Method and apparatus for plasma-mediated thermo-electrical ablation

• US 7,238,185 B2
• Filed: 04/16/2004
• Issued: 07/03/2007
• Est. Priority Date: 05/03/2002
• Status: Active Grant

• Current Assignee: Board of Trustees of the Leland Stanford Junior University (Stanford Management Co.)
• Original Assignee: Board of Trustees of the Leland Stanford Junior University (Stanford Management Co.)
• Inventors: Palanker, Daniel V., Vankov, Alexander B.
• Primary Examiner(s): Peffley; Michael
• Assistant Examiner(s): VRETTAKOS, PETER J
• Application Number:
  US10/825,716
• Publication Number:
  US 20040199157A1
• Time in Patent Office: 1,173 Days
• Field of Search: 128/898, 606 27- 52
• US Class Current: 606/41
• CPC Class Codes: A61B 18/042 using additional gas becoming plasma
• CPC Class Codes: A61B 18/14 Probes or electrodes therefor
• CPC Class Codes: A61B 2018/00577 Ablation
• CPC Class Codes: A61B 2018/00601 Cutting
• CPC Class Codes: A61B 2018/00625 Vaporization
• CPC Class Codes: A61B 2018/1213 creating an arc
• CPC Class Codes: A61B 2018/122 ionizing, with corona
• CPC Class Codes: A61B 2018/1472 for use with liquid electrolyte, e.g. virtual electrodes
• CPC Class Codes: H05H 1/48 using an arc H05H1/26 takes precedence
• CPC Class Codes: H05H 2245/32 Surgery, e.g. scalpels, blades or bistoury; Treatments inside the body

Abstract

An apparatus and method for cutting a material including conducting and non-conducting materials such as biological tissue, cellulose or plastic while the material is submerged in a conductive liquid medium. The apparatus has a cutting electrode with an elongate cutting portion having an aspect ratio (length to width) of 1 or more and a return electrode. The two electrodes are immersed in the conductive medium and a voltage is applied between them to heat the medium, thus producing a vapor cavity around the elongate cutting portion and ionizing a gas inside the vapor cavity to produce a plasma. The voltage applied between the electrodes is modulated in pulses having a modulation format selected to minimize the size of the vapor cavity, its rate of formation and heat diffusion into the material while the latter is cut with an edge of the elongate cutting portion. The modulation format includes pulses ranging in duration from 10 μs to 10 ms, as well as minipulses and micropulses, as necessary. The apparatus and method of invention allow the user to perform efficient thermal ablation and electrosurgical procedures in particular at power levels as low as 10 mW with minimal thermal and cavitation damage.

Claims

1. A method for cutting a material submerged in a conductive liquid medium, said method comprising:

a) providing a cutting electrode having an elongate cutting portion;

b) providing a return electrode;

c) immersing said cutting electrode and said return electrode in said conductive liquid medium;

d) applying a voltage between said cutting electrode and said return electrode such that said conductive liquid medium is heated to produce a vapor cavity around said elongate cutting portion and to ionize a gas inside said vapor cavity to produce a plasma;

e) modulating said voltage in a modulation format comprising pulses separated by a pulse interval greater than 1 ms, wherein each of said pulses comprises a plurality of minipulses separated by a minipulse interval of less than 1 ms; and

f) cutting said material with an edge of said elongate cutting portion.

2. The method of claim 1, wherein said pulses have a pulse duration selected in the range substantially between 10 μ

s and 10 ms.

3. The method of claim 2, wherein the voltage of said pulses is varied during said pulse duration, such that a low voltage is applied for electrochemical generation of said gas and a high voltage is applied for generation of said plasma.

4. The method of claim 1, wherein said minipulses have a minipulse duration selected in the range between 0.1 and 10 μ

s and said minipulse interval is selected in the range between 0.1 and 10 μ

s.

5. The method of claim 4, wherein said minipulse duration and a peak power are adjusted to permit spark discharges and to prevent are discharges.

6. The method of claim 1, wherein each of said minipulses comprises micropulses having a micropulse duration selected in the range between 0.1 and 1 μ

s.

7. The method of claim 1, wherein said minipulse interval is shorter than a lifetime of said vapor cavity, and wherein said pulse interval is greater than said lifetime.

8. The method of claim 1, wherein said minipulses exhibit alternating positive and negative polarities.

9. The method of claim 1, wherein said plasma has a temperature greater than 100°

C.

10. The method of claim 1, wherein the temperature of said elongate cutting portion is maintained between about 100 and 1,000°

C.

11. The method of claim 1, further comprising preventing charge transfer to said material.

12. The method of claim 1, wherein said material is selected from the group consisting of biological tissue, cellulose and plastics.

13. The method of claim 1, wherein said elongate cutting portion has an aspect ratio of length to width larger than 1.

14. The method of claim 13, wherein said aspect ratio is larger than 5.

15. The method of claim 1, wherein said elongate cutting portion has a width between 1 and 250 microns.

16. The method of claim 15, wherein said elongate cutting portion has a width between 10 and 100 microns.

17. The method of claim 1, wherein said elongate cutting portion is a wire with diameter between 1 and 250 microns.

18. The method of claim 17, wherein said elongate cutting portion is a wire with diameter between 10 and 100 microns.

19. A method for cutting a biological tissue, comprising:

providing a cutting electrode having an elongate cutting portion;

providing a return electrode;

applying a voltage between said cutting electrode and said return electrode;

such that a vapor cavity is produced around said elongate cutting portion and gas inside said vapor cavity is ionized to produce a plasma;

modulating said voltage in a modulation format comprising pulses separated by a pulse interval greater than 1 ms, wherein each of said pulses comprises plurality of minipulses separated by a minipulse interval of less than 1 ms; and

cutting said biological tissue with an edge of said elongate cutting portion.

20. The method of claim 19, wherein said pulses have a pulse duration selected in the range substantially between 10 μ

s and 1 μ

s.

21. The method of claim 19, wherein the voltage of said pulses is varied during said pulse duration, such that a low voltage is applied for electrochemical generation of said gas and a high voltage is applied for generation of said plasma.

22. The method of claim 19, wherein said minipulses have a minipulse duration selected in the range between 0.1 and 10 μ

s.

23. The method of claim 19, wherein said minipulse duration and a peak power are adjusted to permit spark discharges and to prevent arc discharges.

24. The method of claim 19, wherein each of said minipulses comprises micropulses having a micropulse duration selected in the range between 0.1 and 1 μ

s.

25. The method of claim 19, wherein said minipulse interval is shorter than a lifetime of said vapor cavity, and wherein said pulse interval is greater than said lifetime.

26. The method of claim 19, wherein said minipulses exhibit alternating positive and negative polarities.

27. The method of claim 19, wherein said plasma has a temperature greater than 100°

C.

28. The method of claim 19, wherein the temperature of said elongate cutting portion is maintained between about 100 and 1,000°

C.

29. The method of claim 19, further comprising preventing charge transfer to said biological tissue.

30. The method of claim 19, wherein said elongate cutting portion has an aspect ratio of length to width larger than 1.

31. The method of claim 30, wherein said aspect ratio is larger than 5.

32. The method of claim 19, wherein said elongate cutting portion has a width between 1 and 250 microns.

33. The method of claim 32, wherein said elongate cutting portion has a width between 10 and 100 microns.

34. The method of claim 19, wherein said elongate cutting portion is a wire with diameter between 1 and 250 microns.

35. The method of claim 34, wherein said elongate cutting portion is a wire with diameter between 10 and 100 microns.