Flexible wiring board for tape carrier package having improved flame resistance
First Claim
1. A flexible wiring board for tape carrier package having improved flame resistance, comprisingan insulating film having a bending slit,a wiring pattern formed on the insulating film and crossing the bending slit,an adhesive layer adhering the wiring pattern to the insulating film,a flex resin layer protecting at least one side of the wiring pattern at the bending slit, andan overcoat layer protecting a region where the wiring pattern is formed;
- wherein the overcoat layer is a layer of cured material of a curable resin composition having such a property that, when cured into a form of film, the film has an initial modulus of 10 to 1,500 MPa at 25°
C., an electrical insulation of sufficient level, a soldering resistance of 10 seconds at 260°
C., and an oxygen index exceeding 22.0.
2 Assignments
0 Petitions
Accused Products
Abstract
A flexible wiring board for tape carrier package having improved flame resistance is disclosed. The flexible wiring board has an insulating film having a bending slit, a wiring pattern formed thereon and crossing the bending slit, an adhesive layer adhering the wiring pattern to the insulating film, a flex resin layer protecting the wiring pattern at the bending slit, and an overcoat layer protecting the wiring pattern, in which the overcoat layer is obtained from a curable resin composition, when cured into a form of film, the film has an initial modulus of 10 to 1,500 MPa at 25° C., an electrical insulation of sufficient level, a soldering resistance of 10 seconds at 260° C., and an oxygen index exceeding 22.0.
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Citations
10 Claims
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1. A flexible wiring board for tape carrier package having improved flame resistance, comprising
an insulating film having a bending slit, a wiring pattern formed on the insulating film and crossing the bending slit, an adhesive layer adhering the wiring pattern to the insulating film, a flex resin layer protecting at least one side of the wiring pattern at the bending slit, and an overcoat layer protecting a region where the wiring pattern is formed; wherein the overcoat layer is a layer of cured material of a curable resin composition having such a property that, when cured into a form of film, the film has an initial modulus of 10 to 1,500 MPa at 25°
C., an electrical insulation of sufficient level, a soldering resistance of 10 seconds at 260°
C., and an oxygen index exceeding 22.0.- View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
Specification