Electrochemically fabricated structures having dielectric or active bases and methods of and apparatus for producing such structures

• US 7,250,101 B2
• Filed: 05/07/2003
• Issued: 07/31/2007
• Est. Priority Date: 05/07/2002
• Status: Expired due to Term

• Current Assignee: Microfabrica Incorporated (Technoprobe S.P.A.)
• Original Assignee: Microfabrica Incorporated (Technoprobe S.P.A.)
• Inventors: Smalley, Dennis R., Cohen, Adam L., Lockard, Michael S., Thompson, Jeffrey A.
• Primary Examiner(s): Wong; Edna
• Application Number:
  US10/434,493
• Publication Number:
  US 20040004002A1
• Time in Patent Office: 1,546 Days
• Field of Search: 205/67, 205/118, 205/220, 205/221, 205/222, 205/223
• US Class Current: 205/67
• CPC Class Codes: B33Y 10/00 Processes of additive manufacturing
• CPC Class Codes: B81C 1/00126 Static structures not provided for in groups B81C1/00031 - B81C1/00119
• CPC Class Codes: B81C 2201/0181 Physical Vapour Deposition [PVD], i.e. evaporation, sputtering, ion plating or plasma assisted deposition, ion cluster beam technology
• CPC Class Codes: B81C 2201/0188 Selective deposition techniques not provided for in B81C2201/0184 - B81C2201/0187
• CPC Class Codes: B81C 2201/019 Bonding or gluing multiple substrate layers

Abstract

Multilayer structures are electrochemically fabricated on a temporary (e.g. conductive) substrate and are thereafter bonded to a permanent (e.g. dielectric, patterned, multi-material, or otherwise functional) substrate and removed from the temporary substrate. In some embodiments, the structures are formed from top layer to bottom layer, such that the bottom layer of the structure becomes adhered to the permanent substrate, while in other embodiments the structures are form from bottom layer to top layer and then a double substrate swap occurs. The permanent substrate may be a solid that is bonded (e.g. by an adhesive) to the layered structure or it may start out as a flowable material that is solidified adjacent to or partially surrounding a portion of the structure with bonding occurs during solidification. The multilayer structure may be released from a sacrificial material prior to attaching the permanent substrate or it may be released after attachment.

Claims

1. An electrochemical fabrication process for producing a three-dimensional structure from a plurality of adhered layers, the process comprising:

(A) selectively depositing a first material onto a temporary substrate or onto previously deposited material on the temporary substrate to form a portion of a layer and depositing at least a second material to form another portion of the layer, wherein one of the first material or the second material comprises a structural material and the other comprises a sacrificial material, and wherein the depositing of the first material or the second material comprises an electrodeposition operation;

(B) forming the plurality of adhered layers such that successive layers are formed adjacent to and adhered to previously formed layers, wherein said forming comprises repeating (A) a plurality of times to form an embedded structure;

(C) after formation of the plurality of adhered layers, attaching a structural substrate comprising a dielectric material to at least a portion of a layer of the embedded structure and separating the temporary substrate from the embedded structure; and

(D) after attaching the structural substrate, removing at least a portion of the sacrificial material from multiple layers and from the embedded structure to release the three-dimensional structure.

2. The process of claim 1 additionally comprising:

supplying a plurality of preformed masks, wherein each mask comprises a patterned dielectric material that includes at least one opening through which deposition can take place, and wherein each mask comprises a support structure that supports the patterned dielectric material,

wherein for a plurality of layers, the forming of adhered layers in (B) further comprises;

(1) contacting the previously deposited material and the dielectric material of a selected preformed mask;

(2) in the presence of a plating solution, conducting an electric current through the at least one opening in the selected mask between an anode and the previously deposited material, wherein the previously deposited material functions as a cathode, such that the first material is deposited onto the previously deposited material to form at least the portion of a layer; and

(3) separating the selected preformed mask from the previously deposited material.

3. The process of claim 1 wherein for a plurality of layers the forming of adhered layers in (B) further comprises:

(1) providing an adhered patterned mask on a surface of the previously deposited material, wherein the mask includes at least one opening;

(2) in the presence of a plating solution, conducting an electric current through the at least one opening in the adhered mask between an anode and the previously deposited material, wherein the previously deposited material functions as a cathode, such that the first material is deposited onto the previously deposited material to form at least the portion of a layer; and

(3) removing the mask from the previously deposited material.

4. The process of claim 1 wherein the attaching comprises placing a dielectric adhesive onto at least one of (i) the structural substrate or (ii) the at least a portion of the layer to which attachment is to occur and then bringing the structural substrate and the at least a portion of the layer into contact.

5. The process of claim 1 wherein the structural substrate further comprises a preformed sheet.

6. The process of claim 1 wherein the structural substrate further comprises a flowable material that is contacted to the at least a portion of the layer and is thereafter allowed to solidify or is made to solidify.

7. The process of claim 6 wherein the flowable material comprises a pre-polymer.

8. The process of claim 7 wherein the pre-polymer comprises a two-part epoxy.

9. The process of claim 1 wherein the structural substrate further comprises a flexible material.

10. The process of claim 1 wherein the attaching causes the structural substrate to at least partially surround at least a portion of a layer of the deposited structural material.

11. The process of claim 1 wherein the attaching of the structural substrate occurs prior to the separation of the temporary substrate.

12. The process of claim 11 wherein the first material comprises the structural material and the second material comprises the sacrificial material.

13. The process of claim 1 wherein the attaching of the structural substrate to the embedded structure comprises a mechanical interlocking of portions of the structural substrate with portions of the embedded structure.

14. The process of claim 1 wherein the attaching of the structural substrate occur after the separation of the temporary substrate.

15. The process of claim 1 wherein the second material comprises the structural material and the first material comprises the sacrificial material.

16. The process of claim 1 wherein a portion of the sacrificial material is removed prior to attaching the structural substrate.

17. The process of claim 16 wherein at least a portion a region from which the sacrificial material is removed prior to attaching the structural substrate is filled with a dielectric material.

18. The process of claim 1 wherein the attaching of the structural substrate occurs after separating a portion of the temporary substrate from the embedded structure.

19. The process of claim 1 wherein upon release of the embedded structure from the sacrificial material the structural material is also released from the temporary substrate.

20. The electrochemical fabrication process of claim 1 wherein the removing of at least a portion of the sacrificial material removes sacrificial material from a plurality of the layers.

21. An electrochemical fabrication process for producing a three-dimensional structure from a plurality of adhered layers, the process comprising:

(A) selectively depositing a first material onto a first temporary substrate or onto previously deposited material on the first temporary substrate to form a portion of a layer and depositing at least a second material to form another portion of the layer, wherein one of the first material or the second material comprises a structural material and the other comprises a sacrificial material, and wherein the depositing of the first material or the second material comprises an electrodeposition operation;

(B) repeating (A) a plurality of times to form the plurality of adhered layers such that successive layers are formed adjacent to and adhered to previously formed layers to produce an embedded structure;

(C) after formation of the plurality of adhered layers attaching a second temporary substrate, which comprises a dielectric material, to at least a portion of a layer of the embedded structure and separating the first temporary substrate from the embedded structure and then attaching a structural substrate to at least a portion of a layer of the embedded structure that at least partially overlaps a location that was occupied by the first temporary substrate; and

(D) after attaching the second temporary substrate, removing at least a portion of the sacrificial material from multiple layers and from the embedded structure to release the three-dimensional structure.

22. The electrochemical fabrication process of claim 21 wherein the removing of at least a portion of the sacrificial material removes sacrificial material from a plurality of the layers.

23. An electrochemical fabrication process for producing a three-dimensional structure, the process comprising:

(A) selectively depositing a first material onto a temporary substrate or onto previously deposited material on the temporary substrate to form a portion of a layer and depositing at least a second material to form another portion of the layer, wherein one of the first material or the second material comprises a structural material and the other comprises a sacrificial material, and wherein the depositing of the first material or the second material comprises an electrodeposition operation;

(B) forming a plurality of adhered layers such that each successive layer is formed adjacent to and adhered to a previously formed layer, wherein said forming comprises repeating (A) a plurality of times to produce an embedded structure;

(C) after formation of the plurality of layers attaching a structural substrate, comprising a plurality of materials and/or a patterned structure, to at least a portion of a layer of the embedded structure and separating the temporary substrate from the embedded structure; and

(D) after attaching the structural substrate, removing at least a portion of the sacrificial material from multiple layers and from the embedded structure to release the three-dimensional structure.

24. The process of claim 23 wherein for a plurality of layers the forming of adhered layers in (B) further comprises:

(1) providing an adhered patterned mask on a surface of the previously deposited material, wherein the mask includes at least one opening;

(2) in the presence of a plating solution, conducting an electric current through the at least one opening in the adhered mask between an anode and the previously deposited material, wherein the previously deposited material functions as a cathode, such that the first material is deposited onto the previously deposited material to form at least the portion of a layer; and

(3) removing the mask from the previously deposited material.

25. The electrochemical fabrication process of claim 23 wherein the removing of at least a portion of the sacrificial material removes sacrificial material from a plurality of the layers.

26. An electrochemical fabrication process for producing a three-dimensional structure from a plurality of adhered layers, the process comprising:

(A) selectively depositing a first material onto a first temporary substrate or onto previously deposited material on the first temporary substrate to form a portion of a layer and depositing at least a second material to form another portion of the layer, wherein one of the first material or the second material comprises a structural material and the other comprises a sacrificial material, and wherein the depositing of the first material or the second material comprises an electrodeposition operation;

(B) repeating (A) a plurality of times to form a plurality of layers such that successive layers are formed adjacent to and adhered to previously deposited layers to form an embedded structure;

(C) after formation of the plurality of adhered layers attaching a second temporary substrate, which comprises a plurality of materials and/or comprises a patterned structure, to at least a portion of a layer of the embedded structure and separating the first temporary substrate from the embedded structure and then attaching a structural substrate to at least a portion of a layer of the embedded structure that at least partially overlaps a location that was occupied by the first temporary substrate; and

(D) after attaching the second substrate, removing at least a portion of the sacrificial material from multiple layers and from the embedded structure to release the three-dimensional structure.

27. The electrochemical fabrication process of claim 26 wherein the removing of at least a portion of the sacrificial material removes sacrificial material from a plurality of the layers.

28. An electrochemical fabrication process for producing a multi-part three-dimensional structure, the process comprising:

(A) forming at least one part of the multi-part structure, comprising;

(1) selectively depositing a first material onto a substrate or onto previously deposited material on the substrate to form a portion of a layer and depositing at least a second material to form another portion of the layer, wherein one of the first material or the second material comprises a structural material and the other comprises a sacrificial material, and wherein the depositing of the first material or the second material comprises an electrodeposition operation;

(2) forming a plurality of adhered layers such that successive layers are formed adjacent to and adhered to previously formed layers, wherein said forming comprises repeating (1) a plurality of times;

(B) supplying at least one additional part of the multi-part structure;

(C) attaching the at least one part to the at least one additional part to form an embedded structure; and

(D) after attaching the at least one part and the at least one additional part, removing at least a portion of the sacrificial material from multiple layers and from the embedded structure to release a multi-part three-dimensional structure.

29. The electrochemical fabrication process of claim 28 additionally comprising separating the embedded structure from the substrate.

30. The electrochemical fabrication process of claim 28 wherein the removing of at least a portion of the sacrificial material removes sacrificial material from a plurality of the layers.