Methods of processing a workpiece, methods of communicating signals with respect to a wafer, and methods of communicating signals within a workpiece processing apparatus
First Claim
1. A method of processing a workpiece comprising:
- receiving a first workpiece and a second workpiece within a workpiece processing apparatus configured to form a semiconductor device using the first workpiece;
processing the first workpiece within the workpiece processing apparatus to form the semiconductor device; and
communicating signals intermediate the second workpiece and the workpiece processing apparatus.
7 Assignments
0 Petitions
Accused Products
Abstract
An electronic device workpiece processing apparatus and method of communicating signals within an electronic device workpiece processing apparatus are provided. One embodiment of an electronic device workpiece processing apparatus includes a chuck including a surface, an electrical coupling adjacent the surface, and electrical interconnect configured to connect with the electrical coupling of the chuck and conduct signal within the chuck; an intermediate member having a first surface and a second surface and the intermediate member including: and electrical coupling adjacent the first surface and configured to couple with the electrical coupling of the chuck; an electrical coupling adjacent the second surface; and an electrical interconnect configured to connect the electrical coupling adjacent the first surface and the electrical coupling adjacent the second surface; and an electronic device workpiece configured to couple with the second surface of the intermediate member, the electronic device workpiece including a sensor and an electrical coupling configured to provide electrical connection of the sensor with the electrical coupling of the second surface of the intermediate member.
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Citations
30 Claims
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1. A method of processing a workpiece comprising:
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receiving a first workpiece and a second workpiece within a workpiece processing apparatus configured to form a semiconductor device using the first workpiece;
processing the first workpiece within the workpiece processing apparatus to form the semiconductor device; and
communicating signals intermediate the second workpiece and the workpiece processing apparatus. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. A method of communicating signals with respect to a wafer comprising:
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providing a workpiece holder;
supporting a wafer using the workpiece holder;
coupling circuitry of the wafer with circuitry of the workpiece holder;
communicating signals intermaediate the circuitry of the wafer and the circuitry of the workpiece holder; and
wherein the communicating comprises communicating the signals comprising information regarding process conditions of a workpiece processing apparatus. - View Dependent Claims (12, 13, 14, 15)
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16. A method of communicating signals within a workpiece processing apparatus comprising:
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providing a workpiece processing apparatus adapted to form a semiconductor device;
providing a workpiece within the workpiece processing apparatus;
communicating signals using the workpiece;
receiving the signals within the workpiece processing apparatus from the workpiece; and
wherein the communicating comprises communicating the signals comprising process signals comprising information regarding process conditions of the workpiece processing apparatus used to form the semiconductor device. - View Dependent Claims (17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28)
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29. A method of communicating signals within a workpiece processing apparatus comprising:
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providing a workpiece processing apparatus adapted to form a semiconductor device;
providing a workpiece within the workpiece processing apparatus;
communicating signals using the workpiece;
receiving the signals within the workpiece processing apparatus from the workpiece; and
wherein the communicating comprises communicating the signals comprising process signals comprising information regrading a temperature of a surface of the workpiece.
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30. A method of communicating signals within a workpiece processing apparatus comprising:
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providing a workpiece processing apparatus adapted to form a semiconductor device;
providing a workpiece within the workpiece processing apparatus;
communicating signals using the workpiece;
receiving the signals within the workpiece processing apparatus from the workpiece; and
wherein the communicating comprises communicating the signals comprising process signals comprising information regarding temperature information at a plurality of different positions of a surface of the workpiece.
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Specification