×

Attachment of integrated circuit structures and other substrates to substrates with vias

  • US 7,241,675 B2
  • Filed: 03/10/2004
  • Issued: 07/10/2007
  • Est. Priority Date: 12/17/2003
  • Status: Expired due to Term
First Claim
Patent Images

1. A manufacturing method comprising:

  • forming one or more conductive contact pads in a first substrate at a top surface of the first substrate;

    forming dielectric over the top surface, with the dielectric having one or more openings which overlie the contact pads and also overlie one or more regions adjacent to the contact pads;

    placing solder paste into the one or more openings; and

    heating the solder paste in the one or more openings to melt the solder and to solder one or more contact pads of a second substrate to the one or more contact pads of the first substrate with solder obtained from the solder paste, the dielectric being present over the top surface of the first substrate during soldering.

View all claims
  • 6 Assignments
Timeline View
Assignment View
    ×
    ×