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Processing method for protection of backside of a wafer

  • US 7,241,693 B2
  • Filed: 04/18/2005
  • Issued: 07/10/2007
  • Est. Priority Date: 04/18/2005
  • Status: Active Grant
First Claim
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1. A processing method for protection of a backside of a wafer in process of a transferring system;

  • comprising;

    providing said wafer having a topside and said backside opposite thereto, wherein said wafer comprises a semiconductor device region near said topside and said semiconductor device region comprises a IC device region, a dielectric layer and a plurality of conductive structures;

    forming a first barrier layer on said backside, wherein said first barrier layer be used as a mask for following process; and

    forming a first protective layer on and adjacent to said barrier layer of said backside.

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