Lithographic apparatus, level sensor, method of inspection, device manufacturing method, and device manufactured thereby

• US 7,248,337 B2
• Filed: 01/14/2004
• Issued: 07/24/2007
• Est. Priority Date: 01/14/2003
• Status: Active Grant

• Current Assignee: ASML Netherlands BV (ASML Holding NV)
• Original Assignee: ASML Netherlands BV (ASML Holding NV)
• Inventors: Teunissen, Paulus Antonius Andreas, Broodbakker, Petrus Johannes Maria, Queens, Rene Marinus Gerardus Johan
• Primary Examiner(s): Kim; Peter B.
• Application Number:
  US10/756,841
• Publication Number:
  US 20040165169A1
• Time in Patent Office: 1,287 Days
• Field of Search: 355/67, 355/53, 355/72, 355/75, 250/492.1, 250/201.2, 359/619, 349/124
• US Class Current: 355/67
• CPC Class Codes: G03F 9/7034 Leveling

Abstract

A level sensor for a lithographic projection apparatus according to one embodiment of the invention includes a light source, a first reflector, a second reflector and a detector. The first reflector is positioned to direct light from the light source towards a wafer surface, and the second reflector is positioned to direct light reflected from the wafer surface to the detector. The first and second reflectors are selected to incur a minimal process dependent apparent surface depression.

Claims

1. A lithographic apparatus comprising a level sensor configured to measure a height of a wafer surface, said level sensor comprising:

a first reflector having at least two layers and being configured to direct a beam from a light source toward the wafer surface; and

a second reflector having at least two layers and being configured to direct the beam from the wafer surface to a detector,

wherein a magnitude of an apparent depression of the wafer surface due to translation of the beam at reflective surfaces of the first and second reflectors is less than thirty-five nanometers.

2. The lithographic apparatus according to claim 1, wherein a magnitude of an apparent depression of the wafer surface due to translation of the beam at reflective surfaces of the first and second reflectors is less than twenty nanometers.

3. The lithographic apparatus according to claim 1, wherein an error in the height of the wafer surface as indicated by a corresponding position of incidence of the beam at the detector is less than seventy nanometers.

4. The lithographic apparatus according to claim 1, wherein the detector is configured to indicate a height of the wafer surface based on a position of incidence of the beam.

5. The lithographic apparatus according to claim 1, wherein a sum of a translation of the beam at a surface of the first reflector, a translation of the beam at a surface of the second reflector, and a translation of the beam at the wafer surface is less than seventy-five nanometers.

6. The lithographic apparatus according to claim 1, wherein a translation of the beam at a surface of the first reflector is less than ten percent of a central wavelength of the beam.

7. The lithographic apparatus according to claim 1, wherein the first reflector includes:

a first surface configured to direct the beam toward the wafer surface; and

a second surface that is oriented in a same direction as the first surface, the second surface being configured to direct the beam toward the first surface.

8. The lithographic apparatus according to claim 1, wherein the second reflector includes:

a first surface configured to direct the beam to the detector; and

a second surface that is oriented in a same direction as the first surface, the second surface being configured to direct the beam toward the first surface.

9. The lithographic apparatus according to claim 1, wherein each among said first and second reflectors comprises a mirror.

10. The lithographic apparatus according to claim 9, wherein a reflective surface of at least one of said mirrors comprises gold.

11. The lithographic apparatus according to claim 9, wherein a reflective surface of at least one of said mirrors comprises a dielectric material.

12. The lithographic apparatus according to claim 9, wherein a reflective surface of each of said mirrors comprises a metal, and

wherein the reflective surface of at least one of said mirrors has a transparent coating.

13. The lithographic apparatus according to claim 12, wherein a reflective surface of at least one of said mirrors comprises at least one of silver and aluminum.

14. The lithographic apparatus according to claim 12, wherein said coating comprises at least one of aluminum oxide, magnesium fluoride, and silicon oxide.

15. A method comprising:

positioning a first reflector of a level sensor of a lithographic apparatus to direct a light beam from a light source toward a surface of a wafer, wherein the first reflector includes at least two layers;

positioning a second reflector of a level sensor of a lithographic apparatus to direct the beam from the surface of the wafer to a detector, wherein the second reflector includes at least two layers; and

selecting the first and second reflectors to obtain a minimum total effective translation of the beam at the surfaces of the first and second reflectors.

16. The method according to claim 15, wherein said selecting the first and second reflectors includes selecting the first and second reflectors to incur a minimal process-dependent apparent surface depression.

17. The method according to claim 15, wherein said selecting the first and second reflectors includes selecting the first and second reflectors to obtain a magnitude of an apparent depression of the surface of the wafer due to translation of the beam at reflective surfaces of the first and second reflectors of Less than thirty-five nanometers.

18. The method according to claim 15, said method further comprising:

calibrating the level sensor with respect to a wafer-processing procedure; and

applying a result of said calibrating to a height measurement obtained using a level sensor of another lithographic apparatus.

19. A lithographic method comprising:

using a first reflector of a level sensor of a lithographic apparatus to direct a light beam from a light source toward a wafer surface, wherein the first reflector includes at least two layers;

using a second reflector of the level sensor of the lithographic apparatus to direct the beam from the wafer surface to a detector, wherein the second reflector includes at least two layers; and

determining a height of the surface of the wafer based on the beam incident on the detector,

wherein a magnitude of an apparent depression of the surface of the wafer due to translation of the beam at reflective surfaces of the first and second reflectors is less than thirty-five nanometers.

20. The lithographic method according to claim 19, wherein an error in the height of the wafer surface as indicated by a corresponding position of incidence of the beam at the detector is less than seventy nanometers.

21. The lithographic method according to claim 19, wherein a total effective translation of the beam at the surfaces of the first and second reflectors is less than twenty-five nanometers.

22. The lithographic method according to claim 19, said method further comprising changing at least one of a position and an attitude of the wafer based on the determined height.

23. The lithographic method according to claim 19, said method further comprising exposing a radiation-sensitive portion of the wafer based on the determined height.

24. A lithographic apparatus comprising a level sensor configured to measure a height of a wafer surface, said level sensor comprising:

a first reflector configured to direct a beam from a light source toward the wafer surface, wherein the first reflector includes at least two layers; and

a second reflector configured to direct the beam from the wafer surface to a detector, wherein the second reflector includes at least two layers, and

wherein the first reflector and the second reflector are selected to obtain a minimum total effective translation of the beam at the surfaces of the first reflector and the second reflector.