Test bus architecture for embedded RAM and method of operating same

• US 7,246,277 B2
• Filed: 06/20/2001
• Issued: 07/17/2007
• Est. Priority Date: 06/20/2001
• Status: Active Grant

• Current Assignee: Integrated Device Technology Incorporated (Renesas Electronics Corporation)
• Original Assignee: Integrated Device Technology Incorporated (Renesas Electronics Corporation)
• Inventors: Lukanc, Jeffrey
• Primary Examiner(s): Lamarre, Guy J.
• Application Number:
  US09/887,913
• Publication Number:
  US 20030009712A1
• Time in Patent Office: 2,218 Days
• Field of Search: 365/750, 380/4, 380/25, 714/718, 714/722, 714/27, 714/30, 714/31, 702117-118
• US Class Current: 714/718
• CPC Class Codes: G11C 29/12 Built-in arrangements for testing, e.g. built-in self testing [BIST] or interconnection details
• CPC Class Codes: G11C 29/48 Arrangements in static stores specially adapted for testing by means external to the store, e.g. using direct memory access [DMA] or using auxiliary access paths

Abstract

A test bus architecture for an integrated circuit chip including a plurality of embedded RAM/register blocks, a corresponding plurality of test modules, and a dedicated test bus. Each RAM/register block is coupled to a corresponding test module, as well as to system circuitry. Each test module is coupled to the test bus. The embedded RAM/register blocks are accessible through the system circuitry during normal operation. During a test mode the embedded RAM/register blocks are accessible through the test modules and test bus. During the test mode, test data values are written to the RAM/register blocks by broadcasting test data values to all of the RAM/register blocks on the test bus. Subsequently, the test data values are read from the RAM/register blocks by individually accessing the RAM/register blocks on the test bus. The test modules are assigned unique addresses, thereby enabling the RAM/register blocks to be addressed during the read operations.

Claims

1. An integrated circuit chip comprising:

a plurality of random access memory (RAM) blocks, wherein each of the RAM blocks is accessible by system circuitry located on the chip during normal operation of the chip;

a plurality of test modules, each being coupled to a corresponding one of the RAM blocks, wherein each of the test modules enables access to a corresponding one of the RAM blocks, independent of the system circuitry; and

a dedicated test bus coupled to each of the test modules, wherein each of the test modules includes circuitry configured to route addresses received on the dedicated test bus to a corresponding one of the RAM blocks, whereby the corresponding one of the RAM blocks is accessed in response to the routed addresses.

2. The integrated circuit chip of claim 1, further comprising:

a plurality of pads; and

a switching structure coupled to the plurality of pads, wherein the switching structure is configured to alternately couple the plurality of pads to the dedicated test bus and the system circuitry.

3. The integrated circuit chip of claim 2, further comprising a JTAG controller configured to control the switching structure.

4. The integrated circuit chip of claim 2, wherein the plurality of RAM blocks comprise dual-port and two-port RAM blocks.

5. The integrated circuit chip of claim 1, wherein the dedicated test bus comprises:

a first set of lines for transmitting address and data signals to the test modules;

a second set of lines for transmitting command signals to the test modules; and

a third set of one or more lines for transmitting a signal for latching the command signals.

6. The integrated circuit chip of claim 5, wherein the dedicated test bus further comprises a fourth set of lines for transmitting byte-enable signals to the test modules.

7. The integrated circuit chip of claim 5, wherein the dedicated test bus further comprises a fourth set of lines for transmitting data values from the test modules.

8. The integrated circuit chip of claim 1, wherein each of the test modules comprises a register for storing a unique address.

9. The integrated circuit chip of claim 1, wherein each of the RAM blocks includes a multiplexer structure for alternately routing input signals from a corresponding test module or the system circuitry, the multiplexer structure being controlled by a signal from the corresponding test module.

10. The integrated circuit chip of claim 1, wherein each of the RAN blocks has a capacity of 32 Kb or less.

11. The integrated circuit chip of claim 1, wherein the dedicated test bus comprises a clock line for routing a clock signal to each of the test modules.

12. The integrated circuit chip of claim 1, wherein each of the test modules further comprises a comparator coupled to receive a unique identification address and the addresses received on the dedicated test bus, wherein the comparator enables a read operation from the corresponding one of the RAM blocks if the unique identification address matches an address received on the dedicated test bus.

13. A method of operating RAN blocks having a capacity less of 32 Kb or less embedded in system circuitry on an integrated circuit chip, the method comprising the steps of:

accessing the RAN blocks through the system circuitry during normal operation of the chip; and

accessing the RAN blocks through a dedicated test bus during a test mode to test the functionality of the RAN blocks prior to normal operation of the chip, wherein the RAN blocks are accessed in response to addresses broadcast on the dedicated test bus.

14. The method of claim 13, further comprising the steps of accessing the RAN blocks through dedicated test modules coupled to the test bus during the test mode.

15. The method of claim 14, further comprising the step of storing a unique address in each of the test modules.

16. The method of claim 13, wherein the chip comprises a plurality of pads, the method further comprising the steps of:

coupling the pads to the system circuitry during normal operation of the chip; and

coupling the pads to the test bus during the test mode.

17. The method of claim 16, further comprising the step of controlling the coupling of the pads using a JTAG controller.

18. The method of claim 13, further comprising the steps of:

writing test data values to the RAM blocks by broadcasting the test data values to all of the RAM blocks on the test bus; and

then

reading test data values from the RAM blocks by individually accessing the RAM blocks on the test bus.

19. The method of claim 18, further comprising the steps of:

writing test data values to RAM blocks having one write port and to the first write port of RAM blocks having more than one write port; and

then

writing test data values to the second write port of RAM blocks having more than one write port.

20. The method of claim 14, further comprising the steps of:

operating the test modules in response to a first clock signal provided on the test bus during the test mode; and

operating the RAM blocks in response to a second clock signal provided on the system circuitry during the test mode, wherein the first clock signal and the second clock signal are independent signals.

21. The method of claim 20, further comprising adjusting edges of the first clock signal relative to edges of the second clock signal.