×

Chip package with capacitor

  • US 7,247,932 B1
  • Filed: 05/19/2000
  • Issued: 07/24/2007
  • Est. Priority Date: 05/19/2000
  • Status: Expired due to Term
First Claim
Patent Images

1. A chip package comprising:

  • a circuit substrate;

    a first chip over said circuit substrate;

    a second chip over said circuit substrate;

    a first bump under said circuit substrate;

    a second bump under said circuit substrate;

    a third bump between said first chip and said circuit substrate, wherein said third bump has a height less than that of said first bump; and

    a first passive device under said circuit substrate, wherein said first passive device is between said first and second bumps.

View all claims
  • 4 Assignments
Timeline View
Assignment View
    ×
    ×