising a measurement device configured to detect defects present on the specimen.

42. The system of claim 41, further comprising a processor coupled to the measurement device and the removal tool, wherein the processor is configured to receive output from the measurement device, wherein the output is responsive to the defects detected on the specimen, and wherein the processor is further configured to alter a parameter of the removal tool in response to the output.

43. A system, comprising:

a wet cleaning chamber configured to process a specimen; and

a chemically assisted laser removal tool coupled to the wet cleaning chamber, wherein the removal tool is configured to remove particles from the specimen.

44. The system of claim 43, wherein the particles are located on frontside and backside surfaces of the specimen.

45. The system of claim 43, wherein the removal tool is further coupled to the wet cleaning chamber by a common handler.

46. The system of claim 43, further comprising a measurement device configured to detect defects present on the specimen.

47. The system of claim 46, further comprising a processor coupled to the measurement device and the removal tool, wherein the processor is configured to receive output from the measurement device, wherein the output is responsive to the defects detected on the specimen, and wherein the processor is further configured to alter a parameter of the removal tool in response to the output.

48. A system, comprising:

a cluster tool comprising at least one process chamber and a measurement device configured to detect defects present on a specimen; and

a cleaning chamber coupled to the cluster tool by a common handler, wherein the cleaning chamber is configured to process a single specimen.

49. The system of claim 48, further comprising a processor coupled to the measurement device and the at least one process chamber or the cleaning chamber, wherein the processor is configured to receive output from the measurement device, wherein the output is responsive to the defects detected on the specimen, and wherein the processor is further configured to alter a parameter of the at least one process chamber or the cleaning chamber in response to the output.

50. A system, comprising:

a measurement device configured to detect defects present on a specimen;

a processor coupled to the measurement device, wherein the processor is configured to analyze output from the measurement device to determine which of the defects are repairable by localized defect repair and which of the defects are repairable by processing the entire specimen; and

an inspection tool configured to detect defects remaining on the specimen subsequent to the localized defect repair or said processing the entire specimen;

wherein the processor is further configured to alter a parameter of an instrument coupled to a process chamber used to process the specimen in response to the defects remaining on the specimen subsequent to the repair.

51. The system of claim 50, wherein said processing the entire specimen comprises cleaning.

52. The system of claim 50, wherein the localized defect repair comprises removing the defects with chemically assisted laser removal, removing the defects with laser induced shock wave removal, or particle beam assisted repair.

53. The system of claim 50, wherein the processor is further configured to determine if the defects should be repaired or if the specimen should be further processed.

54. A method, comprising:

processing a specimen;

detecting defects present on the specimen subsequent to the processing;

analyzing the defects to determine if there is a problem with the processing and to determine which of the defects are repairable by localized defect repair and which of the defects are repairable by processing the entire specimen; and

if it is determined that there is a problem with the processing, altering a parameter of the processing prior to processing additional specimens.

55. The method of claim 54, wherein said analyzing comprises processing data responsive to the defects to determine if the defects are formed on the specimen due to individual process marginalities or by interactions of multiple processes.

56. The method of claim 54, wherein said analyzing comprises determining if characteristics, locations, numbers, or types of the defects are outside of a predetermined range.