Micro-electromechanical structure resonator frequency adjustment using radiant energy trimming and laser/focused ion beam assisted deposition

• US 7,245,057 B2
• Filed: 01/22/2004
• Issued: 07/17/2007
• Est. Priority Date: 12/15/2000
• Status: Expired due to Fees

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Ma, Qing, Rao, Valluri, Cheng, Peng
• Primary Examiner(s): Dougherty; Thomas M.
• Application Number:
  US10/763,779
• Publication Number:
  US 20040148771A1
• Time in Patent Office: 1,272 Days
• Field of Search: 310/309, 310/311, 310/321, 310330-332, 310/348, 310/363, 310/312
• US Class Current: 310/312
• CPC Class Codes: B81B 2201/0271 Resonators; ultrasonic resonators
• CPC Class Codes: B81C 1/0015 Cantilevers switches using MEMS H01H1/0036; electrostatic relays using micromechanics H01H59/0009; microelectro-mechanical resonators H03H9/02244
• CPC Class Codes: B81C 2201/053 Depositing a protective layers
• CPC Class Codes: H03H 2009/02511 Vertical, i.e. perpendicular to the substrate plane
• CPC Class Codes: H03H 9/02393 Post-fabrication trimming of parameters, e.g. resonance frequency, Q factor
• CPC Class Codes: H03H 9/2405 of microelectro-mechanical resonators
• CPC Class Codes: Y10T 29/49105 Switch making
• CPC Class Codes: Y10T 29/4916 Simultaneous circuit manufacturing

Abstract

The invention relates to a microbeam oscillator. Tuning of the oscillator is carried out by addition or subtraction of material to an oscillator member in order to change the mass of the oscillator member.

Claims

1. A micro resonator comprising:

an oscillator member comprising a vibrating portion supported by a pedestal; and

an ablative structure disposed on the vibrating portion, the ablative structure comprising a pattern of spaced-apart stacks, each spaced-apart stack being separated from the oscillator member by a protective pad.

2. The micro resonator according to claim 1 wherein the protective pad is made from aluminum, an aluminum alloy, silver, a silver alloy, indium, or an indium alloy.

3. The micro resonator according to claim 1 wherein the protective pad is made from a refractory metal, a refractory metal oxide, a refractory metal silicide, a refractory metal nitride, or combinations thereof.

4. The micro resonator according to claim 1 wherein the oscillator member is made of a material selected from polysilicon, a metal, a metal nitride, a metal oxide, a metal silicide, or combinations thereof.

5. A microresonator system comprising:

a microresonator having an input and an output and comprising;

an oscillator member comprising a vibrating portion suspended above a substrate by a pedestal,

a drive electrode positioned between the vibrating portion and the substrate,

an ablative structure disposed on the vibrating portion, the ablative structure comprising a pattern of spaced-apart stacks, each spaced-apart stack being separated from the oscillator member by a protective pad;

an input circuit connected to the input; and

an output circuit connected to the output.

6. The micro resonator according to claim 5 wherein the protective pad is made from aluminum, an aluminum alloy, silver, a silver alloy, indium, or an indium alloy.

7. The micro resonator according to claim 5 wherein the protective pad is made from a refractory metal, a refractory metal oxide, a refractory metal silicide, a refractory metal nitride, or combinations thereof.

8. The micro resonator according to claim 5 wherein the oscillator member is made of a material selected from polysilicon, a metal, a metal nitride, a metal oxide, a metal suicide, or combinations thereof.