Miniature silicon condenser microphone
DC CAFCFirst Claim
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1. A surface mountable package for containing a transducer, the transducer being responsive to sound pressure levels of an acoustic signal to provide an electrical output representative of the acoustic signals, the surface mountable package comprising:
- at least a first member and a second member and a chamber being defined by the first member and the second member, the transducer being attached to a surface formed on one of the first member or the second member and the transducer residing within the chamber;
the surface being formed with at least one patterned conductive layer, the patterned conductive layer being electrically coupled to the transducer;
an outside surface of the surface mountable package comprising a plurality of terminal pads electrically coupled to the patterned conductive layer;
a volume being defined by the transducer and one of the first member or the second member, the volume being acoustically coupled to the transducer; and
one of the first member or the second member being formed to include an aperture, the aperture configured to permit the passage of an acoustic signal to the transducer.
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Abstract
A silicon condenser microphone package includes a transducer unit, a substrate, and a cover. The substrate includes an upper surface transducer unit is attached to the upper surface of the substrate and overlaps at least a portion of the recess wherein a back volume of the transducer unit is formed between the transducer unit and the substrate. The cover is placed over the transducer unit and either the cover or the substrate includes an aperture.
207 Citations
29 Claims
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1. A surface mountable package for containing a transducer, the transducer being responsive to sound pressure levels of an acoustic signal to provide an electrical output representative of the acoustic signals, the surface mountable package comprising:
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at least a first member and a second member and a chamber being defined by the first member and the second member, the transducer being attached to a surface formed on one of the first member or the second member and the transducer residing within the chamber; the surface being formed with at least one patterned conductive layer, the patterned conductive layer being electrically coupled to the transducer;
an outside surface of the surface mountable package comprising a plurality of terminal pads electrically coupled to the patterned conductive layer;a volume being defined by the transducer and one of the first member or the second member, the volume being acoustically coupled to the transducer; and one of the first member or the second member being formed to include an aperture, the aperture configured to permit the passage of an acoustic signal to the transducer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29)
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Specification