Method of manufacturing a data carrier
First Claim
Patent Images
1. A support strip comprising:
- at least one roughly parallel gripping area; and
a first support element and at least a second support element,wherein the first support element comprises a first set of conducting elements, each of said conducting elements having a contact pad and a wiring pad,wherein the second support element comprises a second set of conducting elements, each of said conducting elements having a contact pad and a wiring pad, andwherein the first support element is connected to the at least one gripping area using at least a first snap-off junction area,wherein the second support element is connected to the at least one gripping area using at least a second snap-off junction area, andwherein each support element is configured to be overmoulded to obtain respectively a first and at least a second data carrier body.
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Abstract
A method of manufacturing a data carrier from a support strip includes an overmoulding step, in which at least one support element of the support strip is overmoulded so as to obtain a data carrier body, and a microcircuit-connecting step, in which a microcircuit is electrically connected to the wiring pads of the data carrier body so as to obtain the data carrier.
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Citations
10 Claims
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1. A support strip comprising:
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at least one roughly parallel gripping area; and a first support element and at least a second support element, wherein the first support element comprises a first set of conducting elements, each of said conducting elements having a contact pad and a wiring pad, wherein the second support element comprises a second set of conducting elements, each of said conducting elements having a contact pad and a wiring pad, and wherein the first support element is connected to the at least one gripping area using at least a first snap-off junction area, wherein the second support element is connected to the at least one gripping area using at least a second snap-off junction area, and wherein each support element is configured to be overmoulded to obtain respectively a first and at least a second data carrier body. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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Specification