Transfer assembly for manufacturing electronic devices

• US 7,244,326 B2
• Filed: 05/13/2004
• Issued: 07/17/2007
• Est. Priority Date: 05/16/2003
• Status: Expired due to Fees

• Current Assignee: RUIZHANG TECHNOLOGY LIMITED COMPANY
• Original Assignee: Alien Technology Corporation
• Inventors: Craig, Gordon S. W., Schatz, Kenneth D., Hadley, Mark A., Drzaic, Paul S.
• Primary Examiner(s): SELLS, JAMES D
• Application Number:
  US10/846,753
• Publication Number:
  US 20050000634A1
• Time in Patent Office: 1,160 Days
• Field of Search: 156/230, 156/234, 156/235, 156/238, 156/241, 156/325, 156/326, 156/327, 156/538, 156/539, 156/540, 156/541, 156/542, 156/556
• US Class Current: 156/234
• CPC Class Codes: G06K 19/07718 the record carrier being manufactured in a continuous process, e.g. using endless rolls
• CPC Class Codes: G06K 19/07745 Mounting details of integrated circuit chips
• CPC Class Codes: H01L 21/673 using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders holders for supporting a complete device in operation H01L23/32
• CPC Class Codes: H01L 21/6835 using temporarily an auxiliary support
• CPC Class Codes: H01L 2221/68313 Auxiliary support including a cavity for storing a finished device, e.g. IC package, or a partly finished device, e.g. die, during manufacturing or mounting
• CPC Class Codes: H01L 2221/68354 used to support diced chips prior to mounting
• CPC Class Codes: H01L 2223/54473 for use after dicing
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/0401 Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/04105 Bonding areas formed on an encapsulation of the semiconductor or solid-state body, e.g. bonding areas on chip-scale packages
• CPC Class Codes: H01L 2224/20 Structure, shape, material or disposition of high density interconnect preforms
• CPC Class Codes: H01L 2224/7665 Means for transporting the components to be connected
• CPC Class Codes: H01L 2224/81801 Soldering or alloying
• CPC Class Codes: H01L 2224/83192 wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/92144 the second connecting process involving a build-up interconnect
• CPC Class Codes: H01L 2224/95085 being a liquid, e.g. for fluidic self-assembly
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 23/544 Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps test patterns for characterising or monitoring manufacturing processes H01L22/00
• CPC Class Codes: H01L 24/19 Manufacturing methods of high density interconnect preforms
• CPC Class Codes: H01L 24/76 Apparatus for connecting with build-up interconnects
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 24/95 : at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01039 : Yttrium [Y]
• CPC Class Codes: H01L 2924/01043 : Technetium [Tc]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01057 : Lanthanum [La]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/10329 : Gallium arsenide [GaAs]
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/12043 : Photo diode
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/1461 : MEMS
• CPC Class Codes: H01L 2924/15153 : the die mounting substrate comprising a recess for hosting the device
• CPC Class Codes: H01L 2924/15155 : the shape of the recess being other than a cuboid
• CPC Class Codes: H01L 2924/15165 : Monolayer substrate
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/30105 : Capacitance
• CPC Class Codes: H05K 2201/10636 : Leadless chip, e.g. chip capacitor or resistor
• CPC Class Codes: H05K 2203/0173 : Template for holding a PCB having mounted components thereon
• CPC Class Codes: H05K 3/303 : Surface mounted components, e.g. affixing before soldering, aligning means, spacing means H05K3/32 takes precedence
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product
• CPC Class Codes: Y10T 156/17 : Surface bonding means and/or assemblymeans with work feeding or handling means
• CPC Class Codes: Y10T 156/171 : Means serially presenting discrete base articles or separate portions of a single article
• CPC Class Codes: Y10T 156/1744 : Means bringing discrete articles into assembled relationship
• CPC Class Codes: Y10T 156/1798 : with liquid adhesive or adhesive activator applying means

Abstract

A method for assembling a device. The method comprises placing a functional element in a first opening formed in a template substrate and transferring the functional element to a device substrate having a second opening formed therein wherein the functional element is held within the second opening and against an adhesive film coupled to the device substrate.

Claims

1. A method for assembling a device comprising:

placing a functional element in a first opening formed in a template substrate using a fluidic self-assembly process (FSA) and a web process; and

transferring the functional element to a device substrate having a second opening formed therein wherein the functional element is held within the second opening and against an adhesive film coupled to the top of the device substrate, wherein said transferring includes pressing the adhesive film through the second opening so that an adhesive side of the adhesive film adheres to the functional element through the second opening and transfers the functional element out of the first opening in the template substrate into the second opening of the device substrate.

2. The method of claim 1 further comprising:

forming at least one interconnection to the functional element.

3. The method of claim 1 wherein the adhesive film is at least one of a dielectric film, a pressure sensitive adhesive, a heat-activated adhesive, chemically-activated adhesive, microwave frequency activated adhesive, radio frequency activated adhesive, radiation-activated adhesive, a laser ablatable adhesive, and an anisotropically-conductive adhesive and wherein the adhesive film is placed over the device substrate and wherein said second opening is formed completely through the device substrate.

4. The method of claim 3 wherein the adhesive film is a dielectric film and the method further comprises:

forming a via through the dielectric film to allow for an electrical connection to the functional element.

5. The method of claim 4 further comprising:

forming an electrical connection to the functional element.

6. The method of claim 1 further comprising:

forming a conductive trace on a surface of the device substrate; and

interconnecting the conductive trace to the functional element.

7. The method of claim 1 wherein the conductive trace is formed on top of the adhesive film.

8. The method of claim 6 wherein the interconnecting of the conductive trace to the functional element is accomplished through a via created in the adhesive film.

9. The method of claim 6 wherein the interconnecting of the conductive trace to the functional element is accomplished through the adhesive film, wherein the adhesive film is an anisotropically conductive adhesive.

10. The method of claim 1 further comprising:

forming an antenna trace on the surface of the device substrate; and

interconnecting the antenna trace to the functional element.

11. The method of claim 10 wherein the antenna trace is formed on top of the adhesive film.

12. The method of claim 10 wherein the functional element is a radio frequency control element.

13. The method of claim 10 wherein the interconnecting of the conductive trace to the functional element is accomplished through a via created in the adhesive film.

14. The method of claim 10 wherein the interconnecting of the conductive trace to the functional element is accomplished through the adhesive film, wherein the adhesive film is an anisotropically-conductive adhesive.

15. The method of claim 1 further comprising:

placing, using said FSA process, a plurality of said functional elements in a plurality of said first openings formed in the template substrate;

transferring at least one functional element selected from the plurality of functional elements to the second opening formed in the device substrate.

16. The method of claim 15 wherein the plurality of first openings in the template substrate are in one or more regular patterns designed to match a pattern of the second openings in the device substrate.

17. The method of claim 15 wherein the plurality of first openings in the template substrate are in one or more arrays designed to match an array pattern of the second openings in the device substrate.

18. The method of claim 15 wherein the plurality of first openings in the template substrate are in an array in which a pitch between the first openings in an orthogonal direction is equal to a corresponding pitch of the second openings in the device substrate.

19. The method of claim 15 wherein the plurality of first openings in the template substrate are in an array in which a pitch between the first openings in an orthogonal direction is equal to a corresponding pitch of the second openings divided by an integer number.

20. The method of claim 1 wherein the template substrate is selected from a group consisting of a silicon wafer, a plastic film, a glass sheet, and a multilayer film comprising a combination thereof.

21. The method of claim 1 wherein functional element is an integrated circuit.

22. The method of claim 1 further comprising:

filling a gap in the second opening in the device substrate.

23. The method of claim 22 wherein filling a gap in the second opening in the device substrate is accomplished with at least one of UV-curable epoxy, and thermoset resin.

24. The method of claim 1 further comprising:

laminating the adhesive film over a surface of the device substrate prior to the transferring of the functional element.

25. The method of claim 1 further comprising:

laminating additional films over a surface of the device substrate.

26. The method of claim 1 further comprising:

forming at least one of a top contact and a bottom contact on the functional element.

27. The method of claim 1 further comprising:

forming electrical interconnection to at least one of the top contact and the bottom contact on the functional element.

37. The method of claim 1 wherein the adhesive film is a temporary adhesive film.

38. The method of claim 37 further comprise filling a gap in the second opening in the device substrate and removing the adhesive film.

41. The method of claim 7 wherein the interconnecting of the conductive trace to the functional element is accomplished through a via created in the adhesive film.

42. The method of claim 7 wherein the interconnecting of the conductive trace to the functional element is accomplished through the adhesive film, wherein the adhesive film is an anisotropically conductive adhesive.

28. A method for assembling a device comprising:

transferring a first functional element to a device substrate having a first opening formed therein, the first functional element is held within the first opening and against an adhesive film coupled to the top of the device substrate and the first functional element is transferred to the first opening from a first template substrate having the first functional element deposited therein; and

transferring a second functional element to the device substrate having a second opening formed therein, the second functional element is held within the second opening and against the adhesive film coupled to the top of the device substrate and the second functional element is transferred to the second opening from a second template substrate having the second functional element deposited therein;

wherein

transferring the first functional element to the first opening comprises pressing the adhesive film through the first opening so that an adhesive side of the adhesive film adheres to the first functional element and transfers the first functional element out of the first opening in the template substrate into the first opening of the device substrate transferring of the first functional element tc the device substrate; and

transferring the second functional element to the second opening comprises pressing the adhesive film through the second opening so that an adhesive side of the adhesive film adheres to the second functional element and transfers the second functional element out of the second opening in the second template substrate into the second opening of the device substrate.

29. The method of claim 28 wherein the first functional element and the second functional element is at least one of different material from one another, different functionality from one another, different shape from one another, and different size from one another.

30. The method of claim 28 wherein the first functional element and the second functional element is selected from a group consisting of thin film transistor, passive electrical element, capacitor, inductor, resistor, diode, optical element, photodiode, light emitter, and microelectronic mechanical system (MEMS), microprocessor, memory structure, radio frequency transceiver, communications element, sensor, power source, energy storage, electromagnetic radiation emitting element, electromagnetic radiation reflecting element, display driver, display pixel element, and display element.

31. The method of claim 28 wherein the first functional element is deposited in the first template substrate using fluidic-self assembly processing.

32. The method of claim 28 wherein the second functional element is deposited in the second template substrate using fluidic-self assembly processing.

39. The method of claim 28 wherein the adhesive film is a temporary adhesive film.

40. The method of claim 39 further comprising:

filling a gap in the second opening in the device substrate and removing the adhesive film.

33. A method for assembling a device, the method comprising:

placing a plurality of functional elements in a corresponding plurality of first openings formed in a first substrate;

transferring only a portion of said plurality of functional elements to a second substrate having at least one second opening, wherein an adhesive film is coupled to the top of said second substrate and having at least a portion exposed in said at least one second opening in said second substrate and wherein said transferring comprises pressing said adhesive film through said second opening such that an adhesive side of said adhesive film adheres to the portion of said plurality of functional elements and transfer the portion of said plurality of functional elements out of its location in the plurality of first openings in the first substrate to said at least one second opening in the second substrate.

34. The method of claim 33 wherein the placing comprises a fluid self assembly process wherein a slurry of functional elements is created and dispensed over the first substrate and the functional elements become disposed in the first openings;

and wherein the transferring comprises preventing at least one functional element from being transferred to the second substrate.

35. The method of claim 33 further comprising:

aligning the first substrate to the second substrate so that only the portion is transferred.

36. The method of claim 33 wherein the transferring occurs at a first time and wherein the method further comprises a further transferring of another portion of the plurality of functional elements from the first substrate to the second substrate.

43. A method for assembling a device comprising:

transferring a functional element to a device substrate having an opening formed therein wherein the functional element is held within the opening and against an adhesive film coupled to the device substrate, and wherein the functional element is transferred from a plurality of functional elements that are disposed on a handle substrate format and temporarily held in place on the handle substrate, wherein the adhesive film is coupled to the top of said device substrate and having at least a portion over the opening exposed to contact said functional element and wherein said transferring comprises pressing said exposed adhesive film over the opening toward said handle substrate such that an adhesive side of said adhesive film adheres to said functional element and transfers said functional element disposed on the handle substrate into the opening of said device substrate.

44. The method of claim 43 further comprises releasing the functional element from the handle substrate.

45. The method of claim 43 further comprising:

interconnecting a conductive trace to the functional element.

46. The method of claim 45 wherein the conductive trace is one of formed on top of the adhesive film and formed on a surface of the device substrate.

47. The method of claim 45 wherein the interconnecting of the conductive trace to the functional element is accomplished through a via created in the adhesive film.

48. The method of claim 45 wherein the interconnecting of the conductive trace to the functional element is accomplished through the adhesive film, wherein the adhesive film is an anisotropically conductive adhesive.

49. The method of claim 43 further comprising:

interconnecting an antenna trace to the functional element.

50. The method of claim 49 wherein the antenna trace is one of formed on top of the adhesive film and formed on a surface of the device substrate.

51. The method of claim 49 wherein the functional element is a radio frequency control element.

52. The method of claim 49 wherein the interconnecting of the conductive trace to the functional element is accomplished through a via created in the adhesive film.

53. The method of claim 49 wherein the interconnecting of the conductive trace to the functional element is accomplished through the adhesive film, wherein the adhesive film is an anisotropically-conductive adhesive.

54. A method for assembling a device comprising:

transferring a functional element to a first opening in a template substrate, the first opening selected from a set of openings formed on the template substrate, the functional element selected from a set of functional elements that are disposed on a handle substrate and temporarily held in place on the handle substrate, the set of openings having a pattern matching the pattern of the set of functional elements on the handle substrate; and

transferring the functional element from the first opening to a second opening formed therein in a device substrate, the device substrate having an adhesive film coupled thereto, the adhesive film holding the functional element against the second opening;

wherein the adhesive film is coupled to the top of said device substrate and having at least a portion exposed to contact said functional element and wherein said transferring comprises pressing said adhesive film toward said handle substrate such that an adhesive side of said adhesive film adheres to said functional element and transfers the functional element from the handle substrate to said device substrate.

55. The method of claim 54 further comprises releasing the functional element from the handle substrate.

56. The method of claim 54 further comprising:

interconnecting a conductive trace to the functional element.

57. The method of claim 56 wherein the conductive trace is one of formed on top of the adhesive film and formed on a surface of the device substrate.

59. The method of claim 56 wherein the interconnecting of the conductive trace to the functional element is accomplished through the adhesive film, wherein the adhesive film is an anisotropically conductive adhesive.

60. The method of claim 54 further comprising:

interconnecting an antenna trace to the functional element.

61. The method of claim 60 wherein the antenna trace is one of formed on top of the adhesive film and formed on a surface of the device substrate.

62. The method of claim 60 wherein the functional element is a radio frequency control element.

63. The method of claim 60 wherein the interconnecting of the conductive trace to the functional element is accomplished through a via created in the adhesive film.

64. The method of claim 60 wherein the interconnecting of the conductive trace to the functional element is accomplished through the adhesive film, wherein the adhesive film is an anisotropically-conductive adhesive.

58. The method of 56 wherein the interconnecting of the conductive trace to the functional element is accomplished through a via created in the adhesive film.