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Method of making an X-Y axis dual-mass tuning fork gyroscope with vertically integrated electronics and wafer-scale hermetic packaging

  • US 7,250,112 B2
  • Filed: 07/28/2005
  • Issued: 07/31/2007
  • Est. Priority Date: 10/20/2003
  • Status: Active Grant
First Claim
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1. A method for manufacturing a sensor for measuring angular velocity in a sensing plane, the method comprising:

  • etching a sensing subassembly from a gyroscope wafer, wherein the sensing subassembly includes;

    a substantially planar frame parallel to the sensing plane; and

    a linkage connected to the frame and comprising a first mass and a second mass laterally disposed in the sensing plane, the linkage mechanically constraining the first mass and the second mass to move in opposite directions perpendicular to the sensing plane,wherein angular velocity in the sensing plane is measurable based on the movement of the first mass and the second mass in opposite directions.

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